公开(公告)号：US06985332B1

公开(公告)日：2006-01-10

申请号：US09455851

申请日：1999-12-07

Applicant: David Allen Sluzewski ,  David Gordon Qualey ,  Kevin Jon Schulz ,  Gordon Merle Jones

Inventor： David Allen Sluzewski ,  David Gordon Qualey ,  Kevin Jon Schulz ,  Gordon Merle Jones

IPC: G11B5/60 ,  G11B21/21

CPC classification number: G11B5/4826 ,  G11B5/3103 ,  G11B5/4853 ,  H05K3/361

Abstract: A slider scale package assembly in a head gimbal assembly (HGA) for electrically coupling a slider/magnetic recording (MR) head to a head interconnect circuit in a disc drive includes a flex circuit attached to the back of the slider/MR head which turns the slider/MR head into the slider scale package with at least one repositioned interconnect pad disposed at the back of the slider/MR head. The flex circuit further includes a conductive material, one end of which is electrically bonded to a bond pad of the slider/MR head, and the other end is electrically bonded to a conductive material of the head interconnect circuit via the interconnect pad. A plurality of flex circuits can be made in a sheet format and dividable into a plurality of individual flex circuits to be attached to a plurality of slider/MR heads. The bonding of the conductive material of the flex circuit to the slider/MR head and the bonding of the interconnect pad of the flex circuit to the conductive material of the head interconnect circuit can be done in a separate automated process.

Abstract translation: 用于将滑块/磁记录（MR）磁头电耦合到磁盘驱动器中的磁头互连电路的磁头万向架组件（HGA）中的滑块刻度封装组件包括附接到滑块/ MR磁头背面的柔性电路 滑块/ MR头进入滑块尺度封装，其中至少一个重新定位的互连焊盘设置在滑块/ MR头的后部。 柔性电路还包括导电材料，其一端电连接到滑块/ MR磁头的接合焊盘，另一端通过互连焊盘电连接到磁头互连电路的导电材料。 多个柔性电路可以以薄片形式制成并且可分割成多个单独的柔性电路以附接到多个滑块/ MR磁头。 柔性电路的导电材料与滑块/ MR磁头的接合以及柔性电路的互连焊盘与磁头互连电路的导电材料的接合可以在单独的自动化过程中完成。

公开(公告)号：US06233124B1

公开(公告)日：2001-05-15

申请号：US09311086

申请日：1999-05-13

Applicant: Richard August Budde ,  David Gordon Qualey ,  David Allen Sluzewski ,  James Morgan Murphy

Inventor： Richard August Budde ,  David Gordon Qualey ,  David Allen Sluzewski ,  James Morgan Murphy

IPC: G11B556

CPC classification number: G11B5/5552 ,  G11B21/10

Abstract: A microactuation system is disclosed for selectively altering a position of a transducing head carried by a slider in a disc drive system with respect to a track of a rotatable disk having a plurality of concentric tracks. The disc drive system includes a load beam having a base for attachment to an actuator arm and a head suspension for supporting the slider over the rotatable disc. A microactuation system includes a piezoelectric element attached between the base and the head suspension of the load beam and beams or hinges connecting the head suspension to the base. The piezoelectric element is deformable in response to a voltage applied thereto. The beams are sufficiently compliant to permit movement of the head suspension with respect to the base upon deformation of the piezoelectric elements.

Abstract translation: 公开了一种微致动器系统，用于相对于具有多个同心轨道的可旋转盘的轨道选择性地改变由盘驱动系统中的滑块承载的换能头的位置。 盘驱动系统包括负载梁，其具有用于附接到致动器臂的基座和用于将滑块支撑在可旋转盘上的头悬架。 微动作系统包括一个压电元件，该压电元件安装在底座和负载梁的头部悬挂之间，以及将头悬挂件连接到基座的梁或铰链。 压电元件可响应于施加到其上的电压而变形。 梁足够柔顺以允许头部悬架在压电元件变形时相对于基座移动。

公开(公告)号：US6078473A

公开(公告)日：2000-06-20

申请号：US78588

申请日：1998-05-13

Applicant: Peter Crane ,  Adam Karl Himes ,  David Allen Sluzewski ,  Kevin John Schulz ,  David Gordon Qualey

Inventor： Peter Crane ,  Adam Karl Himes ,  David Allen Sluzewski ,  Kevin John Schulz ,  David Gordon Qualey

IPC: G11B5/55

CPC classification number: G11B5/5552

Abstract: A disc drive has a recording disc rotatable about an axis and a slider supporting a transducing head for transducing data with the disc. A dual-stage actuation assembly supports the slider to position the transducing head adjacent a selected radial track of the disc, and includes a movable actuator arm and a load beam connected to the actuator arm. A flexure is connected to the load beam for supporting the slider, and includes first conductive traces terminating at first bond pads and at least one second conductive trace electrically connected to the transducing head. A microactuator includes a rotor operatively connected to the slider for radially moving the transducing head and a stator connected to the flexure at the first bond pads.

Abstract translation: 磁盘驱动器具有可围绕轴线旋转的记录盘和支撑换能头的滑块，用于与盘一起转换数据。 双级致动组件支撑滑块以将换能头邻近盘的选定的径向轨道定位，并且包括可移动致动器臂和连接到致动器臂的负载梁。 挠曲件连接到用于支撑滑块的负载梁，并且包括终止于第一接合焊盘处的第一导电迹线和电连接到换能头的至少一个第二导电迹线。 微型致动器包括可操作地连接到滑块的转子，用于径向移动换能头和在第一接合垫处连接到挠曲件的定子。

公开(公告)号：US5806753A

公开(公告)日：1998-09-15

申请号：US577586

申请日：1995-12-22

Applicant: James Daniel Bielick ,  Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs ,  Thomas Donald Kidd ,  David Allen Sluzewski

Inventor： James Daniel Bielick ,  Mark Kenneth Hoffmeyer ,  Phillip Duane Isaacs ,  Thomas Donald Kidd ,  David Allen Sluzewski

IPC: H01L21/60 ,  H05K3/12 ,  H05K3/34

CPC classification number: H01L24/83 ,  H01L24/31 ,  H05K3/3484 ,  H01L2224/11332 ,  H01L2224/13611 ,  H01L2224/29111 ,  H01L2224/8319 ,  H01L2224/838 ,  H01L2924/00013 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01042 ,  H01L2924/0105 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/0132 ,  H01L2924/014 ,  H01L2924/0781 ,  H01L2924/09701 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/157 ,  H05K2201/035 ,  H05K2201/10734 ,  H05K2201/10984 ,  H05K2201/10992 ,  H05K2203/0338 ,  H05K2203/043 ,  H05K2203/0557 ,  H05K3/1216

Abstract: A method of forming a bond structure for use with integrated circuits and semiconductor electronics and carrier assemblies is disclosed. Metallurgical paste is screen printed through a stencil and the stencil is left in place during the reflow process. The melting point of the bond structure and the metallurgical paste is lower than the melting point of interconnects on the electronic components and less than the decomposition temperature of the carrier assemblies to which the electronic components are bonded.

公开(公告)号：US5789930A

公开(公告)日：1998-08-04

申请号：US572591

申请日：1995-12-14

Applicant: Phillip Duane Isaacs ,  David Allen Sluzewski ,  Mark Kenneth Hoffmeyer

Inventor： Phillip Duane Isaacs ,  David Allen Sluzewski ,  Mark Kenneth Hoffmeyer

IPC: G01R31/28 ,  H05K3/34 ,  G01R31/02

CPC classification number: H05K3/3436 ,  G01R31/2886 ,  H05K2201/035 ,  H05K2203/162 ,  H05K3/3484 ,  Y02P70/613

Abstract: The present invention may be characterized as an improved integrated circuit die testing system which includes a number of components which cooperate together. An integrated circuit carrier is provided for holding the integrated circuit die. Attached to the integrated circuit carrier is a chip site. Proximate to this chip site exists a plurality of contact pads. These contact pads are electrically coupled to a plurality of test points. Also provided is an integrated circuit die. Finally, a pattern of electrically conductive paste is provided. This electrically conductive paste electrically couples the integrated circuit die and the contact pads thereby allowing the integrated circuit die to be tested from the test points.

Abstract translation: 本发明可以被表征为一种改进的集成电路芯片测试系统，其包括多个组合在一起的组件。 提供了用于保持集成电路管芯的集成电路载体。 连接到集成电路的载体是一个芯片现场。 靠近该芯片位置存在多个接触垫。 这些接触垫电耦合到多个测试点。 还提供集成电路管芯。 最后，提供导电浆料的图案。 该导电浆料电耦合集成电路管芯和接触焊盘，从而允许从测试点测试集成电路管芯。