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公开(公告)号：US07042734B2
公开(公告)日：2006-05-09
申请号：US10350731
申请日：2003-01-23
IPC分类号： H05K7/02
CPC分类号： G06F1/184
摘要： A CompactPCI blade assembly includes a main printed circuit assembly (PCA), a mezzanine PCA, an electrical connector, and at least one support structure. The main PCA is couplable to a connector plane of a CompactPCI-based computer system. The electrical connector is coupled between the mezzanine PCA and the main PCA. The at least one support structure is mechanically coupled between the main PCA and the mezzanine PCA and establishes a board-to-board distance between the mezzanine PCA and the main PCA of at least one slot unit width.
摘要翻译： CompactPCI刀片组件包括主印刷电路组件（PCA），夹层PCA，电连接器和至少一个支撑结构。 主PCA可连接到基于CompactPCI的计算机系统的连接器平面。 电连接器连接在夹层PCA和主PCA之间。 所述至少一个支撑结构在主PCA和夹层PCA之间机械耦合，并且在夹层PCA和主PCA之间建立至少一个槽单元宽度的板对板距离。
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公开(公告)号：US07002799B2
公开(公告)日：2006-02-21
申请号：US10828448
申请日：2004-04-19
IPC分类号： H05K7/20
CPC分类号： H05K7/20772 , H05K7/20727
摘要： A cooling apparatus for usage in an electronic system, a liquid loop heat exchanger body is configured for attachment to an exterior surface of an electronic system chassis.
摘要翻译： 一种用于电子系统的冷却装置，液体回路热交换器主体被构造成附接到电子系统底盘的外表面。
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公开(公告)号：US06853554B2
公开(公告)日：2005-02-08
申请号：US10022112
申请日：2001-12-14
IPC分类号： H05K7/20
CPC分类号： H05K7/20772
摘要： A modular semiconductor chip cooling system having a readily openable enclosure defining a chamber configured to hold a printed circuit board carrying components to be cooled. The enclosure can include a reservoir, a condenser and a pump. Sprayers within the chamber are adjustably mounted on one or more brackets to allow each sprayer to be set for the individual height of its respective component. The enclosure can be readily removed from a computer system through a quick release connection. The computer system can include a condenser and pump to operate all its modular cooling systems, removing the condensing function from the individual modules.
摘要翻译： 一种模块化半导体芯片冷却系统，其具有容易打开的外壳，其限定了配置成容纳承载待冷却部件的印刷电路板的室。 外壳可以包括储存器，冷凝器和泵。 室内的喷雾器可调节地安装在一个或多个支架上，以允许每个喷雾器为其各自部件的单独高度设定。 外壳可以通过快速释放连接容易地从计算机系统中移除。 计算机系统可以包括冷凝器和泵来操作其所有的模块化冷却系统，从各个模块中去除冷凝功能。
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公开(公告)号：US09223325B2
公开(公告)日：2015-12-29
申请号：US13282678
申请日：2011-10-27
CPC分类号： G05D23/1932 , G06F1/206
摘要： Example embodiments disclosed herein relate to the estimation of temperature based on a fan control signal. Example embodiments include the estimation of temperature based on a fan control signal having a value based on a temperature reading of a temperature sensor.
摘要翻译： 本文公开的示例性实施例涉及基于风扇控制信号的温度估计。 示例性实施例包括基于具有基于温度传感器的温度读数的值的风扇控制信号来估计温度。
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公开(公告)号：US07068509B2
公开(公告)日：2006-06-27
申请号：US10772115
申请日：2004-02-03
IPC分类号： H05K7/20
CPC分类号： H05K7/20809 , G06F1/20 , G06F2200/201 , H05K7/20727 , H05K7/20772
摘要： An enclosure forms a plurality of tiers vertically stacked in a longitudinal dimension. Each tier is a 1U modular computer system having a computer chassis configured for mounting in the multi-tiered support, and computer components that need cooling within the computer chassis. An evaporator is in thermal communication with at least one of the computer components, and vaporizes a coolant to cool that component. A condenser dissipates heat from the coolant vapor, and provides liquid coolant back to the evaporator. The condenser directs liquid coolant gravitationally downward, making the condenser and evaporator gravity driven. An air mover within the chassis cools the condenser, blows air across other components needing cooling, and removes heated air from the chassis.
摘要翻译： 外壳形成在纵向尺寸上垂直堆叠的多个层。 每个层是1U模块化计算机系统，其具有配置成安装在多层支持中的计算机机箱以及需要在计算机机箱内进行冷却的计算机组件。 蒸发器与至少一个计算机部件热连通，并蒸发冷却剂以冷却该部件。 冷凝器从冷却剂蒸汽散发热量，并将液体冷却剂提供回蒸发器。 冷凝器将液体冷却液重力向下引导，使冷凝器和蒸发器重力驱动。 底盘内的空气推进器冷却冷凝器，将空气吹向需要冷却的其他部件，并从机箱中除去加热的空气。
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16.发明授权Keyed filler panel with removably-coupleable airflow resistive filler card assembly 失效带可拆卸式气流阻力填充卡组合件的带键填充面板公开(公告)号：US06891734B2
公开(公告)日：2005-05-10
申请号：US10094248
申请日：2002-03-07
CPC分类号： H05K7/20563 , H05K7/1461
摘要： A keyed filler panel with removably-coupleable airflow resistive filler card assembly is disclosed. In one embodiment, the present invention is comprised of a filler panel body. The present embodiment is further comprised of an airflow resistive filler portion removably-coupleable with said filler panel body. The airflow resistive filler portion adapted to couple with the filler panel body without additional hardware.
摘要翻译： 公开了一种具有可移除可耦合气流阻力填充卡组合件的带键填充板。 在一个实施例中，本发明由填充板主体组成。 本实施例还包括可拆卸地与所述填充板本体连接的气流阻力填充部分。 气流阻力填料部分适于与填充板主体联接，而无需额外的硬件。
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公开(公告)号：US06882536B2
公开(公告)日：2005-04-19
申请号：US10131476
申请日：2002-04-25
IPC分类号： H05K7/20 , H01L23/36 , H01L23/433 , H05K1/02
CPC分类号： H01L23/433 , H01L23/36 , H01L2924/0002 , H05K1/0203 , H05K2201/066 , H05K2201/10386 , H05K2201/10446 , H05K2201/10545 , H05K2201/10689 , H01L2924/00
摘要： A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.
摘要翻译： 公开了一种用于印刷电路板的环绕冷却装置。 这种布置包括：具有第一侧和与所述第一侧相对的第二侧的印刷电路板（“PCB”）; 布置在所述PCB的所述第一侧上的散热器; 耦合到所述PCB的所述第二侧的第一被冷却部件; 以及用于将所述第二侧上的所述第一部件热耦合到所述第一侧上的所述散热器的热跳线，所述跳线构造成物理地围绕所述PCB的侧边缘延伸。
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公开(公告)号：US06879487B2
公开(公告)日：2005-04-12
申请号：US10677151
申请日：2003-09-30
IPC分类号： H01L23/40 , H01L23/467 , H05K7/20
CPC分类号： H05K7/20172 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.
摘要翻译： 风扇固定装置将风扇固定到传热装置，其允许快速移除风扇而不干扰传热装置的其余部分。 风扇固定装置包括基座，用于将主体基座固定到传热装置的紧固件，以及用于将风扇固定到基座的压缩翼片。
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公开(公告)号：US06650541B1
公开(公告)日：2003-11-18
申请号：US10180426
申请日：2002-06-25
IPC分类号： H05K720
CPC分类号： H05K7/20172 , H01L23/4006 , H01L23/467 , H01L2924/0002 , H01L2924/00
摘要： A fan-securing device secures a fan to a heat transfer device that allows for the rapid removal of the fan without disturbing the remainder of the heat transfer device. The fan-securing device includes a base, a fastener for securing the body base to the heat transfer device, and compression tabs for securing the fan to the base.
摘要翻译： 风扇固定装置将风扇固定到传热装置，其允许快速移除风扇而不干扰传热装置的其余部分。 风扇固定装置包括基座，用于将主体基座固定到传热装置的紧固件，以及用于将风扇固定到基座的压缩翼片。
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20.发明授权Computer system bulkhead plate for attenuating electromagnetic interference (EMI) at a telephone jack connector 失效用于衰减电话插孔连接器电磁干扰（EMI）的计算机系统隔板公开(公告)号：US06508653B2
公开(公告)日：2003-01-21
申请号：US09675369
申请日：2000-09-29
IPC分类号： H01R466
CPC分类号： G06F1/182 , H01R13/6584 , H01R2201/06 , Y10S439/939
摘要： A bulkhead plate member for providing an attenuating barrier for electromagnetic interference (EMI) noise in a computer system housing. The bulkhead plate member includes a rectangular shaped main portion having a material thickness. The main portion has a plurality of edge walls defining an opening for receiving a peripheral component connector affixed to a printed circuit board (PCB). The edge walls are adapted to contact side walls of the peripheral component connector to provide contact regions substantially perpendicular to the main portion and greater than the material thickness of the main portion, such that EMI noise is conducted through the bulkhead plate member, at the edge walls of the opening, to a bulkhead wall of the computer system housing thereby suppressing the EMI noise. The edge walls of the opening provides increased surface area contact between the bulkhead plate member and the peripheral component connector to maximize the attenuation of EMI noise around the connector.
摘要翻译： 一种隔板板构件，用于在计算机系统壳体中提供用于电磁干扰（EMI）噪声的衰减屏障。 隔板板构件包括具有材料厚度的矩形主体部分。 主要部分具有限定用于接收固定到印刷电路板（PCB）的外围部件连接器的开口的多个边缘壁。 边缘壁适于接触外围部件连接器的侧壁，以提供基本上垂直于主要部分并且大于主要部分的材料厚度的接触区域，使得EMI噪声通过隔板板件在边缘处被传导 开口的壁，到计算机系统壳体的隔壁，从而抑制EMI噪声。 开口的边缘壁提供了隔板板构件和外围构件连接器之间的增加的表面积接触，以最大化连接器周围的EMI噪声的衰减。
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