公开(公告)号：US06882536B2

公开(公告)日：2005-04-19

申请号：US10131476

申请日：2002-04-25

申请人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Glenn C. Simon

发明人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Glenn C. Simon

IPC分类号： H05K7/20 ,  H01L23/36 ,  H01L23/433 ,  H05K1/02

CPC分类号： H01L23/433 ,  H01L23/36 ,  H01L2924/0002 ,  H05K1/0203 ,  H05K2201/066 ,  H05K2201/10386 ,  H05K2201/10446 ,  H05K2201/10545 ,  H05K2201/10689 ,  H01L2924/00

摘要： A wrap-around cooling arrangement for a printed circuit board is disclosed. Such an arrangement comprises: a printed circuit board (“PCB”) having a first side and a second side opposite to said first side; a heat sink arranged on said first side of said PCB; a first to-be-cooled component coupled to said second side of said PCB; and a thermal jumper to thermally couple said first component on said second side to said heat sink on said first side, said jumper being configured to extend physically around a side edge of said PCB.

摘要翻译： 公开了一种用于印刷电路板的环绕冷却装置。 这种布置包括：具有第一侧和与所述第一侧相对的第二侧的印刷电路板（“PCB”）; 布置在所述PCB的所述第一侧上的散热器; 耦合到所述PCB的所述第二侧的第一被冷却部件; 以及用于将所述第二侧上的所述第一部件热耦合到所述第一侧上的所述散热器的热跳线，所述跳线构造成物理地围绕所述PCB的侧边缘延伸。

公开(公告)号：US07434309B2

公开(公告)日：2008-10-14

申请号：US10652598

申请日：2003-08-29

申请人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

发明人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

IPC分类号： H05K3/36

CPC分类号： H05K3/301 ,  H05K3/3436 ,  Y10T29/49144

摘要： A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

摘要翻译： 一种具有电路板和列栅格阵列（“CGA”）集成电路封装的电路板组件。 CGA封装具有从底表面延伸的焊料列阵列的衬底。 框架围绕着CGA集成电路封装并被固定在其上。 当列格栅阵列集成电路封装安装在电路板上以支持列格栅阵列集成电路封装时，框架从基板延伸到电路板的一部分。 在将CGA集成电路封装安装在电路板上之后，框架通过粘合剂固定在CGA集成电路封装上，该粘合剂可容纳CGA集成电路封装的任何高度变化。

公开(公告)号：US07273386B2

公开(公告)日：2007-09-25

申请号：US10901338

申请日：2004-07-28

申请人： Richard E. Olson ,  Jill H. Quinn ,  Stacy A. Fraker ,  Jeffrey L. Deeney ,  Joseph D. Dutson

发明人： Richard E. Olson ,  Jill H. Quinn ,  Stacy A. Fraker ,  Jeffrey L. Deeney ,  Joseph D. Dutson

IPC分类号： H01R13/62

CPC分类号： H01R13/5213

摘要： A pin shroud for a circuit board having a raised pin platform and a pin array projecting from the raised pin platform. A spacer extending from a side wall of the shroud engages a side of the raised pin platform, thereby accurately aligning the pin shroud with the pin platform.

摘要翻译： 一种用于电路板的针罩，其具有凸起销平台和从升高的销平台突出的销阵列。 从护罩的侧壁延伸的间隔件接合凸起销平台的一侧，从而将销护罩与销平台精确地对准。

公开(公告)号：US06710264B2

公开(公告)日：2004-03-23

申请号：US09994004

申请日：2001-11-16

申请人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

发明人： Jeffrey L. Deeney ,  Joseph D. Dutson ,  Richard J. Luebs

IPC分类号： H05K116

CPC分类号： H05K3/301 ,  H05K3/3436 ,  Y10T29/49144

摘要： A circuit board assembly having a circuit board and a column grid array (“CGA”) integrated circuit package. The CGA package has a substrate having an array of solder columns extending from a bottom surface. A frame surrounds the CGA integrated circuit package and is affixed thereto. The frame extends from the substrate to a portion of the circuit board when the column grid array integrated circuit package is mounted on the circuit board to support the column grid array integrated circuit package. The frame is affixed to the CGA integrated circuit package by adhesive after the CGA integrated circuit package is mounted on the circuit board, the adhesive accommodating any variations in height of the CGA integrated circuit package.

摘要翻译： 一种具有电路板和列栅格阵列（“CGA”）集成电路封装的电路板组件。 CGA封装具有从底表面延伸的焊料列阵列的衬底。 框架围绕着CGA集成电路封装并被固定在其上。 当列格栅阵列集成电路封装安装在电路板上以支持列格栅阵列集成电路封装时，框架从基板延伸到电路板的一部分。 在将CGA集成电路封装安装在电路板上之后，框架通过粘合剂固定在CGA集成电路封装上，该粘合剂可容纳CGA集成电路封装的任何高度变化。

公开(公告)号：US06791184B2

公开(公告)日：2004-09-14

申请号：US10202416

申请日：2002-07-23

申请人： Jeffrey L Deeney ,  Laszlo Nobi ,  Joseph D. Dutson

发明人： Jeffrey L Deeney ,  Laszlo Nobi ,  Joseph D. Dutson

IPC分类号： H01L2334

CPC分类号： H01L23/49816 ,  H01L23/32 ,  H01L2924/0002 ,  H01L2924/1433 ,  H05K3/301 ,  H05K3/303 ,  H05K2201/10386 ,  H05K2201/10734 ,  H05K2201/2036 ,  Y02P70/613 ,  H01L2924/00

摘要： A support assembly for supporting an integrated circuit package with an array of solder columns extending from a bottom surface of the integrated circuit package to a circuit board preferably includes: a pair of shims for supporting the integrated circuit package, the shims being positioned along opposite edges of the integrated circuit package and placed between and abutting the integrated circuit package and the circuit board; and a retention clip for aligning and securing in place the pair of shims.