公开(公告)号：US20180319656A1

公开(公告)日：2018-11-08

申请号：US15909431

申请日：2018-03-01

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Joseph L. Nguyen

IPC: B81C3/00 ,  B81C1/00 ,  H05K3/34 ,  G01K13/02 ,  G01K15/00

Abstract: A method of attaching a MEMS die to a mounting surface includes coating an inside surface of a pressure port of a fluid inlet member with a layer of solder mask, the fluid inlet member having a first axial end, a second axial end, and a port opening of the pressure port formed in the second axial end of the fluid inlet member. A solder preform is disposed on the mounting surface of the fluid inlet member and a MEMS die is disposed on the solder preform. The solder preform is heated in a re-flow operation to attach the MEMS die to the mounting surface, wherein the solder mask within the pressure port prevents molten solder from entering the pressure port during the re-flow operation.

公开(公告)号：US20180319654A1

公开(公告)日：2018-11-08

申请号：US15896749

申请日：2018-02-14

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joseph L. Nguyen

IPC: B81B7/00 ,  B81C3/00 ,  B81C1/00

CPC classification number: B81B7/0029 ,  B81B7/0048 ,  B81B2201/0264 ,  B81C1/00325 ,  B81C1/00357 ,  B81C3/001 ,  B81C2203/035

Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.

公开(公告)号：US20170097181A1

公开(公告)日：2017-04-06

申请号：US15238834

申请日：2016-08-17

Applicant: DunAn Microstaq, Inc.

Inventor： Buu C. Chung ,  Wayne C. Long ,  Arvind Rao ,  Chen Yang ,  Joseph Nguyen ,  Joe A. Ojeda, SR. ,  Colin B. Bingle

IPC: F25B49/02 ,  F25B41/06 ,  G01L27/00

CPC classification number: F25B49/02 ,  F25B41/062 ,  F25B2600/21 ,  F25B2600/2513 ,  G01L27/002

Abstract: A method of calibrating a plurality of superheat controllers includes attaching a plurality of superheat controllers to a manifold assembly, enclosing the manifold assembly within an environmental chamber, and simultaneously calibrating a pressure sensor within each of the plurality of superheat controllers.

公开(公告)号：US10662057B2

公开(公告)日：2020-05-26

申请号：US16204136

申请日：2018-11-29

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Gengxun K. Gurley ,  Joseph L. Nguyen

IPC: B23K1/00 ,  B81C1/00 ,  B81C3/00 ,  B23K35/02 ,  B23K101/36

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

公开(公告)号：US10457547B2

公开(公告)日：2019-10-29

申请号：US15896749

申请日：2018-02-14

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joseph L. Nguyen

IPC: B81C1/00 ,  B81C3/00 ,  B81B7/00

Abstract: A multi-layer, stress-isolation platform configured for attaching a MEMS die to a base includes a first platform, a first layer of attachment material between the base and the first platform and attaching the first platform to the base, a MEMS die, and a second layer of attachment material between the first platform and the MEMS die and attaching the MEMS die to the first platform.

公开(公告)号：US20190092630A1

公开(公告)日：2019-03-28

申请号：US16204136

申请日：2018-11-29

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Gengxun K. Gurley ,  Joseph L. Nguyen

IPC: B81C1/00 ,  B23K1/00 ,  B23K35/02 ,  B81C3/00 ,  B23K101/36

CPC classification number: B81C1/00301 ,  B23K1/0016 ,  B23K35/0222 ,  B23K2101/36 ,  B81C3/005 ,  B81C2203/035 ,  B81C2203/055

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.

公开(公告)号：US20180127269A1

公开(公告)日：2018-05-10

申请号：US15686343

申请日：2017-08-25

Applicant: DunAn Microstaq, Inc.

Inventor： Wayne C. Long ,  Joe A. Ojeda ,  Gengxun K. Gurley ,  Joseph L. Nguyen

IPC: B81C1/00 ,  B23K35/02

CPC classification number: B81C1/00301 ,  B23K1/0016 ,  B23K35/0222 ,  B23K2101/36 ,  B81C3/005 ,  B81C2203/035 ,  B81C2203/055

Abstract: A method of attaching a MEMS die to a surface includes centering and rotationally aligning a solder perform on a solder surface of a body, centering and rotationally aligning a MEMS die on the solder preform, and heating the solder perform in a reflow process until the solder is molten and surface tension of the molten solder moves the MEMS die to a position where the surface tensions balance, and the MEMS die is centered on, and rotationally aligned with, the solder surface of the body.