公开(公告)号：US11612972B2

公开(公告)日：2023-03-28

申请号：US17459272

申请日：2021-08-27

Applicant: ENTEGRIS, INC.

Inventor： Yan Liu ,  Steven Donnell ,  Jakub Rybczynski ,  Chun Wang Chan ,  Caleb Minsky

IPC: H01T23/00 ,  B23Q3/15 ,  H01L21/683 ,  B23K1/19 ,  H01L21/687 ,  B23K1/00 ,  B23K103/00

Abstract: Described are electrostatic chucks that are useful to support a workpiece during a step of processing the workpiece, the electrostatic chuck including embossments that are made of multiple deposited layers, the layers including diamond-like carbon layers and layers that contain silicon-based materials such as silicon carbide layers.

公开(公告)号：US20160336210A1

公开(公告)日：2016-11-17

申请号：US15111591

申请日：2015-02-06

Applicant: ENTEGRIS, INC.

Inventor： Richard A. Cooke ,  Wolfram Neff ,  Carlo Waldfried ,  Jakub Rybczynski ,  Michael Hanagan ,  Wade Krull

IPC: H01L21/683 ,  H01L21/67

CPC classification number: H01L21/6833 ,  H01L21/67248 ,  H01L21/6831

Abstract: An electrostatic chuck includes a ceramic structural element, at least one electrode disposed on the ceramic structural element, and a surface dielectric layer disposed over the at least one electrode, the surface layer activated by a voltage in the electrode to form an electric charge to electrostatically clamp a substrate to the electrostatic chuck. The surface dielectric layer comprises: (i) an insulator layer of amorphous alumina, of a thickness of less than about 5 microns, disposed over the at least one electrode; and (ii) a stack of dielectric layers disposed over the insulator layer. The stack of dielectric layers includes: (a) at least one dielectric layer including aluminum oxynitride; and (b) at least one dielectric layer including at least one of silicon oxide and silicon oxynitride.

Abstract translation: 静电卡盘包括陶瓷结构元件，设置在陶瓷结构元件上的至少一个电极和设置在至少一个电极上的表面电介质层，该表面层由电极中的电压激活以形成静电电荷 将基板夹紧到静电卡盘。 所述表面介电层包括：（i）厚度小于约5微米的无定形氧化铝绝缘体层，设置在所述至少一个电极上; 和（ii）设置在绝缘体层之上的一叠电介质层。 电介质层的叠层包括：（a）至少一个介电层，包括氮氧化铝; 和（b）至少一个包括氧化硅和氮氧化硅中的至少一种的电介质层。

公开(公告)号：US08861170B2

公开(公告)日：2014-10-14

申请号：US13667516

申请日：2012-11-02

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

IPC: H02N13/00 ,  C23C16/458 ,  H01L21/683 ,  H01L21/687

CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。

公开(公告)号：US20130120897A1

公开(公告)日：2013-05-16

申请号：US13667516

申请日：2012-11-02

Applicant: Entegris, Inc.

Inventor： I-Kuan Lin ,  Richard A. Cooke ,  Jakub Rybczynski

IPC: H02N13/00

CPC classification number: H01L21/6831 ,  C23C16/4581 ,  H01L21/6875 ,  H01L21/68757 ,  H02N13/00

Abstract: In accordance with an embodiment of the invention, there is provided a soft protrusion structure for an electrostatic chuck, which offers a non-abrasive contact surface for wafers, workpieces or other substrates, while also having improved manufacturability and compatibility with grounded surface platen designs. The soft protrusion structure comprises a photo-patternable polymer.

Abstract translation: 根据本发明的实施例，提供了一种用于静电卡盘的软突起结构，其提供用于晶片，工件或其它基板的非研磨接触表面，同时具有改进的可制造性和与接地的平台台板设计的兼容性。 软突起结构包括可光致图案的聚合物。