-
11.发明申请公开(公告)号：US20230069724A1
公开(公告)日：2023-03-02
申请号：US17862930
申请日：2022-07-12
Inventor： Won Bae KWON , Jong Jin LEE , Eun Kyu KANG , Soo Yong JUNG , Hae Chung KANG , Sang Jin KWON , Dae Seon KIM
Abstract: An optical receiver sub-assembly is provided, which includes a substrate, an optical waveguide device mounted on the substrate to transfer ray incident from a ray source, and a photodetector mounted on the substrate and disposed under a vertical cross-sectional surface of the optical waveguide device, wherein the ray is sequentially reflected and refracted by an upper slope surface and a lower slope surface provided in the vertical cross-sectional surface and is vertically incident on an active area of the photodetector.
-
公开(公告)号：US20230067645A1
公开(公告)日：2023-03-02
申请号：US17851148
申请日：2022-06-28
Inventor： Hae Chung KANG , Eun Kyu KANG , Jong Jin LEE , Sang Jin KWON , Won Bae KWON , Dae Seon KIM , Dae Woong MOON , Soo Yong JUNG , Gye Sul CHO
Abstract: A highly integrated multi-channel optical module is provided. The optical module includes an optical source device mounted on a substrate by an optical source mount unit, a waveguide mounted on the substrate by a waveguide mount unit, a lens mount unit disposed between the optical source device and the waveguide and mounted on the substrate, and a lens unit fixed to the lens mount unit by an adhesive cured by ultraviolet (UV) parallel light, wherein a light path of the UV parallel light is formed in the lens mount unit by a reflector attached on a side surface of the lens mount unit, and the UV parallel light moves along the light path and cures the adhesive coated on an upper portion of the lens mount unit facing a lower end portion of the lens unit.
-
公开(公告)号：US20150155944A1
公开(公告)日：2015-06-04
申请号：US14554257
申请日：2014-11-26
Inventor： Jong Jin LEE
CPC classification number: H04B10/503 , H01L23/10 , H01L24/48 , H01L2224/48091 , H01L2224/48225 , H01L2224/4823 , H01L2224/48247 , H01L2924/00014 , H01L2924/12042 , H01S5/0215 , H01S5/02216 , H01S5/02276 , H01S5/02292 , H01S5/02415 , H01L2224/45099
Abstract: Provided is an optical transmitter module. The optical transmitter module includes a package including a lower substrate and a side substrate in which a through hole is formed, and a feed-through block coupled to the side substrate in which the through hole is formed. The feed-through block includes a feed-through substrate, at least one lead pin penetrating the feed-though substrate and coupled to the feed-though substrate, a base substrate formed to extend from the feed-through substrate in a direction in which the at least one lead pin is coupled, and a dielectric substrate formed between the at least one lead pin and the base substrate protruding from the feed-through substrate. Therefore, it is possible to improve the quality of a signal transmitted by the optical transmitter module.
Abstract translation: 提供了一种光发射机模块。 光发射机模块包括：包括下基板和其中形成有通孔的侧基板的封装以及与形成通孔的侧基板连接的馈通块。 馈通块包括馈通衬底，至少一个引导引脚穿过馈通衬底并且耦合到馈通衬底，基底衬底形成为沿着馈通衬底沿着方向延伸 至少一个引脚被耦合，并且形成在从所述馈通基板突出的所述至少一个引脚和所述基底基板之间的电介质基板。 因此，可以提高由光发送模块发送的信号的质量。
-
公开(公告)号：US20140138148A1
公开(公告)日：2014-05-22
申请号：US13842537
申请日：2013-03-15
Inventor： Jong Jin LEE
IPC: H02G3/22
CPC classification number: H02G3/22
Abstract: Provided is a feed through. The feed through comprises: an optical device; a housing surrounding the optical device and having a first hole; a solder coupled into the first hole and having a plurality of second holes, each smaller than the first hole; and lead frames leading from the inside of the housing to the outside through the second holes and having a more reduced line width at the inside of the second holes than the outside thereof.
Abstract translation: 提供了一个饲料。 馈电包括：光学装置; 围绕所述光学装置并具有第一孔的壳体; 焊料，其耦合到所述第一孔中并具有多个第二孔，每个第二孔小于所述第一孔; 以及通过第二孔从壳体的内部引导到外部的引线框架，并且在第二孔的内部具有比其外侧更多的线宽。
-
公开(公告)号：US20240129035A1
公开(公告)日：2024-04-18
申请号：US18379008
申请日：2023-10-11
Inventor： Soo Yong JUNG , Jong Jin LEE
IPC: H04B10/40
CPC classification number: H04B10/40 , G02B6/3807
Abstract: Provided is a detachable light source supply apparatus in which a light source element, which has a high probability of failure among components of an optical transceiver, is separately disposed on the outside, to supply a light source to the optical transceiver. This detachable light source supply apparatus includes a detachable coupling part to the optical transceiver, and an optical input/output unit. The detachable coupling part and the optical input/output unit may be implemented with MPO type connectors. Depending on various wavelength standards, an external light source element may be a multi-channel light source element that emits light sources having different wavelengths. For the multi-channel light source element, a plurality of light emitter of a single wavelength may be used, and in other embodiments, a multi-channel light emitter that emits light sources having a plurality of different wavelengths may be used.
-
Patent Agency Ranking
16.发明公开公开(公告)号：US20240094463A1
公开(公告)日：2024-03-21
申请号：US18465791
申请日：2023-09-12
Inventor： Dae Seon KIM , Jong Jin LEE
CPC classification number: G02B6/12019 , G02B6/122 , G02B7/004 , H01S3/0315
Abstract: The present disclosure is to provide a shape of a surface mount type optical module to be mounted on a surface of a system board or package submount, and is to provide a compact and lightweight optical module attachment/detachment apparatus that performs the mounting (attachment) and separation of the optical module in a confined space by automatically performing optical module loading/unloading, optical module alignment, and laser soldering to facilitate attachment and detachment of the optical module. The attachment/detachment apparatus includes a body frame; a fixing part for fixing the body frame to the board; a gripper for gripping the optical module; an aligning part for aligning the position of the optical module with respect to the board; and a laser part which irradiates a laser for non-contact bonding between the optical module and the board.
-
公开(公告)号：US20250093599A1
公开(公告)日：2025-03-20
申请号：US18883663
申请日：2024-09-12
Inventor： Won-Bae KWON , Eun Kyu KANG , Jong Jin LEE , Soo Yong JUNG , Haechung KANG , Sangjin KWON , Myunghwan KIM
IPC: G02B6/42
Abstract: An optical module assembly is provided. The optical module assembly includes an electric sub-assembly including a printed circuit board (PCB) and an electronic device mounted on the PCB and an optical module including an interposer including a transparent material, an optical sub-assembly accommodating optical components, and a cover covering an upper portion of the optical sub-assembly, wherein one end portion of the PCB is inserted into the optical sub-assembly through an inserting hole formed in a sidewall of the optical sub-assembly, and the optical components and a substrate electrode formed on a surface of the one end portion of the PCB are electrically connected to each other by the interposer.
-
公开(公告)号：US20230061382A1
公开(公告)日：2023-03-02
申请号：US17879008
申请日：2022-08-02
Inventor： Eun Kyu KANG , Jong Jin LEE , Dae Seon KIM , Sang Jin KWON , Won Bae KWON , Soo Yong JUNG , Hae Chung KANG , Dae Woong MOON , Gye Sul CHO
IPC: G02B6/42
Abstract: A multi-channel optical sub-assembly includes a printed circuit board with a signal processor mounted thereon, a package window mounted on the printed circuit board, the package window including a transparent material, a package mounted on the package window, and an optical device accommodated into an inner space of the package and configured to convert an electrical signal, input from the signal processor, into an optical signal, wherein the electrical signal sequentially passes through a window through electrode buried in the package window and a package through electrode buried in the package and is input to the optical device.
-
公开(公告)号：US20210153354A1
公开(公告)日：2021-05-20
申请号：US17068600
申请日：2020-10-12
Inventor： Dae Seon KIM , Jong Jin LEE
IPC: H05K1/18 , H01L23/498
Abstract: Provided is an interposer using an inclined electrode and a manufacturing method thereof. The interposer may include a first plate having at least one inclined surface formed between a first layer in which an upper portion is located and a second layer in which a lower portion is located, a second plate having an upper portion formed along the first layer and a lower portion formed to extend along the upper portion of the first plate, at least one inclined surface, and the second layer, and at least one electrode formed along the upper portion of the first plate, at least one inclined surface, and the lower portion of the second plate. In the at least one electrode, a portion formed along the upper portion of the first plate and a portion formed along the lower portion of the second plate may be exposed.
-
公开(公告)号：US20200158958A1
公开(公告)日：2020-05-21
申请号：US16687353
申请日：2019-11-18
Inventor： Dae Seon KIM , Jong Jin LEE , Eun Kyu KANG , Sang Jin KWON , Jeong Eun KIM , Kwon Seob LIM , Eun Kyoung JEON , Soo Yong JUNG
Abstract: An ultra-small multi-channel optical module according to one embodiment of the present invention includes a base board, a glass substrate, a heat sink, optical elements, parallel light lenses, a first rectangular reflector, a glass cover, a second rectangular reflector, horizontal reflectors, and a light collecting lens.
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.02 seconds)
