METHOD FOR FILLING AT LEAST ONE CAVITY OF A MULTI-LAYER COMPONENT WITH A FILLING MATERIAL, AND MULTI-LAYER COMPONENT
    12.
    发明申请
    METHOD FOR FILLING AT LEAST ONE CAVITY OF A MULTI-LAYER COMPONENT WITH A FILLING MATERIAL, AND MULTI-LAYER COMPONENT 有权
    用于填充多层组分与填充材料的至少一个孔的方法,以及多层组件

    公开(公告)号:US20150235770A1

    公开(公告)日:2015-08-20

    申请号:US14420653

    申请日:2013-07-31

    Applicant: EPCOS AG

    CPC classification number: H01G4/30 H01L41/083 H01L41/273

    Abstract: The invention relates to a method for filling at least one cavity (5a, 5b) of a multi-layer component (1) with filling material (9). In a first step, the method comprises providing a main body (2) of the multi-layer component (1), the main body (2) having at least one cavity (5a, 5b). In a subsequent step, the method comprises placing the main body (2) in a chamber (11) and then generating a first pressure, the first pressure being a negative pressure. Then, a filling material (9) is arranged on the main body (2). Furthermore, the invention relates to a multi-layer component (1). The multi-layer component (1) has a main body (2) with at least one cavity (5a, 5b), wherein the cavity (5a, 5b) is filled with a filling material (9) which has a viscosity of between 200 mPas and 2000 mPas.

    Abstract translation: 本发明涉及用填充材料(9)填充多层部件(1)的至少一个空腔(5a,5b)的方法。 在第一步骤中,该方法包括提供多层部件(1)的主体(2),主体(2)具有至少一个空腔(5a,5b)。 在随后的步骤中,该方法包括将主体(2)放置在室(11)中,然后产生第一压力,第一压力为负压。 然后,在主体(2)上配置有填充材料(9)。 此外,本发明涉及多层组件(1)。 所述多层部件(1)具有至少一个空腔(5a,5b)的主体(2),其中所述空腔(5a,5b)填充有填充材料(9),所述填充材料的粘度为200 mPas和2000 mPas。

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