Abstract:
The present invention relates to an electronic device, comprising a fingerprint sensor configured to capture an image of a fingerprint of a finger positioned on a sensor surface of the fingerprint sensor, the fingerprint sensor comprising a sensing array comprising a plurality of sensing elements, and connection pads for electrical connection to external fingerprint sensor control circuitry; and a protective plate for protecting the fingerprint sensor, the protective plate comprising conductive traces for connecting the fingerprint sensor to the external fingerprint sensor control circuitry, wherein the fingerprint sensor is attached to an underside of the protective plate and wherein the connection pads of the fingerprint sensor are mechanically and electrically connected to the conductive traces of the protective plate.
Abstract:
A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.
Abstract:
A fingerprint sensing device comprising sensing circuitry comprising a plurality of sensing elements, each sensing element comprising a sensing structure arranged in a sensing plane and facing a surface of the capacitive fingerprint sensing device, each of the sensing elements being configured to provide a signal indicative of an electromagnetic coupling between the sensing structure and a finger placed on the surface of the fingerprint sensing device; and a plurality of connection pads electrically connected to the sensing circuitry for providing an electrical connection between the sensing circuitry and readout circuitry, wherein each of the connection pads is separately recessed in relation to the sensing plane such that each connection pad has a floor in a floor plane, and wherein each connection pad is separated from an adjacent connection pad through a portion of the sensing device being elevated in relation to the floor plane.