FINGERPRINT SENSING DEVICE WITH HETEROGENEOUS COATING STRUCTURE COMPRISING AN ADHESIVE
    12.
    发明申请
    FINGERPRINT SENSING DEVICE WITH HETEROGENEOUS COATING STRUCTURE COMPRISING AN ADHESIVE 有权
    具有包含粘合剂的异质涂层结构的指纹感测装置

    公开(公告)号:US20160358004A1

    公开(公告)日:2016-12-08

    申请号:US14997689

    申请日:2016-01-18

    Inventor: Karl LUNDAHL

    CPC classification number: G06K9/00053 G03F7/16 G06K9/00 G06K9/0002

    Abstract: A fingerprint sensing device comprises a sensing chip comprising an array of capacitive sensing elements. The sensing device comprises a coating material arranged in a layer on top of the array of sensing elements, the coating material comprising a plurality of cavities filled with an adhesive; wherein locations of the cavities correspond to locations of the sensing elements, such that a cross-section area of a cavity covers at least a portion of an area of a corresponding sensing element; and wherein a dielectric constant of the adhesive is higher than a dielectric constant of the coating material; and a protective plate attached to the sensing chip by means of the adhesive. Another sensing device is disclosed, where the coating layer comprises trenches filled with an adhesive, and where the coating has a higher dielectric constant than the adhesive. Associated methods of manufacturing are also disclosed.

    Abstract translation: 指纹感测装置包括感测芯片,其包括电容感测元件阵列。 感测装置包括布置在感测元件阵列的顶部上的涂层材料,涂层材料包括填充有粘合剂的多个空腔; 其中所述腔的位置对应于所述感测元件的位置,使得空腔的横截面面积覆盖相应感测元件的区域的至少一部分; 并且其中所述粘合剂的介电常数高于所述涂层材料的介电常数; 以及通过粘合剂附接到感测芯片的保护板。 公开了另一种感测装置,其中涂层包括填充有粘合剂的沟槽,并且其中涂层具有比粘合剂更高的介电常数。 还公开了相关的制造方法。

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