公开(公告)号：US20190280459A1

公开(公告)日：2019-09-12

申请号：US16422343

申请日：2019-05-24

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yuta ISHIGE ,  Etsuji KATAYAMA ,  Atsushi OGURI ,  Hajime MORI

IPC: H01S5/022 ,  H01S5/00 ,  G02B6/42

Abstract: A laser device that is easily assembled and can be manufactured at low cost and a light-source device using the same are provided. The laser device includes a base plate portion, a semiconductor laser element placed on the base plate portion, a lid portion provided on the base plate portion, on which the semiconductor laser element is placed, and including a top plate, and a side wall portion covering a part or all of lateral sides of a space between the base plate portion and the top plate. The top plate is integrally formed with a part or all of the side wall portion.

公开(公告)号：US20170315311A1

公开(公告)日：2017-11-02

申请号：US15653954

申请日：2017-07-19

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yuta ISHIGE ,  Naoki HAYAMIZU ,  Etsuji KATAYAMA ,  Toshia KIMURA

IPC: G02B6/42 ,  H01S5/40 ,  H01S5/022 ,  H01S5/00 ,  G02B6/26

CPC classification number: G02B6/4206 ,  G02B6/262 ,  G02B6/4236 ,  G02B6/4257 ,  G02B6/4296 ,  H01S5/0064 ,  H01S5/0071 ,  H01S5/0078 ,  H01S5/02216 ,  H01S5/02252 ,  H01S5/02284 ,  H01S5/02469 ,  H01S5/4012 ,  H01S5/4043

Abstract: A semiconductor laser module includes a package; a plurality of semiconductor laser elements provided in the package; a member having a plurality of mounting surfaces on which the semiconductor laser elements are mounted, the mounting surfaces being separated from a bottom surface of the package by respective distances, the distances being gradually different from each other in a manner that the mounting surfaces as a whole form a step-like form; a plurality of lenses collimating respective laser beams emitted from the semiconductor laser elements; a plurality of reflection mirrors reflecting the respective laser beams; a condenser lens unit condensing the laser beams; an optical fiber where the optical beams condensed by the condenser lenses are optically coupled; and an optical filter disposed on optical lines of the respective laser beams reflected by the reflection mirrors and reflecting light having wavelengths different from the wavelengths of the laser beams.

公开(公告)号：US20160064895A1

公开(公告)日：2016-03-03

申请号：US14937060

申请日：2015-11-10

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Yuta ISHIGE ,  Naoki Hayamizu

IPC: H01S5/022 ,  H01S5/00

CPC classification number: H01S5/02252 ,  H01S5/005 ,  H01S5/0226 ,  H01S5/02276 ,  H01S5/02288 ,  H01S5/02476

Abstract: An optical module includes a base portion having a top-surface metal layer on a top surface of a base, a semiconductor element on the top-surface metal layer and an optical element optically-coupled to the semiconductor element and bonded to the base with adhesive at a first side surface of the base at a side of the optical element being optically-coupled. A pull-back area is formed on the top surface by disposing a second side surface at the side, of the top-surface metal layer at a retracted position to the first side surface at the side. Between an adhesion area where the base and the optical element are bonded and a mounting portion below an optical-power-outputting surface of the semiconductor element, the top-surface metal layer has an adhesive flow stopping portion formed, by patterning, so as to prevent the adhesive from flowing through the pull-back area to the mounting portion's side.

Abstract translation: 光学模块包括在基底顶表面上具有顶表面金属层的底部，顶表面金属层上的半导体元件和与该半导体元件光耦合并与粘合剂粘合到基底上的光学元件 在光学元件的一侧的基底的第一侧表面被光学耦合。 通过在顶面金属层的位于侧面的第一侧表面的缩回位置的侧面处设置第二侧表面，在顶表面上形成拉回区域。 在基底和光学元件的粘合区域与半导体元件的光学输出面下方的安装部之间，顶面金属层具有通过图案化形成的粘合剂流动停止部， 防止粘合剂通过拉回区域流到安装部分的侧面。

公开(公告)号：US20150131692A1

公开(公告)日：2015-05-14

申请号：US14535357

申请日：2014-11-07

Applicant: FURUKAWA ELECTRIC CO., LTD.

Inventor： Naoki HAYAMIZU ,  Yuta ISHIGE ,  Toshio KIMURA

IPC: H01S5/06

CPC classification number: H01S5/06 ,  G02B6/32 ,  G02B6/4206 ,  G02B6/4214 ,  H01S5/005 ,  H01S5/02208 ,  H01S5/02284 ,  H01S5/4012

Abstract: A semiconductor laser module 1 is mainly composed of a package 3, a semiconductor laser 5, lenses 7, 9, 13, reflecting mirrors 11, an optical fiber 15, and the like. The package 3 is composed of a bottom part and side surfaces 19a, 19b. The side surfaces 19a, 19b stand erect approximately vertical to the bottom part of the package. In the semiconductor laser module 1, a plurality of semiconductor laser installation surfaces 17 are formed in a step-like shape. On each semiconductor laser installation surface 17, a semiconductor laser 5 is installed. A lens 7 is arranged at the anterior (in the emission direction) of the semiconductor laser 5. Moreover, a lens 9 is arranged further to the anterior. A reflecting mirror 11 is fixed to the side surface 19a, which is provided facing the emission direction of the semiconductor laser 5.

Abstract translation: 半导体激光器模块1主要由封装3，半导体激光器5，透镜7,9,13，反射镜11，光纤15等组成。 包装3由底部和侧面19a，19b构成。 侧表面19a，19b竖直地直立于包装的底部。 在半导体激光器模块1中，形成阶梯状的多个半导体激光器安装面17。 在每个半导体激光器安装表面17上安装半导体激光器5。 透镜7配置在半导体激光器5的前方（发光方向）。此外，透镜9配置在前方。 反射镜11固定在与半导体激光器5的发射方向相对的侧面19a上。