公开(公告)号：US11204463B1

公开(公告)日：2021-12-21

申请号：US16931771

申请日：2020-07-17

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Benjamin V. Fasano ,  Andreas D. Stricker ,  Hanyi Ding ,  Yusheng Bian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/12

Abstract: Embodiments of the disclosure provide an integrated circuit (IC) structure, including an optical medium for light signals; and an optical grating coupler coupled to the optical medium. The optical grating coupler is configured to reorient light from the optical medium. A cladding material is over the optical grating coupler. An absorber layer is over the cladding material, and vertically above the optical grating coupler.

公开(公告)号：US20210356684A1

公开(公告)日：2021-11-18

申请号：US15930876

申请日：2020-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Zhuojie Wu ,  Bo Peng

IPC: G02B6/42 ,  G02B6/293 ,  G02B6/43 ,  G01J3/18

Abstract: Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.

公开(公告)号：US20210311253A1

公开(公告)日：2021-10-07

申请号：US16837149

申请日：2020-04-01

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Bo Peng

IPC: G02B6/125 ,  G02B6/122

Abstract: Structures for an optical coupler and methods of fabricating a structure for an optical coupler. A coupling section has a plurality of segments arranged with a pitch, a first waveguide core has a section extending longitudinally over the first plurality of segments of the coupling section, and a second waveguide core has a section extending longitudinally over the coupling section. The section of the second waveguide core laterally spaced from the section of the first waveguide core by a given distance.

公开(公告)号：US11079544B2

公开(公告)日：2021-08-03

申请号：US16531819

申请日：2019-08-05

Applicant: GLOBALFOUNDRIES U.S. INC.

Inventor： Yusheng Bian ,  Bo Peng ,  Michal Rakowski ,  Ajey Poovannummoottil Jacob

IPC: G02B6/12 ,  G02B6/24

Abstract: The present disclosure relates to semiconductor structures and, more particularly, to Waveguide absorbers and methods of manufacture are provided. The waveguide structure includes a photonics component and a spirally configured waveguide absorber coupled to a node of the photonics component which reduces optical return loss.

公开(公告)号：US11467343B2

公开(公告)日：2022-10-11

申请号：US17170959

申请日：2021-02-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Bo Peng ,  Ajey Poovannummoottil Jacob ,  Yusheng Bian

IPC: G02B6/26

Abstract: Optical coupler structures include a waveguide having waveguide metamaterial segments aligned along a first line. A second insulator is on the first insulator and the waveguide metamaterial segments. A coupler structure is in the second insulator and has coupler metamaterial segments aligned along a second line. The first line and the second line are parallel and within a plane. A portion of the waveguide overlaps a portion of the coupler structure. The waveguide metamaterial segments intersect the plane and have first widths perpendicular to the plane, and the first widths have a first taper along the first line. The coupler metamaterial segments intersect the plane and have second widths in the direction perpendicular to the plane. The second widths have a second taper along the second line that is different from the first taper of the first widths where the waveguide overlaps the coupler structure.

公开(公告)号：US11269142B2

公开(公告)日：2022-03-08

申请号：US16837149

申请日：2020-04-01

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Bo Peng

IPC: G02B6/10 ,  G02B6/125 ,  G02B6/122 ,  G02B6/12

Abstract: Structures for an optical coupler and methods of fabricating a structure for an optical coupler. A coupling section has a plurality of segments arranged with a pitch, a first waveguide core has a section extending longitudinally over the first plurality of segments of the coupling section, and a second waveguide core has a section extending longitudinally over the coupling section. The section of the second waveguide core laterally spaced from the section of the first waveguide core by a given distance.

公开(公告)号：US11215756B2

公开(公告)日：2022-01-04

申请号：US16859347

申请日：2020-04-27

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur ,  Michal Rakowski ,  Kenneth J. Giewont ,  Karen Nummy ,  Kevin K. Dezfulian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/13

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The edge coupler includes a waveguide core, and a shaped layer is positioned over a portion of the waveguide core. The waveguide core is comprised of a first material, and the shaped layer is comprised of a second material different in composition from the first material. The first material may be, for example, single-crystal silicon, and the second material may be, for example, silicon nitride.

公开(公告)号：US20210333474A1

公开(公告)日：2021-10-28

申请号：US16859347

申请日：2020-04-27

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Roderick A. Augur ,  Michal Rakowski ,  Kenneth J. Giewont ,  Karen Nummy ,  Kevin K. Dezfulian ,  Bo Peng

IPC: G02B6/122 ,  G02B6/13

Abstract: Structures including an edge coupler and methods of fabricating a structure including an edge coupler. The edge coupler includes a waveguide core, and a shaped layer is positioned over a portion of the waveguide core. The waveguide core is comprised of a first material, and the shaped layer is comprised of a second material different in composition from the first material. The first material may be, for example, single-crystal silicon, and the second material may be, for example, silicon nitride.

公开(公告)号：US11852867B2

公开(公告)日：2023-12-26

申请号：US17454063

申请日：2021-11-09

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Yusheng Bian ,  Bo Peng ,  Michal Rakowski

IPC: G02B6/122 ,  G02B6/12

CPC classification number: G02B6/1225 ,  G02B2006/1213 ,  G02B2006/12104

Abstract: The present disclosure generally relates to semiconductor devices for use in optoelectronic/photonic applications and integrated circuit (IC) chips. More particularly, the present disclosure relates to semiconductor devices having a reflector and a photonic component and a method of forming the same. The present disclosure provides a semiconductor device having a substrate, a photonic component arranged above the substrate, a bottom reflector arranged above the substrate and positioned below the photonic component, in which the bottom reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component, and a top reflector arranged above the photonic component, in which the top reflector has a plurality of grating structures configured to reflect electromagnetic waves towards the photonic component.

公开(公告)号：US11531172B2

公开(公告)日：2022-12-20

申请号：US15930876

申请日：2020-05-13

Applicant: GLOBALFOUNDRIES U.S. Inc.

Inventor： Zhuojie Wu ,  Bo Peng

IPC: G01J3/18 ,  G02B6/42 ,  G02B6/43 ,  G02B6/293

Abstract: Structures for a photonics chip, testing methods for a photonics chip, and methods of forming a structure for a photonics chip. A photonics chip includes a first waveguide, a second waveguide, an optical tap coupling the first waveguide to the second waveguide, and a photodetector coupled to the second waveguide. A laser is attached to the photonics chip. The laser is configured to generate laser light directed by the first waveguide to the optical tap.