公开(公告)号：US09997434B2

公开(公告)日：2018-06-12

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H05K7/20 ,  H01L23/473 ,  H01L23/427 ,  H01L23/34 ,  H01L25/065 ,  H01L23/02 ,  H01L25/18 ,  H01L23/44 ,  H01L23/467 ,  H01L23/48

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

公开(公告)号：US20170084514A1

公开(公告)日：2017-03-23

申请号：US15311569

申请日：2014-05-19

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Niru Kumari ,  Tahir Cader ,  Sergio Escobar-Vargas ,  Cullen E. Bash

IPC: H01L23/427 ,  H01L25/065 ,  H01L25/18 ,  H01L23/473 ,  H01L23/02

CPC classification number: H01L23/427 ,  H01L23/02 ,  H01L23/34 ,  H01L23/44 ,  H01L23/467 ,  H01L23/473 ,  H01L23/4735 ,  H01L23/481 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/18 ,  H01L2225/06589 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An example device in accordance with an aspect of the present disclosure includes a substrate that may be disposed in a housing. The substrate includes a sprayer to spray coolant.

公开(公告)号：US10108239B2

公开(公告)日：2018-10-23

申请号：US15113995

申请日：2014-01-31

Applicant: Hewlett Packard Enterprise Development LP

Inventor： Chandrakant Patel ,  Jichuan Chang ,  Cullen E. Bash

IPC: G06F1/30 ,  G06F1/28 ,  G06F1/26 ,  G06F11/00 ,  G06F1/32

Abstract: Systems and methods for operating based on recovered waste heat are described. In one example, the method includes receiving recovered waste heat power and operating at least one system component of a recovered waste heat based computing device based on the recovered waste heat power, where the at least one system component is coupled to a non-volatile memory of the recovered waste heat based computing device. The method further includes preserving operational states of the at least one system component in the non-volatile memory based on a current power level associated with the recovered waste heat power.