公开(公告)号：US11318469B2

公开(公告)日：2022-05-03

申请号：US16606287

申请日：2018-04-25

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Chien-Hua Chen

IPC: B01L3/00 ,  B01L7/00

Abstract: An example system includes a microfluidic cavity; a retaining feature within the microfluidic cavity, and a releasing feature. The retaining feature is to position capsules at a predetermined location in the microfluidic cavity. The capsules have a thermally degradable shell enclosing a material therein. The releasing feature is to selectively cause degradation of the shell to release the material into the microfluidic opening. The releasing feature is to generate heat to facilitate degradation of the shell. In some examples, the retaining feature is a physical barrier sized to prevent flow of the capsule and to allow flow of the released materials through the microfluidic cavity.

公开(公告)号：US11278887B2

公开(公告)日：2022-03-22

申请号：US16493241

申请日：2017-04-21

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B01L3/00

Abstract: A microfluidic device is provided that includes a substrate and microfluidic sub-chips embedded in the substrate. An electric field is applied between an adjacent pair microfluidic sub-chips to move a fluid droplet from one of the adjacent pair of microfluidic sub-chips to another of the adjacent pair microfluidic sub-chips.

公开(公告)号：US20210362156A1

公开(公告)日：2021-11-25

申请号：US16606241

申请日：2018-07-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor Shkolnikov ,  Chien-Hua Chen

IPC: B01L3/00

Abstract: An example of an apparatus includes a focusing region to focus a sheath fluid and a particle flow. The apparatus also includes a particle inlet to inject the particle flow into the focusing region. In addition, the apparatus includes a sheath inlet to inject the sheath fluid into the focusing region. Also, the apparatus includes a cut-out disposed on a wall of the sheath inlet to distribute the sheath fluid about the particle flow to focus the particle flow into a linear stream. The apparatus further includes a separation region to apply a force to the particle flow. The force is dependent on a characteristic of a particle in the particle flow.

公开(公告)号：US11183437B2

公开(公告)日：2021-11-23

申请号：US16737361

申请日：2020-01-08

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie ,  Stephen Farrar

IPC: B41J2/14 ,  H01L23/31 ,  H01L23/48 ,  H01L23/00 ,  H01L21/56 ,  H01L23/29

Abstract: In some examples, a circuit package includes a packaging, and a circuit device in the packaging, where the packaging comprises a first EMC having a first coefficient of thermal expansion (CTE), and a second EMC having a second CTE higher than the first CTE. The second EMC is on the first EMC that has gelled over time.

公开(公告)号：US20210347171A1

公开(公告)日：2021-11-11

申请号：US17251982

申请日：2019-01-31

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Daryl E. Anderson ,  Eric Martin ,  James R. Przybyla ,  Chien-Hua Chen

IPC: B41J2/14 ,  B41J2/09 ,  B41J2/085

Abstract: One example provides a fluidic die including a semiconductor substrate, and a nozzle layer disposed on the substrate, the nozzle layer having a top surface opposite the substrate and including a nozzle formed therein, the nozzle including a fluid chamber disposed below the top surface and a nozzle orifice extending through the nozzle layer from the top surface to the fluid chamber, the fluid chamber to hold fluid, and the nozzle to eject fluid drops from the fluid chamber via the nozzle orifice. An electrode is disposed in contact with the nozzle layer about a perimeter of the nozzle orifice, the electrode to carry an electrical charge to adjust movement of electrically charged components of the fluid.

公开(公告)号：US11110714B2

公开(公告)日：2021-09-07

申请号：US16604516

申请日：2017-08-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Jeffrey A. Nielsen ,  Michael W. Cumbie ,  Chien-Hua Chen

IPC: B41J2/175 ,  B41J2/03

Abstract: An apparatus includes a print head coupled to a substrate to dispense fluid from the substrate in response to a command. A reservoir coupled to the substrate transports the fluid to the print head. A preloaded storage container mounted on the reservoir stores the fluid and provides the fluid to the reservoir in response to pressure applied to the container.

公开(公告)号：US20210252860A1

公开(公告)日：2021-08-19

申请号：US16958585

申请日：2019-04-29

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua Chen ,  Michael W Cumbie

IPC: B41J2/14 ,  B41J2/16

Abstract: An example fluidic device may comprise a fluidic die and a support element coupled to the fluidic die. A fluid channel may be arranged within the support element and may define a fluid path through the support element and a fluid aperture of the fluidic die. A conductive element may be arranged in the fluid path and separated from the fluidic die. A conductive lead may provide an electrical coupling between a ground of the fluidic die and the conductive element.

公开(公告)号：US20210129534A1

公开(公告)日：2021-05-06

申请号：US16629366

申请日：2017-07-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Si-lam Choy ,  Michael W Cumbie ,  Chien-Hua Chen ,  Jeffrey R Pollard

IPC: B41J2/14 ,  B41J2/21 ,  B41J2/175 ,  B41J2/16

Abstract: In one example in accordance with the present disclosure, a fluidic ejection die is described. The die includes an array of nozzles. Each nozzle includes an ejection chamber and an opening. A fluid actuator is disposed within the ejection chamber. The fluidic ejection die also includes an array of passages, formed in a substrate, to deliver fluid to and from the ejection chamber. The fluidic ejection die also includes an array of enclosed cross-channels. Each enclosed cross-channel of the array of enclosed cross-channels is fluidly connected to a respective plurality of passages of the array of passages.

公开(公告)号：US20200369031A1

公开(公告)日：2020-11-26

申请号：US16991524

申请日：2020-08-12

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Silam J. Choy ,  Michael W. Cumbie ,  Devin Alexander Mourey ,  Chien-Hua Chen

IPC: B41J2/16 ,  B41J2/14 ,  B41J2/155 ,  B41J2/175

Abstract: In some examples, a print bar fabrication method comprises placing printhead dies face down on a carrier, placing a printed circuit board on the carrier, wire bonding each printhead die of the printhead dies to the printed circuit board, and overmolding the printhead dies and the printed circuit board on the carrier, including fully encapsulating the wire bonds.

公开(公告)号：US10821729B2

公开(公告)日：2020-11-03

申请号：US14770402

申请日：2013-07-29

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua Chen ,  Michael W. Cumbie

IPC: B41J2/14 ,  B41J2/16

Abstract: In an embodiment, a fluid flow structure includes a micro device embedded in a molding, a fluid feed hole formed through the micro device, and a transfer molded fluid channel in the molding that fluidically couples the fluid feed hole with the channel.