公开(公告)号：US20210229438A1

公开(公告)日：2021-07-29

申请号：US16769907

申请日：2019-02-06

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Christopher A. LEONARD ,  Anthony M. FULLER

IPC: B41J2/14 ,  B41J2/16

Abstract: A fluid ejection device includes a fluid ejection die including a first end portion positioned adjacent a first end of the fluid ejection die, and a fluid ejection portion positioned adjacent the first end portion. The fluid ejection die includes a contact pad positioned in the first end portion, and a fluid actuation device positioned in the fluid ejection portion. A carrier is attached to the fluid ejection die. The carrier includes a slot to provide fluid to the fluid actuation device. The slot extends longitudinally along the fluid ejection portion to a first slot end. A length from the first slot end to the first end of the fluid ejection die is less than 1.5 mm.

公开(公告)号：US20210221029A1

公开(公告)日：2021-07-22

申请号：US16772309

申请日：2019-02-06

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua CHEN ,  Jimmy PEREZ

IPC: B29C33/30 ,  B29C33/00 ,  B29C33/14 ,  B29C33/42 ,  B29C39/10

Abstract: A mold assembly may include a mold frame having an opening extending in a plane and a movable mold insert adjuster to move a mold insert having a slot forming protrusion within the plane within opening.

公开(公告)号：US20200331272A1

公开(公告)日：2020-10-22

申请号：US16920313

申请日：2020-07-02

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua CHEN ,  Micheal W. CUMBIE

IPC: B41J2/16 ,  B41J2/14

Abstract: A method for forming a fluid flow structure may include positioning rows of micro devices in a mold, wherein each of the micro devices comprising a chamber layer in which an ejection chamber is formed and an orifice layer over the chamber layer in which an orifice is formed. The method may further include molding an amorphous body to encapsulate the rows of the micro devices such that the amorphous body forms fluid channels such that each of the rows is fluidically coupled to a different one of the fluid channels.

公开(公告)号：US20180244044A1

公开(公告)日：2018-08-30

申请号：US15747619

申请日：2015-10-15

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Devin Alexander MOUREY ,  Chien-Hua CHEN ,  Michael W. CUMBIE

IPC: B41J2/16 ,  B41J2/14

CPC classification number: B41J2/1637 ,  B41J2/14 ,  B41J2/16 ,  B41J2202/22

Abstract: In example implementations, an apparatus with an embedded service structure is provided. The apparatus may include an epoxy molded compound (EMC). At least one print head die may be embedded in the EMC. A service structure may be located within the EMC adjacent to the at least one print head die.

公开(公告)号：US20170120596A1

公开(公告)日：2017-05-04

申请号：US15122701

申请日：2014-03-31

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Michael W Cumbie ,  Devin Alexander Mourey

IPC: B41J2/16 ,  B23K26/402 ,  B24C1/04 ,  B29C69/00

CPC classification number: B41J2/1637 ,  B23K26/402 ,  B24C1/04 ,  B29C69/001 ,  B29L2031/767 ,  B41J2/1603 ,  B41J2/162 ,  B41J2/1632 ,  B41J2/1639 ,  B41J2/1752

Abstract: In an example, a method for making a fluid ejection apparatus may include forming a molding material over a fluid passage on a back surface of printhead die, embedding the printhead die in an encapsulant in a cavity in a printed circuit board such that at least one drop ejector of the printhead die is exposed at a front side of the printed circuit board, removing the encapsulant at a back side of the printed circuit board to expose the molding material, and removing the molding material to form a fluid feed slot through which fluid may flow to the fluid passage opening in the printhead die.

公开(公告)号：US20230150198A1

公开(公告)日：2023-05-18

申请号：US18098089

申请日：2023-01-17

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Chien-Hua CHEN ,  Michael W. Cumbie

IPC: B29C64/209 ,  B33Y30/00 ,  B29D99/00 ,  B41J2/14 ,  B41J2/16

CPC classification number: B29C64/209 ,  B33Y30/00 ,  B29D99/001 ,  B41J2/1433 ,  B41J2/162

Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

公开(公告)号：US20230050391A1

公开(公告)日：2023-02-16

申请号：US17974743

申请日：2022-10-27

Applicant: Hewlett-Packard Development Company, L.P.

Inventor： Viktor Shkolnikov ,  Chien-Hua CHEN

IPC: B01L7/00 ,  B01L3/00 ,  G01N33/543

Abstract: An example system includes an array of retaining features in a microfluidic cavity, an array of thermally controlled releasing features, and a controller coupled to each releasing feature in the array of releasing feature. Each retaining feature in the array of retaining features is to position capsules at a predetermined location, the capsules having a thermally degradable shell enclosing a biological reagent therein. Each releasing feature in the array of releasing features corresponds to a retaining feature and is to selectively cause degradation of the shell of a capsule. Each releasing feature is to generate thermal energy to facilitate degradation of the shell. The controller is to selectively activate at least one releasing feature in the array of thermally controlled releasing features to release the biological reagent in the capsules positioned at the retaining feature corresponding to the activated releasing feature.

公开(公告)号：US20210170396A1

公开(公告)日：2021-06-10

申请号：US16769783

申请日：2018-01-16

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Michael W. CUMBIE ,  Hilary ELY ,  Chien-Hua CHEN

IPC: B01L3/00

Abstract: A fluid testing device may include a fluid interaction element and a fluid chamber to contain a fluid to be sensed by the fluid interaction element. The fluid chamber may form a first gap through which fluid is to be wicked to a second gap that is opposite the fluid interaction element and less than the first gap.

公开(公告)号：US20170008281A1

公开(公告)日：2017-01-12

申请号：US15113533

申请日：2014-01-28

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Chien-Hua CHEN ,  Michael W. Cumbie

IPC: B41J2/14

Abstract: Printbar modules and methods of forming printbars are described. In an example, a printbar module includes a printed circuit board (PCB), adhesive material, a printhead die sliver, and a slot extending through the PCB and the adhesive material to the printhead die sliver.

Abstract translation: 描述打印条模块和形成印刷条的方法。 在一个示例中，打印头模块包括印刷电路板（PCB），粘合剂材料，打印头芯片条，以及延伸穿过印刷电路板和将粘合剂材料延伸到打印头芯片的狭槽。

公开(公告)号：US20210213451A1

公开(公告)日：2021-07-15

申请号：US16076074

申请日：2017-04-23

Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.

Inventor： Viktor SHKOLNIKOV ,  Chien-Hua CHEN

IPC: B01L3/00 ,  B03C5/00 ,  B03C5/02 ,  G01N1/40

Abstract: A fluid entrained particle separator may include an inlet passage to direct particles entrained in a fluid, a first separation passage branching from the inlet passage, a second separation passage branching from the inlet passage and electrodes to create electric field exerting a dielectrophoretic force on the particles to direct the particles to the first separation passage or the second separation passage, wherein the first separation passage, the second separation passage, the electric field and the dielectrophoretic force extend in a plane.