MOLDED PANELS
    4.
    发明公开
    MOLDED PANELS 审中-公开

    公开(公告)号:US20230150198A1

    公开(公告)日:2023-05-18

    申请号:US18098089

    申请日:2023-01-17

    CPC classification number: B29C64/209 B33Y30/00 B29D99/001 B41J2/1433 B41J2/162

    Abstract: A fluid ejection device may include a fluid ejection die including nozzles and fluid feed holes. Each nozzle may have a nozzle orifice formed in a top surface of the fluid ejection die. The fluid feed holes may be formed in a bottom surface of the fluid ejection die and fluidly connected to the nozzles. The fluid ejection device may include a molded panel into which the fluid ejection die is at least partially embedded, the molded panel having a fluid slot formed therethrough such that the fluid slot is fluidly connected to the fluid feed holes of the fluid ejection die, the molded panel formed with a mold chase and a release liner coupled to and at least partially covering an interior surface of the mold chase, the mold chase having a fluid slot feature corresponding to the fluid slot.

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