公开(公告)号：US20230294212A1

公开(公告)日：2023-09-21

申请号：US18014806

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/40 ,  B23K26/067 ,  B23K26/08 ,  B23K26/06

CPC classification number: B23K26/40 ,  B23K26/0676 ,  B23K26/0884 ,  B23K26/0648 ,  B23K26/0643 ,  B23K2101/40

Abstract: This laser processing apparatus includes a controller. The controller executes first control for causing the laser light to be modulated such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that, in the irradiation direction, the converging point of each of the plurality of rays is positioned on a side opposite to a converging point of non-modulated light of the laser light with respect to an ideal converging point of the processing light, or the converging point of each of the plurality of rays is positioned on a side opposite to the ideal converging point with respect to the converging point of the non-modulated light.

公开(公告)号：US20230095941A1

公开(公告)日：2023-03-30

申请号：US17910075

申请日：2021-03-03

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Iku SANO ,  Takeshi SAKAMOTO

IPC: B23K26/53 ,  B23K26/03 ,  B23K26/06 ,  B23K26/0622

Abstract: A laser processing device includes an irradiation unit configured to irradiate an object with laser light, an image capturing part configured to capture an image of the object with light having transparency to the object, a display unit configured to display information, and a control unit configured to control at least the irradiation unit, the image capturing part, and the display unit. The control unit performs a first process of irradiating the object with the laser light by control of the irradiation unit to form a modified spot and a fracture extending from the modified spot in the object so as not to reach an outer surface of the object, a second process of, after the first process, capturing an image of the object by control of the image capturing part and acquiring information indicating a formation state of the modified spot and/or the fracture.

公开(公告)号：US20230057674A1

公开(公告)日：2023-02-23

申请号：US17795062

申请日：2020-12-07

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Katsuhiro KOREMATSU ,  Takeshi SAKAMOTO

IPC: B23K26/046 ,  B23K26/067 ,  B23K26/53 ,  B23K26/06

Abstract: A control unit performs first processing of irradiating an object with laser light while relatively moving a first converging point and a second converging point along a first line, in a state where a distance between the first converging point and a second converging point is set as a first distance, and performs second processing of irradiating the object with the laser light while relatively moving the first converging point and the second converging point along a second line, in a state where the distance between the first converging point and the second converging point is set to a second distance smaller than the first distance.

公开(公告)号：US20210060693A1

公开(公告)日：2021-03-04

申请号：US16605027

申请日：2018-04-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: B23K26/00 ,  B23K26/0622 ,  B23K26/53 ,  H01L21/304 ,  H01L21/3065 ,  H01L21/78

Abstract: An object cutting method includes: a first step of preparing an object; a second step of irradiating the object with a laser light to form at least one row of modified regions in a single crystal silicon substrate of the object so as to extend between the at least one row of modified regions and a second main surface of the object along each of a plurality of lines to cut and to form a fracture; and a third step of, after the second step, performing dry etching on the object from the second main surface side to form a groove opening to the second main surface, along each of the plurality of lines to cut. In the second step, the modified region is formed so that a not-fracture region, to which the fracture does not extend, is formed at a predetermined position in the thickness direction in the object.

公开(公告)号：US20210057402A1

公开(公告)日：2021-02-25

申请号：US16633367

申请日：2018-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Ryuji SUGIURA ,  Yuta KONDOH ,  Naoki UCHIYAMA

IPC: H01L25/00 ,  H01L21/268 ,  H01L21/78 ,  H01L21/304 ,  H01L25/18

Abstract: A laminated element manufacturing method includes a first forming step of forming a first gettering region for each of functional elements by irradiating a semiconductor substrate of a first wafer with a laser light, a first grindsing step of grinding the semiconductor substrate of the first wafer and removing a portion of the first gettering region, a bonding step of bonding a circuit layer of a second wafer to the semiconductor substrate of the first wafer, a second forming step of forming a second gettering region for each of the functional elements by irradiating the semiconductor substrate of the second wafer with a laser light, and a second grinding step of grinding the semiconductor substrate of the second wafer and removing a portion of the second gettering region.

公开(公告)号：US20210053157A1

公开(公告)日：2021-02-25

申请号：US16605292

申请日：2018-04-12

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Tomoya TAGUCHI

IPC: B23K26/364 ,  B23K26/38 ,  B23K26/53 ,  H01L21/3065 ,  H01L21/78 ,  H01L21/311

Abstract: An object cutting method includes: a first step of preparing an object including a single crystal silicon substrate and a functional device layer provided on a first main surface side; a second step of irradiating the object with laser light to form at least one row of modified regions in the single crystal silicon substrate and to form a fracture in the object so as to extend between the at least one row of modified regions and a second main surface of the object; and a third step of performing dry etching on the object from the second main surface side to form a groove opening to the second main surface. In the third step, in a state in which an etching protection layer having a gas passing region formed, is formed on the second main surface, the dry etching is performed by using a xenon difluoride gas.

公开(公告)号：US20250025963A1

公开(公告)日：2025-01-23

申请号：US18715221

申请日：2022-08-22

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Yo SUGIMOTO ,  Takafumi OGIWARA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/364

Abstract: A laser processing device includes a support unit, a laser light source, a spatial light modulator, and a condensing unit. A modulation pattern displayed on a display unit of the spatial light modulator includes a branching pattern for branching laser light into first branched laser light components to form a first groove and second branched laser light components to form a second groove. A distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light adjacent to each other in a direction along the line is larger than a distance between the position of the focusing point of the first branched laser light and the position of the focusing point of the second branched laser light in the width direction of the first groove and the second groove.

公开(公告)号：US20240238897A1

公开(公告)日：2024-07-18

申请号：US18014828

申请日：2021-07-13

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO ,  Katsuhiro KOREMATSU ,  Takafumi OGIWARA

IPC: B23K26/067 ,  B23K26/04 ,  B23K26/53

CPC classification number: B23K26/0676 ,  B23K26/04 ,  B23K26/53

Abstract: This laser processing apparatus includes an irradiation unit and a controller. The irradiation unit has a spatial light modulator and a converging part. The controller executes first control for causing the laser light to be modulated such that the laser light is branched into a plurality of rays of processing light and a plurality of converging points of the plurality of rays are positioned in different positions in a direction perpendicular to an irradiation direction of the laser light. In the first control, the laser light is modulated such that fractures that extend from a plurality of modified spots constituting the modified region and stretch along the virtual plane to be connected to each other are present between a converging point of non-modulated light of the laser light and an opposite surface on a side opposite to a laser light incidence surface of the object in the irradiation direction.

公开(公告)号：US20240033859A1

公开(公告)日：2024-02-01

申请号：US18268383

申请日：2021-12-20

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Yo SUGIMOTO ,  Takeshi SAKAMOTO ,  Takafumi OGIWARA ,  Naoki UCHIYAMA ,  Takashi KURITA ,  Ryo YOSHIMURA

IPC: B23K26/38 ,  B23K37/00

CPC classification number: B23K26/38 ,  B23K37/00

Abstract: A laser processing method includes a first step of preparing a wafer including a plurality of functional elements disposed to be adjacent to each other via a street, a second step of, after the first step, forming a modified region in the wafer along a line passing through the street, and a third step of, after the second step, irradiating the street with laser light such that a surface layer of the street is removed, and a fracture extending from the modified region reaches a bottom surface of a recess formed by removing the surface layer, along the line.

公开(公告)号：US20230249285A1

公开(公告)日：2023-08-10

申请号：US18015558

申请日：2021-07-01

Applicant: HAMAMATSU PHOTONICS K.K.

Inventor： Takeshi SAKAMOTO

IPC: B23K26/06 ,  B23K26/38 ,  B23K26/062

CPC classification number: B23K26/0648 ,  B23K26/38 ,  B23K26/062

Abstract: A laser processing method includes a laser processing step of converging laser light to an object including a first surface and a second surface opposite to the first surface using the first surface as an incident surface to form a converging spot of the laser light, while relatively moving the converging spot with respect to the object, thereby performing laser processing in the object, the object being provided with a grinding planned area along the incident surface, and the laser processing step including a first forming step of relatively moving, while setting a position of the converging spot in a Z direction intersecting with the incident surface at a first Z position, the converging spot along a line extended in an X direction along the incident surface, thereby forming a first modified region and a first fracture extended from the first modified region in the object.