公开(公告)号：US20250007221A1

公开(公告)日：2025-01-02

申请号：US18342432

申请日：2023-06-27

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Katherine Jeanne Novak

IPC: H01R13/6587 ,  H01R12/71

Abstract: An Electromagnetic Interference (EMI) Shielding Assembly (EISA) for a PCBA is provided and includes an enclosure, wherein the enclosure defines an enclosure cavity and an electrically conductive foundation associated with a PCBA having an area of interest, wherein the electrically conductive foundation at least partially surrounds the area of interest, and wherein the enclosure is securely connected to the PCBA to completely cover the area of interest and to contact the electrically conductive foundation.

公开(公告)号：US20240377867A1

公开(公告)日：2024-11-14

申请号：US18316034

申请日：2023-05-11

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Kenneth J. Trotman

IPC: G06F1/18 ,  H05K7/14 ,  H05K7/20

Abstract: Apparatus and associated methods relate to dividing single full-width card slot of an electronics enclosure into two reduced-width card slots. Such conversion is performed by interposing a card-slot dividing member between full-width slide members on opposite interior surfaces of a card cage of the electronics enclosure. The card-slot dividing member has first and second reduced-width slide members aligned directly opposite the full-width slide members on opposite interior surfaces of the card cage. Each of the first and second reduced-width slide members is configured to slidably guide a reduced-width Circuit Card Assembly (CCA) module into the reduced-width card slot cooperatively with a corresponding one of the full-width slide members. In some embodiments, the card-slot dividing member is further configured to operate as a heat exchanger, helping to cool any CCA modules within an interior cavity of the electronics enclosure.

公开(公告)号：US20240090131A1

公开(公告)日：2024-03-14

申请号：US17944333

申请日：2022-09-14

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Judy Schwartz

IPC: H05K1/18 ,  H01L23/31 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32

CPC classification number: H05K1/18 ,  H01L23/3121 ,  H01L23/34 ,  H01L23/367 ,  H05K3/32 ,  H05K2201/10477 ,  H05K2201/10515 ,  H05K2201/10636 ,  H05K2201/10946 ,  H05K2203/049

Abstract: A method of forming a circuit board assembly includes receiving a flat no-lead package. The package includes: a housing having a first side and second side; a circuit disposed within the housing; and an exposed thermal belly pad that is thermally coupled to the circuit and passes at least partially through the first side such that it can be exposed to an environment outside of the housing. The method also includes attaching the second side of the flat no-lead package to a first side of a printed circuit board (PCB) such that the exposed thermal belly pad is opposite the first side of the PCB.

公开(公告)号：US20240074090A1

公开(公告)日：2024-02-29

申请号：US17821566

申请日：2022-08-23

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Kenneth J. Trotman

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20209 ,  H05K7/206

Abstract: An electronic assembly includes one or more electronic components, and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. One or more removable covers are positioned over the cooling airflow inlet to allow for airflow ingress into the cooling airflow inlet, while preventing impingement of debris into the cooling airflow inlet.

公开(公告)号：US20240074088A1

公开(公告)日：2024-02-29

申请号：US17821540

申请日：2022-08-23

Applicant: Hamilton Sundstrand Corporation

Inventor： Alexander Trotman ,  Kenneth J. Trotman

IPC: H05K7/20

CPC classification number: H05K7/20145 ,  H05K7/20209 ,  H05K7/206

Abstract: An electronic assembly includes one or more electronic components and an enclosure in which the one or more electronic components are located. The enclosure includes a vertically top surface, a vertically bottom surface, and a plurality of side portions extending between the top surface and the bottom surface. A cooling arrangement for thermal management of the one or more electronic components includes a cooling airflow inlet to admit a cooling airflow into the enclosure, a cooling airflow outlet to exhaust the cooling airflow from the enclosure, and one or more cooling pathways between the cooling airflow inlet and the cooling airflow outlet. The cooling airflow inlet is downward facing toward the vertically bottom surface such that the cooling airflow flows into the cooling airflow inlet an upward direction toward the vertically top surface.