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公开(公告)号:US07112239B2
公开(公告)日:2006-09-26
申请号:US10848055
申请日:2004-05-19
申请人: Masahiko Kimbara , Daigoro Mori , Takehiro Nito , Hidehito Kubo , Keiji Toh
发明人: Masahiko Kimbara , Daigoro Mori , Takehiro Nito , Hidehito Kubo , Keiji Toh
IPC分类号: F17C11/00
CPC分类号: C01B3/0005 , F17C11/005 , F17C2205/013 , F17C2223/0123 , F17C2227/0337 , Y02E60/321 , Y02E60/327
摘要: A hydrogen storage apparatus that includes multiple gas storage tanks that each house a storing/adsorbing material and through the interior of which a fluid travels is provided. The gas storage apparatus 10 includes roughly cylindrical gas storage tanks 20 that house hydrogen-storing alloy. The multiple gas storage tanks 20 are disposed longitudinally parallel to each other in an ordered fashion such that roughly triangular prism-shaped empty spaces are formed between multiple adjacent hydrogen storage tanks 20. Coolant paths through which coolant flows are formed in these roughly triangular prism-shaped empty spaces. These coolant paths are thermally connected to the hydrogen-storing alloy in the gas storage tanks 20 via constituent members of the gas storage tanks 20 and via heat transfer plates 28 disposed on the gas storage tanks 20.
摘要翻译: 一种氢存储装置,其包括多个储气罐,每个储气罐容纳储存/吸附材料并且通过其流体行进的内部。 气体存储装置10包括容纳储氢合金的大致圆筒形的储气罐20。 多个储气罐20以有序的方式彼此纵向平行地设置,使得在多个相邻的氢存储罐20之间形成大致三角形的棱柱形空间。 冷却剂流过的冷却剂路径形成在这些大致三角形的棱柱形空间中。 这些冷却剂路径经由气体储存槽20的构成部件和设置在气体储存槽20上的传热板28与气体储罐20中的储氢合金热连接。
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公开(公告)号:US20050051294A1
公开(公告)日:2005-03-10
申请号:US10713134
申请日:2003-11-14
申请人: Katsuyoshi Fujita , Hidehito Kubo , Keiji Toh , Akiko Kumano , Daigoro Mori
发明人: Katsuyoshi Fujita , Hidehito Kubo , Keiji Toh , Akiko Kumano , Daigoro Mori
CPC分类号: F28D7/06 , C01B3/0005 , F17C11/005 , F28D2021/0047 , F28F1/32 , Y02E60/321 , Y02E60/327
摘要: In a hydrogen storing tank (solid filling tank) in which a hydrogen absorbing alloy (solid) is filled, a heat exchanger for executing heat exchange with the hydrogen absorbing alloy is constructed by laminating alternately a first heat-transferring fins formed in corrugated plate shape and a second heat-transferring fins formed in flat plate shape. Partitioned portions that are partitioned by the first heat-transferring fins and the second heat-transferring fins restrict movement of hydrogen absorbing alloy powders (MH powders) in a subsiding direction. Therefore, movement of the MH powders can surely be prevented by not using members that has no concern with the heat exchange and reduces an amount of filled MH powders and a volume in which the heat exchanger is provided.
摘要翻译: 在填充有吸氢合金(固体)的储氢罐(固体填充槽)中,与吸氢合金进行热交换的热交换器通过交替层叠形成波纹板状的第一传热翅片而构成 以及形成为平板状的第二传热翅片。 由第一传热翅片和第二传热翅片隔开的分隔部分限制吸氢合金粉末(MH粉末)沿下沉方向的运动。 因此,通过不使用不关心热交换的部件,减少MH粉末的填充量和设置热交换器的体积,可以确实地防止MH粉末的移动。
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公开(公告)号:US20080128896A1
公开(公告)日:2008-06-05
申请号:US11999387
申请日:2007-12-04
申请人: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
发明人: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
CPC分类号: H01L23/473 , H01L24/33 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/3011 , H01L2924/351 , H01L2924/00
摘要: A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.
摘要翻译: 半导体装置包括半导体装置,强制冷却型的冷却器和热质。 在半导体器件中产生的热量被传导到冷却器。 热量与焊料与半导体器件结合,以便与半导体器件热结合。 热质也用作电极。
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公开(公告)号:US08030760B2
公开(公告)日:2011-10-04
申请号:US11999387
申请日:2007-12-04
申请人: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
发明人: Keiji Toh , Hidehito Kubo , Masahiko Kimbara , Haruo Takagi , Daizo Kamiyama
CPC分类号: H01L23/473 , H01L24/33 , H01L2224/32225 , H01L2224/32245 , H01L2224/33181 , H01L2924/1305 , H01L2924/13055 , H01L2924/13091 , H01L2924/15787 , H01L2924/3011 , H01L2924/351 , H01L2924/00
摘要: A semiconductor apparatus includes a semiconductor device, a cooler of a forced cooling type, and a heat mass. Heat generated in the semiconductor device is conducted to the cooler. The heat mass comes into junction with the semiconductor device with solder so as to be thermally combined with the semiconductor device. The heat mass functions also as an electrode.
摘要翻译: 半导体装置包括半导体装置,强制冷却型的冷却器和热质。 在半导体器件中产生的热量被传导到冷却器。 热量与焊料与半导体器件结合,以便与半导体器件热结合。 热质也用作电极。
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公开(公告)号:US08475722B2
公开(公告)日:2013-07-02
申请号:US12756771
申请日:2010-04-08
申请人: Haruyuki Nakanishi , Norihiko Nakamura , Hidekazu Arikawa , Hirofumi Fujiwara , Hidehito Kubo , Keiji Toh , Akiko Kumano , Shohei Matsumoto
发明人: Haruyuki Nakanishi , Norihiko Nakamura , Hidekazu Arikawa , Hirofumi Fujiwara , Hidehito Kubo , Keiji Toh , Akiko Kumano , Shohei Matsumoto
CPC分类号: B01J19/127 , B01J19/2475 , B01J2219/0875 , B01J2219/0877 , B01J2219/0892 , C01B3/042 , C01B2203/0405 , Y02E60/364
摘要: The present invention provides a hydrogen generation device using a photocatalyst to generate hydrogen from liquid water or water vapor and a method of using the same. The hydrogen generation device of the present invention has a water channel through which liquid water or water vapor flows, and which has an outer circumferential wall made at least in part of a transparent material; a hydrogen channel through which hydrogen flows and which is located at the inner circumference side of the water channel; a hydrogen separating membrane forming at least part of a wall between the water channel and hydrogen channel, separating hydrogen from the liquid water or water vapor in the water channel, and providing the hydrogen to the hydrogen channel; and a photocatalyst layer arranged on least at part of the water channel-side surface of the hydrogen separating membrane.
摘要翻译: 本发明提供一种使用光催化剂从液态水或水蒸汽中生成氢的氢生成装置及其使用方法。 本发明的氢生成装置具有液体水或水蒸汽流过的水通道,具有至少部分由透明材料制成的外周壁; 氢气通过氢通道,位于水通道的内周侧; 氢分离膜,其形成水通道和氢通道之间的壁的至少一部分,从水通道中的液态水或水蒸汽中分离出氢气,并向氢气通道提供氢气; 以及设置在氢分离膜的至少一部分水通道侧表面上的光催化剂层。
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公开(公告)号:US08387685B2
公开(公告)日:2013-03-05
申请号:US11919368
申请日:2006-04-19
申请人: Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人: Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
CPC分类号: H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译: 提供了能够实现进一步提高散热性能的功率模块的散热器,并且进一步提高了安装特性。 用于功率模块的散热器1具有层叠体20,第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21,多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分 面22对层叠方向的各平行流路50形成传热路径70a。 在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a,26b接合 主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂 流路由流入路径30a,每个平行流路50和流出路径40a构成。
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公开(公告)号:US20090314474A1
公开(公告)日:2009-12-24
申请号:US11919368
申请日:2006-04-19
申请人: Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人: Masahiko Kimbara , Keiji Toh , Hidehito Kubo , Katsufumi Tanaka , Kota Otoshi , Eiji Kono , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
CPC分类号: H01L23/473 , F28F3/086 , F28F3/12 , H01L23/3731 , H01L23/3736 , H01L2224/48091 , H01L2224/48137 , H01L2924/00014
摘要: A heat sink for a power module able to realize a further improvement of heat radiating performance and a further improvement of a mounting property is provided.The heat sink 1 for a power module has a laminating body 20, a first side plate 30 and a second side plate 40. The laminating body 20 has plural flow path plates 21 formed in a plate shape in which plural grooves 23 parallel to each other are concavely arranged on a flat joining face 22. Each groove 23 is set to a parallel flow path 50 parallel to a front face side by laminating each flow path plate 21 by each joining face 22. A portion other than each groove 23 of each joining face 22 forms a heat transfer path 70a to each parallel flow path 50 of a laminating direction. A flow-in path 30a and a flow-out path 40a are formed in the first and second side plates 30, 40. The flow-in path 30a and the flow-out path 40a are joined to side faces 26a, 26b of the laminating body 20, and are communicated with each parallel flow path 50. The flow-in path 30a flows a cooling medium into each parallel flow path 50. The flow-out path 40a flows the cooling medium out of each parallel flow path 50. A refrigerant flow path is constructed by the flow-in path 30a, each parallel flow path 50 and the flow-out path 40a.
摘要翻译: 提供了能够实现进一步提高散热性能的功率模块的散热器,并且进一步提高了安装特性。 用于功率模块的散热器1具有层叠体20,第一侧板30和第二侧板40.层叠体20具有多个形成为板状的流路板21,多个相互平行的槽23 凹陷地布置在平坦的接合面22上。每个槽23通过每个接合面22层压每个流路板21而设置成平行于前表面的平行流动路径50.每个连接的每个槽23之外的部分 面22对层叠方向的各平行流路50形成传热路径70a。 在第一和第二侧板30,40中形成有流入路径30a和流出路径40a。流入路径30a和流出路径40a与层叠的侧面26a,26b接合 主体20并与每个平行流动路径50连通。流入路径30a将冷却介质流入每个平行流动路径50.流出路径40a将冷却介质从每个平行流动路径50流出。制冷剂 流路由流入路径30a,每个平行流路50和流出路径40a构成。
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公开(公告)号:US20090302458A1
公开(公告)日:2009-12-10
申请号:US11922945
申请日:2006-06-27
申请人: Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人: Hidehito Kubo , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号: H01L23/367 , H05K7/20
CPC分类号: H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要: A heat sink (1) for power module is capable of mounting a power device (101) on at least a surface of the heat sink. The heat sink includes a refrigerant passage (1d) in which cooling medium that dissipates heat generated by the power device (101) flows and a corrugated fin body (1a) arranged in the refrigerant passage (1d). The corrugated fin body (1a) has crests (21b) and troughs (21c) that extend in the flow direction of the cooling medium, and side walls (21a) each of which connects the corresponding one of the crests (21b) with the adjacent one of the troughs (21c). Each adjacent pair of the side walls (21a) and the corresponding one of the crests (21b) or the corresponding one of the troughs (21c) arranged between the adjacent side walls (21a) form a fin (21). Each of the side walls (21a) has a louver (31) that operates to, at least, rotate the cooling medium flowing in the associated fin (21). The heat sink (1) thus has a further improved heat dissipating performance.
摘要翻译: 用于功率模块的散热器(1)能够将功率器件(101)安装在散热器的至少一个表面上。 散热器包括散发由动力装置(101)产生的热量的冷却介质流动的制冷剂通路(1d)和布置在制冷剂通路(1d)中的波纹状散热片体(1a)。 波纹状散热片体(1a)具有在冷却介质的流动方向上延伸的波峰(21b)和槽(21c),以及各个顶部(21b)的相应一个与相邻的顶部 一个槽(21c)。 布置在相邻侧壁(21a)之间的每个相邻的一对侧壁(21a)和相应的一个峰(21b)或相应的一个槽(21c)形成翅片(21)。 每个侧壁(21a)具有操作以使至少旋转在相关联的翅片(21)中流动的冷却介质的百叶窗(31)。 因此,散热器(1)具有进一步改善的散热性能。
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公开(公告)号:US20120111447A1
公开(公告)日:2012-05-10
申请号:US13378864
申请日:2010-06-17
申请人: Daigoro Mori , Kumiko Nishizawa , Kosei Yoshida , Keiji Toh , Shintaro Watanabe , Hidefumi Oishi , Hidehito Kubo
发明人: Daigoro Mori , Kumiko Nishizawa , Kosei Yoshida , Keiji Toh , Shintaro Watanabe , Hidefumi Oishi , Hidehito Kubo
IPC分类号: B65B31/02
CPC分类号: F17C3/025 , F17C5/06 , F17C2221/012 , F17C2223/0123 , F17C2223/036 , F17C2225/0123 , F17C2225/036 , F17C2227/0355 , F17C2250/032 , F17C2250/034 , F17C2250/036 , F17C2250/0631 , F17C2250/0636 , F17C2250/077 , F17C2260/023 , F17C2260/025 , F17C2265/065 , F17C2265/066 , F17C2270/0178 , F17C2270/0184 , Y02E60/321 , Y02P90/45
摘要: A hydrogen filling system includes: a hydrogen tank that is filled with hydrogen; a determination unit that determines whether to fill hydrogen into the hydrogen tank; and a temperature regulating unit that regulates a temperature of the hydrogen tank, wherein, when the determination unit determines to fill hydrogen into the hydrogen tank, the temperature regulating unit starts cooling the hydrogen tank before filling of hydrogen into the hydrogen tank is started.
摘要翻译: 氢气充填系统包括:填充有氢的氢气罐; 确定单元,其确定是否将氢填充到所述氢罐中; 以及温度调节单元,其调节所述氢罐的温度,其中,当所述确定单元确定将氢填充到所述氢罐中时,所述温度调节单元在将氢气填充到所述氢罐内之前开始冷却所述氢罐。
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公开(公告)号:US20140140004A1
公开(公告)日:2014-05-22
申请号:US13779519
申请日:2013-02-27
申请人: Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
发明人: Hidehito KUBO , Masahiko Kimbara , Keiji Toh , Kota Otoshi , Eiji Kono , Katsufumi Tanaka , Nobuhiro Wakabayashi , Shintaro Nakagawa , Yuichi Furukawa , Shinobu Yamauchi
IPC分类号: H05K7/20
CPC分类号: H05K7/20263 , F28F3/027 , H01L23/3672 , H01L23/473 , H01L2924/0002 , H01L2924/00
摘要: A power module includes a power device and a heat sink. The heat sink includes a refrigerant passage in which a cooling medium flows and a corrugated fin body arranged in the refrigerant passage. The refrigerant passage is defined by a surface and a backside, and the power device is disposed in proximity to the surface. The corrugated fin body has crests and troughs that extend in the flow direction of the cooling medium and side walls each of which connects the corresponding one of the crests with the adjacent one of the troughs. Each adjacent pair of the side walls and the corresponding one of the crests or the corresponding one of the troughs arranged between the adjacent side walls form a fin. A guide that extends in the flow direction of the cooling medium and operates to stir the cooling medium is arranged in each of the fins.
摘要翻译: 功率模块包括功率器件和散热器。 散热器包括冷却介质流动的制冷剂通道和布置在制冷剂通道中的波纹状散热片体。 制冷剂通道由表面和背面限定,并且动力装置设置在表面附近。 波纹状散热片本体具有沿着冷却介质的流动方向延伸的波峰和波谷,每个侧壁将相应的波峰与相邻的波谷连接。 布置在相邻侧壁之间的每个相邻的一对侧壁和相应的一个峰或相应的一个槽形成翅片。 在每个散热片中布置有沿冷却介质的流动方向延伸并且用于搅拌冷却介质的引导件。
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