公开(公告)号：US08481151B2

公开(公告)日：2013-07-09

申请号：US13393798

申请日：2009-09-04

申请人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

发明人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

IPC分类号： C01B6/24 ,  B32B3/26

CPC分类号： B22F1/02 ,  B22F7/002 ,  C01B3/0026 ,  C01B3/0042 ,  C01B3/0078 ,  C22C47/06 ,  C22C49/04 ,  C22C2202/04 ,  Y02E60/327 ,  Y10T428/249953 ,  Y10T428/31678

摘要： A hydrogen storage alloy comprises a hydrogen storage base formed of a mixture of magnesium and an alloy, such as a magnesium-nickel alloy, a magnesium-titanium alloy, a magnesium-niobium alloy, a magnesium-manganese alloy, or a magnesium-cobalt alloy, and a catalytic layer covering a surface of the base. A hydrogen storage alloy unit includes the hydrogen storage base and a porous body including an assembly of nanofibers. The alloy may be vapor-deposited onto the assembly of nanofibers. The nanofibers may be tangled to provide spaces between the fibers for the passage of hydrogen molecules. The nanofibers in one example are also porous. A catalytic layer of platinum may cover a surface of the hydrogen storage base.

摘要翻译： 储氢合金包括由镁和合金的混合物形成的储氢基质，例如镁 - 镍合金，镁 - 钛合金，镁 - 铌合金，镁 - 锰合金或镁 - 钴 合金，以及覆盖基材表面的催化剂层。 储氢合金单元包括储氢基底和包括纳米纤维组件的多孔体。 该合金可以气相沉积到纳米纤维的组件上。 纳米纤维可能被缠结以在纤维之间提供用于氢分子通过的空间。 在一个实例中的纳米纤维也是多孔的。 铂的催化剂层可以覆盖储氢基底的表面。

公开(公告)号：US20120228276A1

公开(公告)日：2012-09-13

申请号：US13428336

申请日：2012-03-23

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cutting line on the surface of the work to cause multiple photon absorption and with a condensed point located inside of the work, and a modified area is formed inside the work along the predetermined determined cutting line by moving the condensed point along the predetermined cut line, whereby the work is cut with a small force by cracking the work along the predetermined cutting line starting from the modified area and, because the pulse laser beam is hardly absorbed onto the surface.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不会产生工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件表面上的预定切割线上 工作的表面，引起多光子吸收并且具有位于工件内部的凝结点，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝结点，在工件内部形成改质区域，由此工件 通过从修改区域开始沿着预定切割线开裂工件，并且因为脉冲激光束几乎不被吸收到表面上，所以以小的力切割。

公开(公告)号：US20120171461A1

公开(公告)日：2012-07-05

申请号：US13393792

申请日：2009-09-04

申请人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

发明人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

IPC分类号： B32B3/26 ,  B01J21/10 ,  B82Y99/00

CPC分类号： B22F1/02 ,  B22F7/002 ,  C01B3/0031 ,  C01B3/0042 ,  C01B3/0078 ,  C22C23/00 ,  C22C47/062 ,  C22C49/04 ,  C22C2202/04 ,  Y02E60/327 ,  Y10T428/249953

摘要： A hydrogen storage alloy unit comprises a porous body 7 having a large number of holes (spaces) 9 allowing hydrogen atoms to pass through, and a hydrogen storage alloy covering a surface of the porous body 7, inclusive of surfaces of the holes thereof. The hydrogen storage alloy includes a hydrogen storage base formed of a hydrogen storage material, and a catalytic layer covering a surface of the hydrogen storage base. The porous body 7 is formed of an assembly of hydrogen storage fibers 8 formed by vapor-depositing the hydrogen storage alloy onto nanofibers.

摘要翻译： 储氢合金单元包括具有允许氢原子通过的大量孔（空间）9的多孔体7和覆盖多孔体7的表面的储氢合金，包括其孔的表面。 储氢合金包括由储氢材料形成的储氢基底和覆盖储氢基体的表面的催化剂层。 多孔体7由通过将储氢合金气相沉积在纳米纤维上形成的储氢纤维8的组合而形成。

公开(公告)号：US20120164432A1

公开(公告)日：2012-06-28

申请号：US13393798

申请日：2009-09-04

申请人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

发明人： Naoki Uchiyama ,  Tomomi Kanai ,  Kazumi Harada

IPC分类号： B32B3/26 ,  B32B15/04

CPC分类号： B22F1/02 ,  B22F7/002 ,  C01B3/0026 ,  C01B3/0042 ,  C01B3/0078 ,  C22C47/06 ,  C22C49/04 ,  C22C2202/04 ,  Y02E60/327 ,  Y10T428/249953 ,  Y10T428/31678

摘要： A hydrogen storage alloy comprises a hydrogen storage base 2 formed of a mixture of Mg and an alloy (Mg2Ni, for example), and a catalytic layer 3 covering a surface of the hydrogen storage base 2. The hydrogen storage alloy with this structure exhibits both a high ability to store hydrogen and a high ability to cause hydrogen to diffuse in it in the solid state, provided by Mg and Mg2Ni, respectively. Hydrogen absorbed in Mg in one region is passed on to Mg (or Mg2Ni) in another region by virtue of Mg2Ni. Since this movement of hydrogen does not require heat nor pressure, hydrogen can be absorbed at room temperature and atmospheric pressure.

摘要翻译： 储氢合金包括由Mg和合金（例如Mg2Ni）的混合物形成的储氢基底2和覆盖储氢基底2的表面的催化剂层3.具有这种结构的储氢合金表现出两者 分别由Mg和Mg2Ni提供的氢的存储能力高，并且能够以固态形式在其中扩散氢的高能力。 通过Mg2Ni，将一个区域中Mg中吸收的氢气传递到另一区域的Mg（或Mg2Ni）。 由于氢气的运动不需要热量或压力，所以氢气可以在室温和大气压下被吸收。

公开(公告)号：US20110027972A1

公开(公告)日：2011-02-03

申请号：US12900754

申请日：2010-10-08

申请人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu FUKUYO ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/78 ,  B23K26/00

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US20100190603A1

公开(公告)日：2010-07-29

申请号：US12668614

申请日：2008-07-04

申请人： Naoki Uchiyama

发明人： Naoki Uchiyama

IPC分类号： B60W10/08 ,  B60W20/00

CPC分类号： B60L7/24 ,  B60L11/005 ,  Y02T10/7022 ,  Y10T477/38

摘要： When a drive wheel (3) of a vehicle is driven by a motor generator (10) that operates as a motor, electric power is supplied from a storage battery (20) to the motor generator (10). When the drive wheel (3) is braked by the motor generator (10) that operates as a generator, electric power is supplied from the motor generator (10) to the storage battery (20), and a first thermoelectric conversion element (11) is supplied with electric power from the motor generator (10) to cool the motor generator (10).

摘要翻译： 当车辆的驱动轮（3）由作为电动机工作的电动发电机（10）驱动时，电力从蓄电池（20）供给到电动发电机（10）。 当驱动轮（3）由作为发电机动作的电动发电机（10）制动时，从电动发电机（10）向蓄电池（20）供给电力，第一热电转换元件（11） 被供给来自电动发电机（10）的电力以冷却电动发电机（10）。

公开(公告)号：US20100176100A1

公开(公告)日：2010-07-15

申请号：US12686039

申请日：2010-01-12

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： B23K26/04 ,  B23K26/073 ,  B23K26/38

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US07566635B2

公开(公告)日：2009-07-28

申请号：US11332228

申请日：2006-01-17

申请人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

发明人： Yoshimaro Fujii ,  Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama

IPC分类号： H01L21/00

CPC分类号： H01L21/78 ,  B23K26/0057 ,  B23K26/0622 ,  B23K26/40 ,  B23K26/53 ,  B23K2103/50 ,  B23K2203/50 ,  B28D5/00 ,  B28D5/0011 ,  H01L21/268 ,  H01L21/304 ,  H01L21/30604 ,  H01L21/6836 ,  H01L21/76894 ,  H01L23/544 ,  H01L23/562 ,  H01L2221/68327 ,  H01L2221/68336 ,  H01L2223/5446 ,  H01L2924/00 ,  H01L2924/0002

摘要： A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within the substrate, so as to form a modified region including a molten processed region due to multiphoton absorption within the semiconductor substrate 1, and causing the modified region including the molten processed region to form a starting point region for cutting; and grinding a rear face 21 of the semiconductor substrate 1 after the step of forming the starting point region for cutting such that the semiconductor substrate 1 attains a predetermined thickness.

摘要翻译： 一种衬底分割方法，其可以在防止发生破裂和破裂的同时使衬底细分割。 该基板分割方法包括以下步骤：将具有形成有功能元件19的正面3的半导体基板1照射在基板内，同时将聚光点定位在基板内，从而形成包含熔融处理区域的改质区域 在半导体衬底1内进行多光子吸收，并且使包含熔融处理区域的改性区域形成切割起点区域; 在形成用于切割的起点区域的步骤之后，研磨半导体衬底1的后表面21，使得半导体衬底1达到预定厚度。

公开(公告)号：US07396742B2

公开(公告)日：2008-07-08

申请号：US11106645

申请日：2005-04-15

申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda

IPC分类号： H01L21/78

CPC分类号： H01L21/78 ,  B23K20/023 ,  B23K20/16 ,  B23K20/233 ,  B23K20/26 ,  B23K26/03 ,  B23K26/032 ,  B23K26/034 ,  B23K26/046 ,  B23K26/0624 ,  B23K26/066 ,  B23K26/073 ,  B23K26/0853 ,  B23K26/16 ,  B23K26/364 ,  B23K26/40 ,  B23K26/53 ,  B23K2101/40 ,  B23K2103/50 ,  B28D5/0011 ,  B65G2249/04 ,  C03B33/023 ,  C03B33/082 ,  C03B33/102 ,  C03C23/0025 ,  G02F1/1368 ,  H01L21/6836 ,  H01L2221/68327 ,  Y02P40/57 ,  Y10T29/49144 ,  Y10T83/0341

摘要： A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface of the work under the conditions causing a multiple photon absorption and with a condensed point aligned to the inside of the work, and a modified area is formed inside the work along the predetermined determined cut line by moving the condensed point along the predetermined cut line, whereby the work can be cut with a rather small force by cracking the work along the predetermined cut line starting from the modified area and, because the pulse laser beam radiated is not almost absorbed onto the surface of the work, the surface is not fused even if the modified area is formed.

摘要翻译： 一种激光束加工方法和激光束加工装置，其能够切割工件而不产生在工件表面上的预定切割线的定影和裂纹，其中脉冲激光束照射在工件的预定切割线上 在导致多光子吸收的条件下并且具有与工件内部对准的凝聚点的工作表面，并且沿着预定的切割线沿着预定的切割线沿着预定的切割线移动凝聚点而在工件内部形成改质区域 由此，可以用相当小的力通过从修改区域开始沿着预定切割线的工作而切割工件，并且因为辐射的脉冲激光束几乎不被吸收到工件的表面上，所以表面不熔合 即使形成了修改区域。

公开(公告)号：US20060255024A1

公开(公告)日：2006-11-16

申请号：US10547976

申请日：2003-03-12

申请人： Fumitsufu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

发明人： Fumitsufu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

IPC分类号： B23K26/38

CPC分类号： B23K26/18 ,  A61M5/3272 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B28D1/221 ,  B28D5/0011

摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着要切割物体的线5在待处理物体1内形成切割开始区域8。 此后，通过物体1的未修改区域透射的激光L 2照射物体1，以从作为起点的切割起始区域8产生裂缝24，由此物体1能够沿着 线5沿着该物体打算被切割。 扩大具有固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着目标1切割对象1的线5切割物体1的可靠性。