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    Laser beam machining method
    1.
    发明申请
    Laser beam machining method 有权
    激光束加工方法

    公开(公告)号：US20060255024A1

    公开(公告)日：2006-11-16

    申请号：US10547976

    申请日：2003-03-12

    申请人： Fumitsufu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    发明人： Fumitsufu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    IPC分类号： B23K26/38

    CPC分类号： B23K26/18 ,  A61M5/3272 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B28D1/221 ,  B28D5/0011

    摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

    摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着要切割物体的线5在待处理物体1内形成切割开始区域8。 此后，通过物体1的未修改区域透射的激光L 2照射物体1，以从作为起点的切割起始区域8产生裂缝24，由此物体1能够沿着 线5沿着该物体打算被切割。 扩大具有固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着目标1切割对象1的线5切割物体1的可靠性。

    Laser beam machining method
    5.
    发明授权
    Laser beam machining method 有权
    激光束加工方法

    公开(公告)号：US08247734B2

    公开(公告)日：2012-08-21

    申请号：US10547976

    申请日：2003-03-12

    申请人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    发明人： Fumitsugu Fukuyo ,  Kenshi Fukumitsu ,  Naoki Uchiyama ,  Toshimitsu Wakuda ,  Kazuhiro Atsumi ,  Kenichi Muramatsu

    IPC分类号： H01L21/301 ,  H01L21/322 ,  H01L21/78

    CPC分类号： B23K26/18 ,  A61M5/3272 ,  B23K26/53 ,  B23K26/60 ,  B23K2101/40 ,  B28D1/221 ,  B28D5/0011

    摘要： A laser processing method which can accurately cut an object to be processed along a line to cut is provided. A modified region 7 formed by multiphoton absorption forms a cutting start region 8 within an object to be processed 1 along a line 5 along which the object is intended to be cut. Thereafter, the object 1 is irradiated with laser light L2 transmittable through an unmodified region of the object 1, so as to generate fractures 24 from the cutting start region 8 acting as a start point, whereby the object 1 can accurately be cut along the line 5 along which the object is intended to be cut. Expanding an expandable film 19 having the object 1 secured thereto separates individual chips 25 from each other, which can further improve the reliability in cutting the object 1 along the line 5 along which the object is intended to be cut.

    摘要翻译： 提供了一种能够沿着切割线精密切割待处理物体的激光加工方法。 通过多光子吸收形成的改质区域7沿着要切割物体的线5在待处理物体1内形成切割开始区域8。 此后，对象物1照射通过物体1的未修改区域可透射的激光L2，以便从作为起始点的切割起始区域8产生裂缝24，从而物体1能够沿着线 5，对象意图被切割。 扩大具有固定物体1的可膨胀膜19将各个芯片25彼此分开，这可以进一步提高沿着目标1切割对象1的线5切割物体1的可靠性。