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公开(公告)号：US10391690B2
公开(公告)日：2019-08-27
申请号：US15570484
申请日：2015-04-30
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guo Yang
Abstract: The present disclosure provides an injection molding apparatus, including a fixed mold component, a movable mold component, a first positive electrode module, and a first negative electrode module. The fixed mold component has an injection port and a transmission runner, to receive injection-molding melt. The movable mold component has a molding groove communicated with the transmission runner. The first positive electrode module and the first negative electrode module are disposed on a first side and a second side of the molding groove respectively, where the first side and the second side are opposite to each other. The first positive electrode module cooperates with the first negative electrode module to form an electric field between the first side and the second side of the molding groove, to perform electric field excitation on the injection-molding melt flowing into the molding groove.
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公开(公告)号：US11665816B2
公开(公告)日：2023-05-30
申请号：US17598530
申请日：2020-03-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
CPC classification number: H05K1/0272 , H05K1/0203 , H05K1/0219 , H05K3/4644 , H05K2201/064 , H05K2201/10121
Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
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公开(公告)号：US11272639B2
公开(公告)日：2022-03-08
申请号：US16462826
申请日：2017-02-07
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guo Yang , Quanming Li , Xiaohu Liu , Wei Li , Zhiguo Zhang
Abstract: A heat dissipation apparatus includes a heat dissipation panel built in the electronic device. The heat dissipation panel includes a first heat conducting layer, including a first surface and a second surface. The first surface is a surface exposed to the outside when the first heat conducting layer is bent. The second surface is a surface opposite to the first surface. A first region on the first heat conducting layer is used to absorb heat released by a heat emitting component, and conduct the heat to a second region on the first heat conducting layer, to dissipate the heat. The heat dissipation panel also includes first flexible layer, including a third region. The third region adheres to a position that is on the second surface of the first heat conducting layer and that corresponds to a bending region.
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公开(公告)号：US20210109575A1
公开(公告)日：2021-04-15
申请号：US17130289
申请日：2020-12-22
Applicant: Huawei Technologies Co., Ltd.
Inventor： Guo Yang , Tao Huang , Wenming Shi , Teng Long , Wei Li , Jianliang Wang , Zhiguo Zhang
Abstract: A folding device and a heat dissipation apparatus, where the folding device includes a heat collection element, including a heat collection plate and a first shaft sleeve, where a first end of the heat collection plate is in contact with a heat source in a first folding part, and a second end of the heat collection plate is coupled to an outer wall of the first shaft sleeve, the first shaft sleeve is sleeved on a rotating shaft, and a third end of the cooling element is in contact with the rotating shaft, and a fourth end of the cooling element is in contact with a heat dissipation device in a second folding part.
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Patent Agency Ranking
公开(公告)号：US11839055B2
公开(公告)日：2023-12-05
申请号：US17683698
申请日：2022-03-01
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
CPC classification number: H05K7/20336 , H04M1/026 , H05K7/205 , G06F1/203 , H04M1/02
Abstract: A heat-conducting assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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公开(公告)号：US11778772B2
公开(公告)日：2023-10-03
申请号：US17859259
申请日：2022-07-07
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jiajia Sui , Quanming Li , Guo Yang , Shuainan Lin
CPC classification number: H05K7/20145 , H01F27/085 , H02J7/0042 , H02J50/005 , H02J50/12 , H05K7/20172 , H05K7/20909
Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
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公开(公告)号：US11419238B2
公开(公告)日：2022-08-16
申请号：US16759890
申请日：2018-10-27
Applicant: HUAWEI TECHNOLOGIES CO., LTD.
Inventor： Jiajia Sui , Quanming Li , Guo Yang , Shuainan Lin
Abstract: Embodiments of the present invention relate to a wireless charging device. The wireless charging device includes a housing, an induction coil, a ferrite, a printed circuit board (PCB), and a fan. The housing includes a first surface and a second surface, a protrusion is disposed on the first surface, and the protrusion is configured to: support a to-be-charged device, and leave a gap between the to-be-charged device and the first surface when the to-be-charged device is installed on the wireless charging device. At least one first air guiding opening and at least one second air guiding opening are disposed on the housing. When the fan runs, the first air guiding opening, the fan, and the second air guiding opening form an air duct that passes through the ferrite and the PCB.
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公开(公告)号：US20220183146A1
公开(公告)日：2022-06-09
申请号：US17598530
申请日：2020-03-27
Applicant: Huawei Technologies Co., Ltd.
Inventor： Zhi Yuan , Guo Yang , Jian Shi , Linfang Jin , Zhen Xu
IPC: H05K1/02
Abstract: In an electronic device, a circuit board connects different systems or structures such that heat of a system with a relatively large amount of heat can be transferred to a position or a heat dissipation structure with a relatively small amount of heat, thereby mitigating local high temperatures in the electronic device and distributing heat more evenly throughout the electronic device.
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公开(公告)号：US20210007238A1
公开(公告)日：2021-01-07
申请号：US17031040
申请日：2020-09-24
Applicant: Huawei Technologies Co., Ltd.
Inventor： Yongfu Sun , Guo Yang , Quanming Li
Abstract: A heat-conducting assembly is described, the assembly includes a middle frame and a heat-conducting structure. The middle frame is plate-shaped, having a first side surface and a second side surface that are opposite to each other, and being provided with a first through hole through which the first side surface communicates with the second side surface. The heat-conducting structure includes a heat dissipation part and a conducting part. The heat dissipation part is fastened to the second side surface, and the conducting part extends into the first through hole. The conducting part includes a conductor being connected to the heat dissipation part and a heat insulator which is fastened in the first through hole through the heat insulator, and is in contact with a heat source, which is close to one end that is of the first through hole and that is located on the first side surface.
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