公开(公告)号：US20200212826A1

公开(公告)日：2020-07-02

申请号：US16235054

申请日：2018-12-28

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wen HSU ,  Che-Kai YEH ,  Chin-Fu KUO ,  Chao-Ta HUANG

IPC: H02N1/00 ,  B81B3/00 ,  B81B7/00

Abstract: A MEMS device includes a substrate, at least one anchor disposed on the substrate, a movable stage, a sensing chip disposed on the movable stage, and at least one elastic member connected with the movable stage and the anchor. The movable stage includes at least one electrode and at least one conductive connecting layer. The sensing chip includes at least one electrical interconnection connected with the conductive connecting layer. The elastic member includes at least one first electrical channel, a second electrical channel and an electrical insulation layer disposed between the first electrical channel and the second electrical channel. The first electrical channel is electrically connected with the electrical interconnection, and the second electrical channel is electrically connected with the electrode.

公开(公告)号：US20240219239A1

公开(公告)日：2024-07-04

申请号：US18201996

申请日：2023-05-25

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Yu-Wen HSU ,  Lu-Pu LIAO ,  Chao-Ta HUANG ,  Bo-Kai CHAO

IPC: G01J5/20 ,  H10N19/00

CPC classification number: G01J5/20 ,  H10N19/00

Abstract: A vertically integrated micro-bolometer includes an integrated circuit chip, an infrared sensing film, and a metal bonding layer. The integrated circuit chip includes a silicon substrate, a circuit element, and a dielectric layer disposed on the silicon substrate. The infrared sensing film includes a top absorbing layer, a sensing layer, and a bottom absorbing layer. The sensing layer is disposed between the top absorbing layer and the bottom absorbing layer. Materials of the top absorbing layer, the sensing layer, and the bottom absorbing layer are materials compatible with a semiconductor manufacturing process. The metal bonding layer connects the dielectric layer on the silicon substrate in the integrated circuit chip and the bottom absorbing layer of the infrared sensing film to form a vertically integrated micro-bolometer. In one embodiment, the infrared sensing film is divided into a central sensing film, a surrounding sensing film, and a plurality of connecting portions by a plurality of slots. The surrounding sensing film surrounds the central sensing film. Each of the connecting portions connects the surrounding sensing film and the central sensing film. A central distance from the bottom absorbing layer of the central sensing film to the silicon substrate is substantially equal to a surrounding distance from the bottom absorbing layer of the surrounding sensing film to the silicon substrate.

公开(公告)号：US20230202832A1

公开(公告)日：2023-06-29

申请号：US17743331

申请日：2022-05-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Jen-Chieh LI ,  Chao-Ta HUANG ,  Chung-Yuan SU ,  RueiHung KAO

IPC: B81B3/00 ,  H04R17/00 ,  H04R19/02 ,  H01L41/04

CPC classification number: B81B3/0021 ,  H04R17/00 ,  H04R19/02 ,  H01L41/042 ,  B81B2201/0257

Abstract: A microelectromechanical apparatus includes a base and a thin film including a stationary part disposed on the base, a peripheral part, a central part surrounded by the peripheral part, and a first and second elastic part. The first elastic part is connected to the stationary part and the peripheral part. The second elastic part is connected to the peripheral part and the central part. When low frequency signal is input to a first electrode of the first elastic part, the peripheral part and the and the central part respectively vibrate with a first and second low-frequency amplitudes. When high-frequency signal is input to a second electrode of the second elastic part, the peripheral part and the central part respectively vibrate with a first and second high-frequency amplitudes. A difference between the first and second low-frequency amplitudes is smaller than a difference between the first and second high-frequency amplitudes.

公开(公告)号：US20210018041A1

公开(公告)日：2021-01-21

申请号：US16870439

申请日：2020-05-08

Applicant: Industrial Technology Research Institute

Inventor： Chien-Nan YEH ,  Chung-Yuan SU ,  Chao-Ta HUANG

IPC: F16C29/06 ,  G01B7/16 ,  F16C41/00

Abstract: A linear guideway with an embedded sensor includes a track, a slider, a plurality of rolling members, and a sensing module. The track extends in a first direction and has a first recess. The slider can move in the first direction and include a second recess, a channel, at least one hole, and a deforming region. The channel is formed by coupling the first recess and the second recess, and extends in the first direction. The hole extends from the surface of the slider along the insertion axis and into the slider. The rolling members are disposed in the channel. The sensing module is disposed in the hole, and contacts the deforming region to detect the amount of deformation.

公开(公告)号：US20160165358A1

公开(公告)日：2016-06-09

申请号：US14586086

申请日：2014-12-30

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Tzong-Che HO ,  Yu-Wen FAN ,  Hong-Ren CHEN ,  Chao-Ta HUANG

IPC: H04R23/00 ,  B81B7/00

CPC classification number: H04R1/021 ,  B81B7/0061 ,  B81B7/0064 ,  B81B7/007 ,  B81B2201/0257 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48227 ,  H04R1/04 ,  H04R1/342 ,  H04R19/005 ,  H04R23/00 ,  H04R31/00 ,  H04R2201/003 ,  H04R2410/03 ,  H04R2499/11 ,  H01L2924/00014

Abstract: An MEMS microphone package includes a substrate, an MEMS microphone, an IC chip and an electrically conductive cover. The substrate includes a first hole, an upper surface, a bottom surface, a side surface, a first electrically conductive layer and a second electrically conductive layer. The side surface has two sides connected to the upper surface and the bottom surface, respectively. The first electrically conductive layer is disposed on the upper surface. The second electrically conductive layer is disposed on the bottom surface. The MEMS microphone is electrically coupled to the substrate. The IC chip is electrically coupled to the substrate. The electrically conductive cover includes a second hole. The electrically conductive cover is bonded to the substrate to form a chamber for accommodating the MEMS microphone and the IC chip. The first hole and the second hole together form an acoustic hole.

Abstract translation: MEMS麦克风封装包括基板，MEMS麦克风，IC芯片和导电盖。 基板包括第一孔，上表面，底表面，侧表面，第一导电层和第二导电层。 侧表面分别连接到上表面和底表面。 第一导电层设置在上表面上。 第二导电层设置在底面上。 MEMS麦克风电耦合到基板。 IC芯片电耦合到基板。 导电盖包括第二孔。 导电盖结合到基板上以形成用于容纳MEMS麦克风和IC芯片的室。 第一孔和第二孔一起形成声孔。