公开(公告)号：US20190251214A1

公开(公告)日：2019-08-15

申请号：US16022705

申请日：2018-06-29

Applicant: Industrial Technology Research Institute

Inventor： Wei Li ,  Yu-Lin Chao ,  Chih-Ming Shen ,  Ming-Chi Tai ,  Miao-Zhen Hong

IPC: G06F17/50 ,  B29C64/386 ,  B33Y50/02 ,  G06T17/00 ,  B33Y10/00

CPC classification number: G06F17/5009 ,  B29C64/386 ,  B33Y10/00 ,  B33Y50/02 ,  G06T17/00 ,  G06T2207/10028

Abstract: A design method of an assistive device and an electronic system of assistive device design are provided. The design method of the assistive device are adapted for an electronic devices including a processor. The design method includes: obtaining a point cloud data of a limb part; determining a plurality of reference cross sections according to the point cloud data, wherein each of the reference cross sections is determined corresponding to bone protrusion feature points of the point cloud data, wherein the bone protrusion feature points are corresponding to the bony prominences of the limb parts respectively; establishing an initial digital model of the assistive device according to the reference cross sections; and performing a structural simulation analysis according to the initial digital model and design limitations to obtain a product digital model of the assistive device.

公开(公告)号：US10343868B2

公开(公告)日：2019-07-09

申请号：US15220958

申请日：2016-07-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Kaan Liang ,  Ming-Ji Dai ,  Chin-Hung Wang ,  Chih-Ming Shen

IPC: B65H27/00 ,  B65H23/188 ,  B65H23/04 ,  B65H23/192

Abstract: Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.

公开(公告)号：US20180145236A1

公开(公告)日：2018-05-24

申请号：US15857628

申请日：2017-12-29

Applicant: Industrial Technology Research Institute

Inventor： Yu-Wei Huang ,  Tao-Chih Chang ,  Chih-Ming Shen

IPC: H01L33/62 ,  H01L25/075 ,  H01L21/56 ,  H01L33/58

CPC classification number: H01L33/62 ,  H01L21/568 ,  H01L25/0753 ,  H01L25/0756 ,  H01L33/58 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/18 ,  H01L2224/19 ,  H01L2224/24137 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73267 ,  H01L2224/92244 ,  H01L2924/18162 ,  H01L2924/00

Abstract: A package structure for a light emitting device including a carrier, a plurality of package units, an interconnection structure is provided. The carrier has a carrying surface, the package units stack on the carrying surface, each of the package units has a first surface and a second surface opposite the first surface and a plurality of light emitting devices arranged in an array and embedded in the package unit. Each of the light emitting devices includes a top portion facing the carrier, a bottom portion opposite to the top portion and a first electrode on the top portion, the bottom portion of each of the plurality of light emitting devices is coplanar with the first surface of the package unit. The interconnection structure is located in the package units and includes a plurality of conductive vias passing through the corresponding package units and electrically connected between the corresponding first electrodes.

公开(公告)号：US09157843B2

公开(公告)日：2015-10-13

申请号：US13861390

申请日：2013-04-12

Applicant: Industrial Technology Research Institute

Inventor： Chih-Ming Shen ,  Guo-Shing Huang

IPC: G01N3/20

CPC classification number: G01N3/20 ,  G01N2203/0282 ,  G01N2203/0435

Abstract: A testing method of bending stress and a testing apparatus thereof are provided. The method includes the following steps. A stress distribution model of a structure to be tested is built. Next, a testing sample of the structure to be tested is provided, and a force is applied on two ends of the testing sample to bend the testing sample till it breaks at a breaking point, so as to obtain a first distance between the two ends of the testing sample when the testing sample breaks, or a second distance from the breaking point to a closer end of the two ends. Next, a maximum principle stress value of the stress distribution model or a break point principle stress value at the breaking point of the stress distribution model is obtained according to the first distance or the second distance.

Abstract translation: 提供了弯曲应力的测试方法及其测试装置。 该方法包括以下步骤。 建立了被测结构的应力分布模型。 接下来，提供待测试结构的测试样品，并且将力施加到测试样品的两端以弯曲测试样品，直到其在断裂点断裂，从而获得两端之间的第一距离 当测试样品断裂时，或者从断裂点到两端的较近端的第二距离。 接下来，根据第一距离或第二距离获得应力分布模型的最大主应力值或应力分布模型的断裂点处的断点主应力值。

公开(公告)号：US11239146B2

公开(公告)日：2022-02-01

申请号：US16923554

申请日：2020-07-08

Applicant: Industrial Technology Research Institute

Inventor： Chien-Min Hsu ,  Chih-Ming Shen

IPC: H01L23/498 ,  H01L23/31 ,  H01L23/00

Abstract: A package structure is provided. The package structure includes a substrate. The package structure also includes a hybrid pad disposed on the substrate. The hybrid pad includes a metal layer and a buffer layer connected to the metal layer. The Young's modulus of the buffer layer is less than the Young's modulus of the metal layer. The package structure further includes an electrically connecting structure disposed on the hybrid pad. The package structure includes a chip layer electrically connected to the electrically connecting structure. The package structure also includes a bonding pad disposed between the electrically connecting structure and the chip layer.

公开(公告)号：US10037980B2

公开(公告)日：2018-07-31

申请号：US15632392

申请日：2017-06-26

Applicant: Industrial Technology Research Institute

Inventor： Yu-Wei Huang ,  Tao-Chih Chang ,  Chih-Ming Shen

IPC: H01L25/075 ,  H01L21/68 ,  H01L21/683 ,  H01L33/62 ,  H01L33/48 ,  H01L21/48 ,  H01L33/00

CPC classification number: H01L25/0753 ,  H01L21/4853 ,  H01L21/68 ,  H01L21/6835 ,  H01L24/00 ,  H01L33/0079 ,  H01L33/483 ,  H01L33/62 ,  H01L2221/68363 ,  H01L2933/0066

Abstract: A fabricating method of a semiconductor light emitting device includes disposing a plurality of non-conductive walls on a substrate. An alignment position is formed between every two adjacent non-conductive walls. A plurality of semiconductor light emitting units on a first carrier board are respectively aligned to the alignment positions. The semiconductor light emitting units are divided into a plurality of groups. The semiconductor light emitting units in one of the groups are dissociated from the first carrier board. Thus, the semiconductor light emitting units in the group fall into the corresponding alignment positions due to gravity. Each of the semiconductor light emitting units is electrically connected with the substrate through a first electrode. A conductive layer is formed on the semiconductor light emitting units. Accordingly, the semiconductor light emitting units are electrically connected together to the conductive layer through second electrodes.

公开(公告)号：US20180022563A1

公开(公告)日：2018-01-25

申请号：US15220958

申请日：2016-07-27

Applicant: Industrial Technology Research Institute

Inventor： Ming-Kaan Liang ,  Ming-Ji Dai ,  Chin-Hung Wang ,  Chih-Ming Shen

IPC: B65H23/188 ,  B65H23/04

CPC classification number: B65H23/1888 ,  B65H23/044 ,  B65H23/192 ,  B65H27/00 ,  B65H2408/2171 ,  B65H2515/30 ,  B65H2515/31 ,  B65H2515/312 ,  B65H2553/26 ,  B65H2220/01 ,  B65H2220/02

Abstract: Provided is a roller with pressure sensor. The roller includes a pressure sensor mounted to the roller. The pressure sensor includes a plurality of pressure sensing units distributed on a thin film. The pressure sensing units are electrically connected to each other with a metal wire but not in contact with each other. Also provided is a roll-to-roll device, which includes a roller mechanism and a pressure sensor.

公开(公告)号：US09647029B2

公开(公告)日：2017-05-09

申请号：US14979533

申请日：2015-12-28

Applicant: Industrial Technology Research Institute

Inventor： Wei-Chung Lo ,  Yu-Wei Huang ,  Tao-Chih Chang ,  Chih-Ming Shen

IPC: H01L21/00 ,  H01L27/15 ,  H01L33/38 ,  H01L33/00 ,  H01L33/62

CPC classification number: H01L27/156 ,  H01L25/0753 ,  H01L33/005 ,  H01L33/38 ,  H01L33/62 ,  H01L2224/48139 ,  H01L2933/0016 ,  H01L2933/0066

Abstract: In an embodiment, a light emitting device comprises a light emitting diode chip and a spherical extending electrode. The light emitting diode chip includes a semiconductor epitaxial structure, a first electrode and a second electrode. The first electrode and the second electrode are disposed on two opposite sides of the semiconductor epitaxial structure, respectively. The first electrode is disposed between the semiconductor epitaxial structure and the spherical extending electrode, and the spherical extending electrode is electrically connected to the semiconductor epitaxial structure electrically through the first electrode. The volume of the spherical extending electrode is greater than that of the light emitting diode chip.

公开(公告)号：US20140174195A1

公开(公告)日：2014-06-26

申请号：US13861390

申请日：2013-04-12

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE

Inventor： Chih-Ming Shen ,  Guo-Shing Huang

IPC: G01N3/20

CPC classification number: G01N3/20 ,  G01N2203/0282 ,  G01N2203/0435

Abstract: A testing method of bending stress and a testing apparatus thereof are provided. The method includes the following steps. A stress distribution model of a structure to be tested is built. Next, a testing sample of the structure to be tested is provided, and a force is applied on two ends of the testing sample to bend the testing sample till it breaks at a breaking point, so as to obtain a first distance between the two ends of the testing sample when the testing sample breaks, or a second distance from the breaking point to a closer end of the two ends. Next, a maximum principle stress value of the stress distribution model or a break point principle stress value at the breaking point of the stress distribution model is obtained according to the first distance or the second distance.

Abstract translation: 提供了弯曲应力的测试方法及其测试装置。 该方法包括以下步骤。 建立了被测结构的应力分布模型。 接下来，提供待测试结构的测试样品，并且将力施加到测试样品的两端以弯曲测试样品，直到其在断裂点断裂，从而获得两端之间的第一距离 当测试样品断裂时，或者从断裂点到两端的较近端的第二距离。 接下来，根据第一距离或第二距离获得应力分布模型的最大主应力值或应力分布模型的断裂点处的断点主应力值。

公开(公告)号：US10672677B2

公开(公告)日：2020-06-02

申请号：US15979403

申请日：2018-05-14

Applicant: INDUSTRIAL TECHNOLOGY RESEARCH INSTITUTE ,  Win-House Electronic Co., Ltd.

Inventor： Jing-Yao Chang ,  Tao-Chih Chang ,  Kuo-Shu Kao ,  Fang-Jun Leu ,  Hsin-Han Lin ,  Chih-Ming Tzeng ,  Hsiao-Ming Chang ,  Chih-Ming Shen

IPC: H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/495 ,  H01L23/498 ,  H01L23/00

Abstract: A semiconductor package structure is provided. The semiconductor package structure includes a semiconductor chip, a guard ring, a gel layer, and a first lead frame. The guard ring is disposed on the semiconductor chip, and the gel layer is disposed on the guard ring. The first lead frame is electrically connected to the semiconductor chip, and the gel layer is located between the guard ring and the first lead frame.