公开(公告)号：US11646270B2

公开(公告)日：2023-05-09

申请号：US17065521

申请日：2020-10-08

Applicant: Industrial Technology Research Institute

Inventor： Ang-Ying Lin ,  Yu-Min Lin ,  Shin-Yi Huang ,  Sheng-Tsai Wu ,  Yuan-Yin Lo ,  Tzu-Hsuan Ni ,  Chao-Jung Chen

IPC: H01L23/538 ,  H01L21/48 ,  H01L23/00 ,  H01L23/31

CPC classification number: H01L23/5386 ,  H01L21/481 ,  H01L21/486 ,  H01L21/4857 ,  H01L23/5383 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/24 ,  H01L24/73 ,  H01L23/3185 ,  H01L2224/1357 ,  H01L2224/13609 ,  H01L2224/13611 ,  H01L2224/13613 ,  H01L2224/13639 ,  H01L2224/13644 ,  H01L2224/13647 ,  H01L2224/16225 ,  H01L2224/16505 ,  H01L2224/1703 ,  H01L2224/2402 ,  H01L2224/24101 ,  H01L2224/24137 ,  H01L2224/73204 ,  H01L2224/73209

Abstract: A multi-chip package and a manufacturing method thereof are provided. The multi-chip package includes: an interposer including a wiring structure and an interposer via electrically connected to the wiring structure; a plurality of semiconductor chips located on a first surface of the interposer and electrically connected to each other through the interposer; an encapsulant located on the first surface of the interposer and encapsulating at least a portion of the plurality of semiconductor chips; and a redistribution circuit structure located on a second surface of the interposer opposite to the first surface, wherein the plurality of semiconductor chips are electrically connected to the redistribution circuit structure through at least the interposer.

公开(公告)号：US20220130812A1

公开(公告)日：2022-04-28

申请号：US17568740

申请日：2022-01-05

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Tsai Wu ,  Yu-Min Lin ,  Yuan-Yin Lo ,  Ang-Ying Lin ,  Tzu-Hsuan Ni ,  Chao-Jung Chen ,  Shin-Yi Huang

IPC: H01L25/18 ,  H01L23/00 ,  H01L31/0203

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.

公开(公告)号：US11251174B2

公开(公告)日：2022-02-15

申请号：US16884051

申请日：2020-05-27

Applicant: Industrial Technology Research Institute

Inventor： Sheng-Tsai Wu ,  Yu-Min Lin ,  Yuan-Yin Lo ,  Ang-Ying Lin ,  Tzu-Hsuan Ni ,  Chao-Jung Chen ,  Shin-Yi Huang

IPC: H01L31/0203 ,  H01L25/18 ,  H01L23/00

Abstract: An image sensor package and a manufacturing method thereof are provided. The image sensor package includes a redistribution circuit structure; an image sensing chip disposed on the redistribution circuit structure and having a sensing surface, on which a sensing area and a first conductive pillar arranged in the periphery of the sensing area are disposed; a lid covering the sensing area; an encapsulant disposed on the redistribution circuit structure and encapsulating at least part of the image sensing chip and the cover; and a top tier semiconductor chip disposed above the image sensing chip and having an active surface on which a first conductor is disposed. The first conductor overlaps the image sensing chip in a direction perpendicular to the sensing surface. The first conductive pillar and the first conductor are aligned and bonded to each other to electrically connect the image sensing chip and the top tier semiconductor chip.