公开(公告)号：US20250112196A1

公开(公告)日：2025-04-03

申请号：US18478843

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Feras Eid ,  Johanna Swan ,  Adel Elsherbini ,  Thomas L. Sounart ,  Tushar Kanti Talukdar ,  Brandon M. Rawlings ,  Kimin Jun ,  Andrey Vyatskikh ,  Shawna M. Liff

IPC: H01L23/00 ,  H01L21/48 ,  H01L21/683 ,  H01L23/373 ,  H01L23/38 ,  H01L23/433 ,  H01L23/538 ,  H10N19/00

Abstract: An embodiment discloses an electronic device, comprising an integrated circuit (IC) die, a mesa structure formed on the IC die, and a die bonded to the IC die through the mesa structure.

公开(公告)号：US20250108459A1

公开(公告)日：2025-04-03

申请号：US18478770

申请日：2023-09-29

Applicant: INTEL CORPORATION

Inventor： Andrey Vyatskikh ,  Feras Eid ,  Tushar Kanti Talukdar ,  Kimin Jun ,  Thomas L. Sounart ,  Jeffery D. Bielefeld ,  Grant M. Kloster ,  Carlos Bedoya Arroyave ,  Golsa Naderi ,  Adel Elsherbini

IPC: B23K26/40 ,  B23K26/53 ,  B23K101/40 ,  B23K103/00

Abstract: An embodiment discloses a method comprising receiving a substrate comprising a first layer, a second layer over the first layer, and a third layer over the second layer, the third layer comprising a plurality of integrated circuit (IC) components, and applying a laser to ablate portions of the first layer, wherein the second layer protects the third layer from cracking during application of the laser.