公开(公告)号：US20250105046A1

公开(公告)日：2025-03-27

申请号：US18473905

申请日：2023-09-25

Applicant: Intel Corporation

Inventor： Adel Elsherbini ,  Thomas L. Sounart ,  Feras Eid ,  Tushar Kanti Talukdar ,  Brandon M. Rawlings ,  Andrey Vyatskikh ,  Carlos Bedoya Arroyave ,  Kimin Jun ,  Shawna M. Liff ,  Grant M. Kloster ,  Richard F. Vreeland ,  William P. Brezinski ,  Johanna Swan

IPC: H01L21/683 ,  H01L23/00 ,  H01L25/065

Abstract: Methods of selectively transferring portions of layers between substrates, and devices and systems formed using the same, are disclosed herein. In one embodiment, a first substrate with a layer of integrated circuit (IC) components is received, and a second substrate with one or more adhesive areas is received. The first substrate is partially bonded to the second substrate, such that a subset of IC components on the first substrate are bonded to the adhesive areas on the second substrate. The first substrate is then separated from the second substrate, and the subset of IC components bonded to the second substrate are separated from the first substrate and remain on the second substrate.

公开(公告)号：US20250112077A1

公开(公告)日：2025-04-03

申请号：US18478391

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Feras Eid ,  Andrey Vyatskikh ,  Adel Elsherbini ,  Brandon M. Rawlings ,  Tushar Kanti Talukdar ,  Thomas L. Sounart ,  Kimin Jun ,  Johanna Swan ,  Grant M. Kloster ,  Carlos Bedoya Arroyave

IPC: H01L21/683 ,  H01L23/00 ,  H01L23/538

Abstract: An embodiment discloses an electronic device comprising an integrated circuit (IC) die, a stub extending from the IC die; and a mesa structure under the IC die, wherein the IC die and the stub are bonded to the mesa structure.

公开(公告)号：US20250112067A1

公开(公告)日：2025-04-03

申请号：US18478963

申请日：2023-09-29

Applicant: Intel Corporation

Inventor： Thomas L. Sounart ,  Feras Eid ,  Tushar Kanti Talukdar ,  Adel Elsherbini ,  Carlos Bedoya Arroyave ,  Johanna Swan

IPC: H01L21/67 ,  H01L21/56 ,  H01L21/683 ,  H01L21/762

Abstract: In one embodiment, a selective transfer process includes forming a layer of integrated circuit (IC) components on a first substrate. The method also includes dispensing liquid droplets into a subset of a plurality of areas of a second substrate, where the areas of the second substrate are defined by hydrophobic lines patterned to match a layout of the IC components on the first substrate. The method further includes partially bonding the first substrate to the second substrate, where a subset of the IC components on the first substrate are bonded to the liquid droplets on the second substrate (e.g., via capillary forces), and separating the first substrate from the second substrate. When the first substrate is separated from the second substrate, the subset of IC components is separated from the first substrate and remain on the second substrate.

公开(公告)号：US20250108459A1

公开(公告)日：2025-04-03

申请号：US18478770

申请日：2023-09-29

Applicant: INTEL CORPORATION

Inventor： Andrey Vyatskikh ,  Feras Eid ,  Tushar Kanti Talukdar ,  Kimin Jun ,  Thomas L. Sounart ,  Jeffery D. Bielefeld ,  Grant M. Kloster ,  Carlos Bedoya Arroyave ,  Golsa Naderi ,  Adel Elsherbini

IPC: B23K26/40 ,  B23K26/53 ,  B23K101/40 ,  B23K103/00

Abstract: An embodiment discloses a method comprising receiving a substrate comprising a first layer, a second layer over the first layer, and a third layer over the second layer, the third layer comprising a plurality of integrated circuit (IC) components, and applying a laser to ablate portions of the first layer, wherein the second layer protects the third layer from cracking during application of the laser.