公开(公告)号：US20220397726A1

公开(公告)日：2022-12-15

申请号：US17344213

申请日：2021-06-10

Applicant: Intel Corporation

Inventor： Omkar Karhade ,  Tolga Acikalin ,  Sushrutha Gujjula ,  Kelly Lofgreen ,  Ravindranath Mahajan ,  Chia-pin Chiu

IPC: G02B6/42 ,  F21V8/00

Abstract: An electronic assembly, such as an integrated circuit package, may be formed comprising a package substrate and a photonic integrated circuit device attached thereto, wherein the package substrate includes a heat dissipation structure disposed therein. A back surface of the photonic integrated circuit device may thermally coupled to the heat dissipation structure within the package substrate for the removal of heat from the photonic integrated circuit device, which allows for access to an active surface of the photonic integrated circuit device for the attachment of fiber optic cables and eliminates the need for a heat dissipation device to be thermally attached to the active surface of the photonic integrated circuit device.

公开(公告)号：US09448278B2

公开(公告)日：2016-09-20

申请号：US14746764

申请日：2015-06-22

Applicant: INTEL CORPORATION

Inventor： Christopher R. Schroeder ,  Christopher W. Ackerman ,  James C. Shipley ,  Tolga Acikalin ,  Ioan Sauciuc ,  Michael L. Rutigliano ,  James G. Maveety ,  Ashish Gupta

IPC: G01R31/28 ,  G01R31/26 ,  G06F1/20 ,  H01L23/473 ,  H01L23/467 ,  F28F3/12

CPC classification number: G01R31/2875 ,  F28F3/12 ,  G01R31/2642 ,  G06F1/20 ,  G06F2200/201 ,  H01L23/467 ,  H01L23/473 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An apparatus to test a semiconductive device includes a base plane that holds at least one heat-transfer fluid unit cell. The at least one heat-transfer fluid unit cell includes a fluid supply structure including a supply-orifice cross section as well as a fluid return structure including a return-orifice cross section. The supply-orifice cross section is greater than the return-orifice cross section. A die interface is also included to be a liquid-impermeable material.

Abstract translation: 测试半导体装置的装置包括保持至少一个传热流体单元的基座。 至少一个传热流体单元包括包括供给孔横截面的流体供应结构以及包括回流孔横截面的流体返回结构。 供应孔横截面大于回流孔横截面。 模具界面也被包括为液体不可渗透的材料。