公开(公告)号：US10408691B2

公开(公告)日：2019-09-10

申请号：US15808518

申请日：2017-11-09

Applicant: International Business Machines Corporation

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane

IPC: G01L1/00 ,  G01L1/06 ,  G01M99/00

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

公开(公告)号：US20190107446A1

公开(公告)日：2019-04-11

申请号：US15808518

申请日：2017-11-09

Applicant: International Business Machines Corporation

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane

IPC: G01L1/06

CPC classification number: G01L1/06 ,  G01M99/007 ,  H05K2201/10151

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

公开(公告)号：US20180364692A1

公开(公告)日：2018-12-20

申请号：US15855218

申请日：2017-12-27

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane ,  Jeffrey Nettey

IPC: G05B23/00 ,  G01L5/00

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.

公开(公告)号：US20180364691A1

公开(公告)日：2018-12-20

申请号：US15842974

申请日：2017-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane ,  Jeffrey Nettey

IPC: G05B23/00 ,  G01L5/00

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.

公开(公告)号：US20180350702A1

公开(公告)日：2018-12-06

申请号：US16043712

申请日：2018-07-24

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L21/66 ,  G01K3/04

CPC classification number: H01L22/34 ,  G01K3/04 ,  H01L22/14 ,  H01L22/26

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US09818655B2

公开(公告)日：2017-11-14

申请号：US14962614

申请日：2015-12-08

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC: H01L21/00 ,  H01L21/66 ,  H01L23/522 ,  H01L21/48 ,  H01L21/54 ,  G01R31/28

CPC classification number: H01L22/14 ,  G01R31/2853 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/563 ,  H01L22/34 ,  H01L23/5222 ,  H01L23/5223 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.

公开(公告)号：US20170194221A1

公开(公告)日：2017-07-06

申请号：US14988893

申请日：2016-01-06

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC: H01L21/66 ,  G01N29/06 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

CPC classification number: H01L22/34 ,  G01N29/043 ,  G01N29/06 ,  G01N29/0681 ,  G01N2291/101 ,  G01N2291/2697 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26 ,  H01L22/30 ,  H01L23/49816 ,  H01L23/49838 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/35121

Abstract: A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.

公开(公告)号：US10957622B2

公开(公告)日：2021-03-23

申请号：US16358648

申请日：2019-03-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan R. Fry ,  Michael Rizzolo ,  Tuhin Sinha

IPC: H01L23/34 ,  H01L23/373

Abstract: A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.

公开(公告)号：US10698394B2

公开(公告)日：2020-06-30

申请号：US15842974

申请日：2017-12-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane ,  Jeffrey Nettey

IPC: G05B23/00 ,  G01L5/00 ,  G05B23/02

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.

公开(公告)号：US10545493B2

公开(公告)日：2020-01-28

申请号：US15623934

申请日：2017-06-15

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane ,  Jeffrey Nettey

IPC: G05B23/00 ,  G01L5/00

Abstract: An embodiment of the invention may include a method, computer program product and system for guided service procedure. The embodiment may include receiving feedback data from one or more of a plurality of sensors. Each of the plurality of sensors may detect a physical condition at a serviceable location within an item of equipment. The item of equipment may be undergoing a service procedure by an equipment servicer. The embodiment may include determining whether the received feedback data from one or more of the plurality of sensors exceeds a threshold value. Based on determining that the threshold value is exceeded, the embodiment may include alerting the equipment servicer during the service procedure.