公开(公告)号：US10859453B2

公开(公告)日：2020-12-08

申请号：US16202285

申请日：2018-11-28

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan R. Fry ,  Jonathan D. Bradbury ,  Michael R. Kane

IPC: G01L1/24 ,  G01L5/00 ,  G01L5/24

Abstract: Mechanical integrity sensors are provided to detect occurrence of an out-of-tolerance force on a component, such as a circuit board. The mechanical integrity sensor includes a light-blocking container and a light collector disposed within the light-blocking container. The light-blocking container includes a breakable panel. The breakable panel fractures with a force on the breakable panel indicative of the out-of-tolerance force on the component. Fracturing of the breakable panel allows light into the light-blocking container, and the light is collected by the light collector as indicative of the occurrence of the out-of-tolerance force on the component.

公开(公告)号：US10533919B2

公开(公告)日：2020-01-14

申请号：US15809064

申请日：2017-11-10

Applicant: International Business Machines Corporation

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane

IPC: G01M5/00 ,  G01B7/16 ,  H05K1/02 ,  G01L1/06 ,  G01R31/28

Abstract: An electro-mechanical fuse is provided and includes a chassis component, an extrusion disposed on a monitored component which is disposable proximate to the chassis component and a sensor. The sensor is mounted to the chassis component. The sensor is mechanically breakable in power-on and power-off conditions by the extrusion as a result of a predefined action of or relative to the monitored component. The sensor electrically signals an occurrence of the mechanical breakage during power-on conditions following mechanical breakage.

公开(公告)号：US20190316976A1

公开(公告)日：2019-10-17

申请号：US16454564

申请日：2019-06-27

Applicant: International Business Machines Corporation

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane

IPC: G01L1/06

Abstract: Embodiments of the invention include a fracture ring sensor and a method of using the same to detect out of tolerance forces. Aspects of the invention include a product having a defined an out of tolerance force, a fracture ring sensor, and a mounting assembly coupling the fracture ring sensor to the product. The fracture ring sensor is patterned with a conductive trace and is manufactured to break when subjected to a predetermined amount of force. The predetermined amount of force is substantially equal to a percentage of the out of tolerance force of the product.

公开(公告)号：US20200303282A1

公开(公告)日：2020-09-24

申请号：US16358648

申请日：2019-03-19

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan R. Fry ,  Michael Rizzolo ,  Tuhin Sinha

IPC: H01L23/373

Abstract: A semiconductor device that includes a semiconductor substrate having a surface, the surface having several regions having different thermal and/or mechanical requirements; and a composite thermal interface material including several spatially localized thermal interface materials placed on the surface, each of the several thermal interface materials tailored to the different thermal and/or mechanical requirements of each of the regions. Also disclosed is a method of forming the composite thermal interface material.

公开(公告)号：US10713111B2

公开(公告)日：2020-07-14

申请号：US15825576

申请日：2017-11-29

Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION

Inventor： Jonathan D. Bradbury ,  Jonathan R. Fry ,  Michael R. Kane ,  Jeffrey Nettey

IPC: G06F11/00 ,  G06F11/07 ,  G06F11/14

Abstract: A method includes initiating a power on sequence of a computer equipment including a plurality of sensors at a serviceable location within a component of the computer equipment, the plurality of sensors communicating with a sensor monitor coupled with an interlock mechanism, and a service console capable of communicating with the sensor monitor, receiving feedback data from the plurality of sensors during the power on sequence, each of the plurality of sensors is detecting a physical condition at the serviceable location, determining whether the feedback data exceeds a predefined threshold value, the feedback data exceeding the predefined threshold value is associated with a fault at a serviceable location, in response to the feedback data exceeding the predefined threshold value, logging the fault at the serviceable location, aborting the power on sequence of the equipment, and prompting an equipment servicer of the fault at the serviceable location.

公开(公告)号：US10553503B2

公开(公告)日：2020-02-04

申请号：US15722459

申请日：2017-10-02

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC: H01L21/66 ,  H01L23/522 ,  H01L21/48 ,  H01L21/54 ,  G01R31/28 ,  H01L21/56

Abstract: Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.

公开(公告)号：US20180226308A1

公开(公告)日：2018-08-09

申请号：US15949225

申请日：2018-04-10

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: H01L21/66 ,  G01K3/04

CPC classification number: H01L22/34 ,  G01K3/04 ,  H01L22/14 ,  H01L22/26

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US10032683B2

公开(公告)日：2018-07-24

申请号：US14741086

申请日：2015-06-16

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Terence L. Kane ,  Christopher F. Klabes ,  Andrew J. Martin ,  Vincent J. McGahay ,  Kathryn E. Schlichting ,  Melissa A. Smith

IPC: G01K3/04 ,  G01K7/01 ,  H01L21/66

Abstract: A time temperature monitoring system and method for use with a microchip or similar structure. A disclosed system includes: a substrate having an active region; a dopant source located proximate the active region; an activation system for activating a diffusion of the dopant source into the active region; and a set of spatially distributed electrodes embedded in the active region of the substrate, wherein the electrodes are configured to detect the diffusion in the active region at varying distances from the dopant source to provide time temperature information.

公开(公告)号：US10008427B2

公开(公告)日：2018-06-26

申请号：US15615148

申请日：2017-06-06

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC: H01L23/58 ,  H01L21/66 ,  H01L21/56 ,  H01L21/48 ,  G01N29/06 ,  H01L23/498

CPC classification number: H01L22/34 ,  G01N29/043 ,  G01N29/06 ,  G01N29/0681 ,  G01N2291/101 ,  G01N2291/2697 ,  H01L21/4853 ,  H01L21/563 ,  H01L22/12 ,  H01L22/20 ,  H01L22/26 ,  H01L22/30 ,  H01L23/10 ,  H01L23/13 ,  H01L23/49816 ,  H01L23/49838 ,  H01L23/50 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92125 ,  H01L2225/06596 ,  H01L2924/10253 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/1579 ,  H01L2924/16251 ,  H01L2924/19041 ,  H01L2924/19106 ,  H01L2924/35121

Abstract: A method includes forming a flip-chip module including a chip connected to a substrate with a layer of underfill material adhered to the chip and the substrate; sensing chip-packaging interaction failure in the underfilled flip-chip module in situ; reporting in-situ chip-packaging interaction failure to a device in real-time; and imaging the chip-packaging interaction failure with an indirect scanning acoustic microscope.

公开(公告)号：US20170162455A1

公开(公告)日：2017-06-08

申请号：US14962614

申请日：2015-12-08

Applicant: International Business Machines Corporation

Inventor： Taryn J. Davis ,  Jonathan R. Fry ,  Tuhin Sinha

IPC: H01L21/66 ,  G01R31/28 ,  H01L21/54 ,  H01L23/522 ,  H01L21/48

CPC classification number: H01L22/14 ,  G01R31/2853 ,  H01L21/4853 ,  H01L21/54 ,  H01L21/563 ,  H01L22/34 ,  H01L23/5222 ,  H01L23/5223 ,  H01L2224/16145 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/00

Abstract: Flip-chip package reliability monitoring and systems of monitoring using capacitive sensors are disclosed. The monitoring is conducted in situ and in real-time without the need for destructive testing of the packages. The capacitive sensors can be used for flip-chip package reliability monitoring.