公开(公告)号：US11306959B2

公开(公告)日：2022-04-19

申请号：US14534957

申请日：2014-11-06

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25D17/02 ,  F25B25/00 ,  F25B1/00

Abstract: A cooling system is provided including a first evaporator coil in thermal communication with an air intake flow to a heat load, a first liquid refrigerant distribution unit in fluid communication with the first evaporator coil to form a first fluid circuit, a second evaporator coil disposed in series with the first evaporator coil in the air intake flow and in the thermal communication with the air intake flow to the heat load, a second liquid refrigerant distribution unit in fluid communication with the second evaporator coil to form a second fluid circuit, a water loop in thermal communication with the first fluid circuit and second fluid circuit, and a chiller loop in thermal communication with the water loop.

公开(公告)号：US10739042B2

公开(公告)日：2020-08-11

申请号：US15479588

申请日：2017-04-05

Applicant: Inertech IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B7/00 ,  F25B25/00 ,  H05K7/20 ,  F25B41/04 ,  F25B49/02

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

公开(公告)号：US20200229323A1

公开(公告)日：2020-07-16

申请号：US16741493

申请日：2020-01-13

Applicant: Inertech IP LLC

Inventor： John Costakis ,  Ken Nguyen ,  Ming Zhang ,  Doron Shapiro

IPC: H05K7/20

Abstract: Modular air cooling and distribution systems include a fan and heat exchanger cooling assembly and a controller which controls the fan speed based on temperature and velocity measurements. The cooling assembly includes a fluid-to-air heat exchanger and a variable speed fan. The fluid in the fluid-to-air heat exchanger may be propylene glycol or water. The heat exchanger minimizes pressure drop and maximizes heat transfer. The quantity of cooling assemblies is selected to match the indoor cooling requirements. The cooling assemblies are easily assembled together, stacked vertically, and/or connected horizontally, to match the cooling load. If additional cooling capacity is needed in the future, more cooling assemblies can easily be added, and the cooling assemblies may be expanded vertically and/or horizontally. The speed of the fans of the fan and heat exchanger assemblies are controlled based on fluid temperature and fluid velocity measurements, which may be obtained by an anemometer.

公开(公告)号：US20170268792A1

公开(公告)日：2017-09-21

申请号：US15398512

申请日：2017-01-04

Applicant: INERTECH IP LLC

Inventor： John Costakis ,  Ming Zhang ,  Earl Keisling ,  Ken Nguyen

IPC: F24F5/00 ,  F24F11/00

CPC classification number: F24F5/0007 ,  F24F5/0003 ,  F24F5/001 ,  F24F5/0035 ,  F24F11/46 ,  F24F11/83 ,  F24F2013/225 ,  F24F2110/12 ,  F24F2140/50 ,  F25B23/006 ,  F25B25/00 ,  F25B25/005 ,  F25B2339/041 ,  F25B2339/047 ,  F25B2700/197 ,  F25B2700/21163 ,  F28C2001/006 ,  Y02B30/542

Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

公开(公告)号：US20150192345A1

公开(公告)日：2015-07-09

申请号：US14534957

申请日：2014-11-06

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25D17/02 ,  F25B1/00

CPC classification number: F25D17/02 ,  F25B1/00 ,  F25B1/005 ,  F25B25/005 ,  F25B2339/047

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。

公开(公告)号：US20150176865A1

公开(公告)日：2015-06-25

申请号：US14520322

申请日：2014-10-21

Applicant: Inertech IP LLC

Inventor： Gerald McDonnell ,  Ming Zhang ,  John Costakis ,  Earl Keisling

IPC: F25B5/02 ,  F25B31/00 ,  F25B6/02

CPC classification number: F25B29/003 ,  F25B2339/047 ,  H05K7/20827

Abstract: The cooling systems and methods of the present disclosure relate to cooling electronic equipment in data centers or any other applications that have high heat rejection temperature and high sensible heat ratio.

Abstract translation: 本公开的冷却系统和方法涉及在数据中心中冷却电子设备或具有高散热温度和高显热比的任何其它应用。

公开(公告)号：US12146691B2

公开(公告)日：2024-11-19

申请号：US18097055

申请日：2023-01-13

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B25/00 ,  F25B7/00 ,  F25B49/02 ,  H05K7/20

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.

公开(公告)号：US20240247818A1

公开(公告)日：2024-07-25

申请号：US18407422

申请日：2024-01-08

Applicant: Inertech IP LLC

Inventor： John Costakis ,  Ming Zhang ,  Earl Keisling ,  Ken Nguyen

IPC: F24F5/00 ,  F24F11/46 ,  F24F11/83 ,  F24F11/84 ,  F24F11/85 ,  F24F13/22 ,  F24F110/12 ,  F24F140/50 ,  F25B23/00 ,  F25B25/00 ,  F28C1/00

CPC classification number: F24F5/0007 ,  F24F5/0003 ,  F24F5/001 ,  F24F5/0035 ,  F24F11/83 ,  F24F11/84 ,  F24F11/85 ,  F25B23/006 ,  F25B25/00 ,  F25B25/005 ,  F24F11/46 ,  F24F2013/225 ,  F24F2110/12 ,  F24F2140/50 ,  F25B2339/041 ,  F25B2339/047 ,  F25B2700/197 ,  F25B2700/21163 ,  F28C2001/006 ,  Y02B30/54

Abstract: The cooling systems and methods of the present disclosure involve modular fluid coolers and chillers configured for optimal power and water use based on environmental conditions and client requirements. The fluid coolers include wet media, a first fluid circuit for distributing fluid across wet media, an air to fluid heat exchanger, and an air to refrigerant heat exchanger. The chillers, which are fluidly coupled to the fluid coolers via pipe cages, include a second fluid circuit in fluid communication with the air to fluid heat exchanger and a refrigerant circuit in thermal communication with the second fluid circuit and in fluid communication with the air to refrigerant heat exchanger. Pipe cages are coupled together to allow for expansion of the cooling system when additional cooling capacity is needed. The fluid coolers and chillers are configured to selectively operate in wet or dry free cooling mode, partial free cooling mode, or mechanical cooling mode.

公开(公告)号：US11940227B2

公开(公告)日：2024-03-26

申请号：US17856654

申请日：2022-07-01

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  Ken Nguyen ,  Doron Shapiro ,  John Costakis

IPC: F28D7/00 ,  B23K1/00 ,  B23P15/26 ,  F28D1/047 ,  F28D1/053 ,  F28F1/02 ,  F28F1/12 ,  F28F9/013 ,  F28F9/02 ,  F28F21/08 ,  G06F1/20 ,  H05K7/20

CPC classification number: F28D7/0066 ,  B23K1/0012 ,  B23P15/26 ,  F28D1/0478 ,  F28D1/05391 ,  F28F1/022 ,  F28F1/12 ,  F28F1/128 ,  F28F9/013 ,  F28F9/02 ,  F28F21/084 ,  G06F1/20 ,  H05K7/20654 ,  H05K7/2079 ,  F28F2225/08 ,  F28F2275/04 ,  G06F2200/201

Abstract: A cooling system includes a heat exchanger having one or more rows of multiple flat tubes, louvered fins disposed between pairs of flat tubes, and special header tube connections to form a counter flow heat exchanger. Heat exchangers having multiple rows may be placed near or close to the server racks and may be in fluid communication with an outdoor heat exchanger having one or more rows. A single-phase fluid is pumped through a fluid circuit or loop, which includes the heat exchangers at the server racks and the outdoor heat exchanger. The single-phase fluid circuit including the heat exchangers at the IT racks may alternatively be in thermal communication with a water circuit that includes an outdoor fluid cooler. The flat tubes can be formed tubes with one or more channels, or extruded tubes with multiple channels. The heat exchangers include header tubes/connections, which facilitate easy fabrication and connection between rows and inlet/outlet, and lower the pressure drop.

公开(公告)号：US20230221046A1

公开(公告)日：2023-07-13

申请号：US18097055

申请日：2023-01-13

Applicant: INERTECH IP LLC

Inventor： Ming Zhang ,  John Costakis

IPC: F25B25/00 ,  F25B49/02 ,  H05K7/20 ,  F25B7/00

CPC classification number: F25B25/005 ,  F25B49/02 ,  H05K7/20827 ,  F25B7/00 ,  F25B2500/18

Abstract: The cooling systems of the present disclosure include a first refrigerant circuit in thermal communication with a heat load and in fluid communication with a main condenser, a free cooling circuit in fluid communication with the main condenser and a free-cooled water source, a chilled water circuit in fluid communication with the main condenser and an evaporator, and a second refrigerant circuit in fluid communication with the evaporator and a secondary condenser. The free cooling circuit is in thermal communication with the first refrigerant circuit via the main condenser, the chilled water circuit is in thermal communication with the first refrigerant circuit via the main condenser, and the second refrigeration circuit is in thermal communication with the chilled water circuit and the free cooling circuit. The second refrigeration circuit cools a fluid flowing in the chilled water circuit. Methods of operating a cooling system are also disclosed.