公开(公告)号：US20210050227A1

公开(公告)日：2021-02-18

申请号：US16993867

申请日：2020-08-14

Applicant: Infineon Technologies AG

Inventor： Pei Luan Pok ,  Roslie Saini bin Bakar ,  Chau Fatt Chiang ,  Chee Hong Lee ,  Swee Kah Lee ,  Yu Shien Leong ,  Jan Sing Loh ,  Yean Seng Ng

IPC: H01L21/56 ,  H01L23/29 ,  H01L23/31

Abstract: A method for fabricating an electronic device includes providing an encapsulant having an encapsulation material, providing a first laser beam and forming a trench into a main surface of the encapsulant by removing the encapsulation material by means of the first laser beam, forming a mask along a portion above the edge of the trench, and providing a second laser beam and sweeping the second laser beam over a surface area of the main surface of the encapsulant, wherein the surface area covers at least an area spatially confined by the trench.

公开(公告)号：US20210025774A1

公开(公告)日：2021-01-28

申请号：US16890461

申请日：2020-06-02

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  Paul Armand Asentista Calo ,  Chan Lam Cha ,  Kok Yau Chua ,  Jo Ean Chye ,  Chee Hong Lee ,  Swee Kah Lee ,  Theng Chao Long ,  Jayaganasan Narayanasamy ,  Khay Chwan Saw

IPC: G01L9/00 ,  G01L19/14

Abstract: A pressure sensor includes a lidless structure defining an internal chamber for a sealed environment and presenting an aperture; a chip including a membrane deformable on the basis of external pressure, the chip being mounted outside the lidless structure in correspondence to the aperture so that the membrane closes the sealed environment; and a circuitry configured to provide a pressure measurement information based on the deformation of the membrane.

公开(公告)号：US20190181120A1

公开(公告)日：2019-06-13

申请号：US16213478

申请日：2018-12-07

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  April Coleen Tuazon Bernardez ,  Junny Abdul Wahid ,  Roslie Saini bin Bakar ,  Kon Hoe Chin ,  Hock Heng Chong ,  Kok Yau Chua ,  Hsieh Ting Kuek ,  Chee Hong Lee ,  Soon Lee Liew ,  Nurfarena Othman ,  Pei Luan Pok ,  Werner Reiss ,  Stefan Schmalzl

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.