公开(公告)号：US20190181120A1

公开(公告)日：2019-06-13

申请号：US16213478

申请日：2018-12-07

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  April Coleen Tuazon Bernardez ,  Junny Abdul Wahid ,  Roslie Saini bin Bakar ,  Kon Hoe Chin ,  Hock Heng Chong ,  Kok Yau Chua ,  Hsieh Ting Kuek ,  Chee Hong Lee ,  Soon Lee Liew ,  Nurfarena Othman ,  Pei Luan Pok ,  Werner Reiss ,  Stefan Schmalzl

IPC: H01L25/065 ,  H01L23/31 ,  H01L23/498 ,  H01L23/10

Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

公开(公告)号：US10777536B2

公开(公告)日：2020-09-15

申请号：US16213478

申请日：2018-12-07

Applicant: Infineon Technologies AG

Inventor： Chau Fatt Chiang ,  April Coleen Tuazon Bernardez ,  Junny Abdul Wahid ,  Roslie Saini bin Bakar ,  Kon Hoe Chin ,  Hock Heng Chong ,  Kok Yau Chua ,  Hsieh Ting Kuek ,  Chee Hong Lee ,  Soon Lee Liew ,  Nurfarena Othman ,  Pei Luan Pok ,  Werner Reiss ,  Stefan Schmalzl

IPC: H01L25/075 ,  H01L25/065 ,  H01L23/498 ,  B81B7/00 ,  H01L23/31 ,  B81C1/00 ,  H01L23/10

Abstract: Embodiments of chip-package and corresponding methods of manufacture are provided. In an embodiment of a chip-package, the chip-package includes: a carrier having a first side and a second side opposing the first side; a first chip coupled to the first side of the carrier; a second chip coupled to the second side of the carrier; an encapsulation with a first portion, which at least partially encloses the first chip on the first side of the carrier, and a second portion, which at least partially encloses the second chip on the second side of the carrier; a via extending through the first portion of the encapsulation, the carrier and the second portion of the encapsulation; and an electrically conductive material at least partly covering a sidewall of the via in the first portion or the second portion of the encapsulation, to electrically contact the carrier at either side.

公开(公告)号：US20160365296A1

公开(公告)日：2016-12-15

申请号：US15176952

申请日：2016-06-08

Applicant: Infineon Technologies AG

Inventor： Ralf Otremba ,  Edward Fuergut ,  Christian Kasztelan ,  Hsieh Ting Kuek ,  Teck Sim Lee ,  Sanjay Kumar Murugan ,  Lee Shuang Wang

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/48 ,  H01L23/495 ,  H01L23/29

CPC classification number: H01L23/3114 ,  H01L21/4825 ,  H01L21/565 ,  H01L23/293 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/36 ,  H01L23/49503 ,  H01L23/4952 ,  H01L23/49541 ,  H01L23/49555 ,  H01L23/49562 ,  H01L23/49568 ,  H01L24/05 ,  H01L24/48 ,  H01L24/49 ,  H01L2224/04042 ,  H01L2224/05553 ,  H01L2224/05554 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/48257 ,  H01L2224/49109 ,  H01L2224/49111 ,  H01L2924/00014 ,  H01L2924/10253 ,  H01L2924/10271 ,  H01L2924/10272 ,  H01L2924/10329 ,  H01L2924/1033 ,  H01L2924/13055 ,  H01L2924/13062 ,  H01L2924/13064 ,  H01L2924/13091 ,  H01L2924/14 ,  H01L2924/1434 ,  H01L2924/1461 ,  H01L2924/181 ,  H01L2924/1815 ,  H01L2224/45099 ,  H01L2224/05599 ,  H01L2924/00012

Abstract: A device includes an encapsulation material and a first lead and a second lead protruding out of a surface of the encapsulation material. A recess extends into the surface of the encapsulation material. An elevation is arranged on the surface of the encapsulation material. The first lead protrudes out of the elevation.

Abstract translation: 一种装置包括封装材料和从包封材料的表面突出的第一引线和第二引线。 凹部延伸到封装材料的表面。 在封装材料的表面上布置有高度。 第一个引线突出了海拔高度。