公开(公告)号：US08981545B2

公开(公告)日：2015-03-17

申请号：US13932531

申请日：2013-07-01

Applicant: Infineon Technologies AG

Inventor： Olaf Hohlfeld ,  Guido Boenig ,  Uwe Jansen

IPC: H01L23/16 ,  H01L23/24 ,  H01L23/00 ,  H01L25/18 ,  H01L23/29

CPC classification number: H01L23/24 ,  H01L23/291 ,  H01L23/58 ,  H01L24/42 ,  H01L24/45 ,  H01L24/48 ,  H01L24/49 ,  H01L24/83 ,  H01L24/85 ,  H01L25/18 ,  H01L2224/0603 ,  H01L2224/45015 ,  H01L2224/45124 ,  H01L2224/45139 ,  H01L2224/45147 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48139 ,  H01L2224/4846 ,  H01L2224/48472 ,  H01L2224/49 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8384 ,  H01L2224/85205 ,  H01L2224/8592 ,  H01L2224/92247 ,  H01L2924/00014 ,  H01L2924/1301 ,  H01L2924/1305 ,  H01L2924/13055 ,  H01L2924/1306 ,  H01L2924/13062 ,  H01L2924/13091 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/85399 ,  H01L2224/05599

Abstract: A semiconductor module includes an electrically conductive lower contact piece and an electrically conductive upper contact piece spaced apart from one another in a vertical direction. The module further includes a semiconductor chip having a first load connection and a second load connection. The semiconductor chip is electrically conductively connected by the second load connection to the lower contact piece, and electrically conductively connected to the upper contact piece by at least one bonding wire bonded to the first load connection. An explosion protection means is arranged between the first load connection and the upper contact piece and into which each of the bonding wires is embedded over at least 80% or over at least 90% of its length.

Abstract translation: 半导体模块包括导电下接触片和在垂直方向上彼此间隔开的导电上接触片。 该模块还包括具有第一负载连接和第二负载连接的半导体芯片。 半导体芯片通过第二负载连接导电连接到下接触片，并且通过至少一个接合到第一负载连接的接合线而导电地连接到上接触片。 防爆装置设置在第一负载连接件和上接触片之间，每个接合线在其长度至少80％或以上至少80％的范围内被嵌入其中。