Abstract:
Embodiments include apparatuses, methods, and systems for computing. A computing apparatus may include a first computing part and a second computing part. The first computing part and the second computing part may be attached to a spine assembly. The first computing part may include a first electronic interface and a first mechanical attachment coupler to be coupled to the spine assembly, while the second computing part may include a second electronic interface and a second mechanical attachment coupler to be coupled to the spine assembly. The first computing part or the second computing part may rotate around a rotation hinge of the spine assembly from a first position to a second position. Other embodiments may also be described and claimed.
Abstract:
Particular embodiments described herein provide for device that includes a first housing that includes a first module, a second housing that includes a second module, and a hinge that rotatable couples the first housing to the second housing. The hinge can include a first axle, a second axle, and a plurality of hinge links. At least one of the hinge links includes an interconnect to provide a communication path between the first module and the second module.
Abstract:
A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in electronic devices with various system platforms are disclosed. An example embodiment includes: a substrate; and a plurality of wickless capillary driven constrained vapor bubble heat pipes embedded in the substrate, each wickless capillary driven constrained vapor bubble heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between an evaporator region and a condenser region.
Abstract:
A system and method for providing and using wickless capillary driven constrained vapor bubble heat pipes for application in rack servers are disclosed. An example embodiment includes: a base structure; and a rack column supported by the base structure, the rack column in thermal coupling with a heat-generating device, the rack column containing a constrained vapor bubble (CVB) cell cluster including a plurality of cells in thermal coupling with the heat-generating device at a first end in an evaporator region and in thermal coupling with the base structure at a second end in a condenser region, each cell of the plurality of cells having a wickless capillary driven CVB heat pipe embedded in the cell, each wickless capillary driven CVB heat pipe including a body having a capillary therein with generally square corners and a high energy interior surface, and a highly wettable liquid partially filling the capillary to dissipate heat between the evaporator region and the condenser region.
Abstract:
An adaptor may include a base modular unit that includes a plurality of surface connectors, a first port and circuitry. At least one surface connector may couple to an expansion modular unit. Circuitry or logic may provide information from the first port to the at least one surface connector.
Abstract:
FIG. 1 is a perspective view of a computer notebook, showing our new design; FIG. 2 is a top view of the computer notebook in FIG. 1; FIG. 3 is a bottom view of the computer notebook in FIG. 1; FIG. 4 is a front view of the computer notebook in FIG. 1; FIG. 5 is a back view of the computer notebook in FIG. 1; FIG. 6 is a side view of the computer notebook in FIG. 1; and, FIG. 7 is another side view of the computer notebook in FIG. 1. The broken lines shown in the drawings illustrate portions of the computer notebook that form no part of the claimed design.
Abstract:
Various embodiments relate to an electronic device with a first panel and a second panel coupled by a hinge mechanism. The electronic device may include a first wire that communicatively couples components of the first panel with components of the second panel. The wire may pass through the hinge mechanism, and be tensioned by a tensioning mechanism that provides tension to the first wire when the electronic device is in an open position and a closed position. Other embodiments may be described and/or claimed.
Abstract:
Techniques for overlay components for compute devices are disclosed. In one embodiment, an overlay component on a base portion of a compute device can be moved from a folded or closed position (in which it does not cover the keyboard) to an unfolded or open position (in which it covers part of the keyboard). The base portion includes a touch sensor that allows the overlay component to be used as a touch surface. In another embodiment, an overlay component of a compute device is movable from one position adjacent a display of the compute device to another position adjacent a base of the compute device. The overlay component is electrically switchable from a transparent state to an opaque state, allowing the display to be seen through it in one position and allowing it to be used as an opaque drawing surface in another position.
Abstract:
An electronic device having at least one expandable speaker box is provided. The electronic device may include a base having at least one speaker disposed therein and at least one speaker box configured to expand. The electronic device may include further include a lid having a display configured to be attached to the base. The at least one speaker box may be at least partially formed of a compressible-expandable material, such as rubber. Alternatively, the at least one speaker box may be at least partially formed of a bi-metal material that expands when exposed to heat.