DISPLAY DEVICE
    12.
    发明申请
    DISPLAY DEVICE 审中-公开

    公开(公告)号:US20190074298A1

    公开(公告)日:2019-03-07

    申请号:US16109175

    申请日:2018-08-22

    Inventor: Tatsuya TODA

    Abstract: The purpose of the present invention is to avoid an inflection point in Vg-Id characteristics of the Thin Film transistor, and to avoid step disconnection of the insulating film formed on the semiconductor layer in the display device. The concrete structure of the present invention is: a display device including a TFT substrate having a thin film transistor (TFT) comprising; the TFT having a channel width and a channel length, a gate insulating film formed on a gate electrode, a semiconductor layer formed on the gate insulating film, wherein the gate electrode, near its edge, has a first sloping surface having a first taper angle in a cross sectional view along the direction of the channel width, an edge of the semiconductor layer in the cross sectional view along the direction of the channel width lies on the first sloping surface of the gate electrode.

    SEMICONDUCTOR DEVICE
    15.
    发明公开

    公开(公告)号:US20230187558A1

    公开(公告)日:2023-06-15

    申请号:US18163045

    申请日:2023-02-01

    CPC classification number: H01L29/7869 H01L29/41733

    Abstract: A semiconductor device includes a gate electrode on a substrate, a gate insulating film on the gate electrode, an oxide semiconductor film via the gate insulating film on the gate electrode, a source electrode and a drain electrode on the oxide semiconductor film, a protective film provided on the source electrode and the drain electrode; and a conductive layer provided on the protective film and overlapped on the oxide semiconductor layer. The protective film includes a first silicon oxide film and a first silicon nitride film. The first oxide film is in contact with the oxide semiconductor layer. The gate insulating film includes a second silicon nitride film and a second silicon oxide film. The second silicon oxide film is in contact with the oxide semiconductor layer. The oxide semiconductor layer has a first region located between the source electrode and the drain electrode in a plan view.

    SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD OF SEMICONDUCTOR DEVICE

    公开(公告)号:US20210119055A1

    公开(公告)日:2021-04-22

    申请号:US17036298

    申请日:2020-09-29

    Abstract: A semiconductor device comprising: an oxide semiconductor layer including indium; a gate electrode facing to the oxide semiconductor layer; a gate insulating layer between the oxide semiconductor layer and the gate electrode; a first conductive layer arranged above the oxide semiconductor layer and being in contact with the oxide semiconductor layer from above the oxide semiconductor layer; an oxide portion formed on the oxide semiconductor layer and at an edge of the first conductive layer, the oxide portion being a oxide of the first conductive layer.

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