公开(公告)号：US20100148348A1

公开(公告)日：2010-06-17

申请号：US12480291

申请日：2009-06-08

申请人： Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

发明人： Jae-Joon LEE ,  Jin-Yong An ,  Ki-Hwan Kim ,  Seok-Kyu Lee

IPC分类号： H01L23/498

CPC分类号： H01L23/49822 ,  H01L23/49894 ,  H01L2224/16 ,  H01L2224/16235 ,  H01L2924/01078 ,  H01L2924/15174 ,  H05K1/0271 ,  H05K3/3452 ,  H05K3/4682 ,  H05K2201/0191 ,  H05K2201/09972 ,  H05K2203/1572

摘要： A package substrate is disclosed. The package substrate as a printed circuit board, in which a semiconductor chip is mounted on one side thereof and the other side thereof is mounted on a main board, can include a substrate part, a first pad, which is formed on one side of the substrate part such that the first pad is electrically connected to the semiconductor chip, and a first solder resist layer, which is formed on one surface of the substrate part such that the first pad is exposed. Here, the first solder resist layer is divided into a pad portion and a dummy portion, the first pad is exposed in the pad portion, and the dummy portion is thinner than the pad portion. The package substrate can contribute to the formation of a structure in which thermal expansion coefficients are symmetrical between the top and bottom, thus preventing the warpage.

摘要翻译： 公开了封装衬底。 作为印刷电路板的封装基板，其中半导体芯片安装在其一侧并且另一侧安装在主板上，可以包括基板部分，第一焊盘，其形成在主体的一侧上 基板部分，使得第一焊盘电连接到半导体芯片;以及第一阻焊层，其形成在基板部分的一个表面上，使得第一焊盘露出。 这里，第一阻焊层被分成焊盘部分和虚设部分，第一焊盘暴露在焊盘部分中，并且虚设部分比焊盘部分薄。 封装基板有助于形成热膨胀系数在顶部和底部之间对称的结构，从而防止翘曲。

公开(公告)号：US20100126765A1

公开(公告)日：2010-05-27

申请号：US12569104

申请日：2009-09-29

申请人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

发明人： Ki-Hwan KIM ,  Jin-Yong An ,  Jae-Joon Lee

IPC分类号： H05K1/11 ,  B32B38/00 ,  B32B38/10 ,  C23F1/00

CPC分类号： H05K3/4007 ,  H05K3/205 ,  H05K3/4682 ,  H05K2201/0367 ,  H05K2201/09481 ,  H05K2203/054 ,  Y10T156/1168

摘要： A method of manufacturing a multi-layer PCB having external contact pads formed on one side can include: forming an outermost insulation layer, in which openings are formed corresponding with the external contact pads; forming a mask, in which openings are formed corresponding with the external contact pad and with a circuit pattern, on the outermost insulation layer; forming the external contact pads and the circuit pattern in the openings of the outermost insulation layer and the openings of the mask; removing the mask; forming a build-up layer by stacking layers over the outermost insulation layer such that the external contact pads and the circuit pattern are covered; forming a first solder resist layer on the build-up layer; and forming a second solder resist layer on an opposite side of the outermost insulation layer; and forming openings in the second solder resist layer such that the external contact pads are exposed.

摘要翻译： 一种制造具有形成在一侧上的外部接触焊盘的多层PCB的方法可以包括：形成最外绝缘层，其中形成对应于外部接触焊盘的开口; 形成掩模，其中在最外绝缘层上形成对应于外部接触焊盘和电路图案的开口; 在外绝缘层的开口和掩模的开口中形成外部接触焊盘和电路图案; 去除面膜; 通过在最外层绝缘层上层叠层来形成堆积层，使得覆盖外部接触焊盘和电路图案; 在积层上形成第一阻焊层; 以及在最外绝缘层的相对侧上形成第二阻焊层; 以及在所述第二阻焊层中形成开口，使得所述外部接触焊盘露出。