-
公开(公告)号:US06333212B1
公开(公告)日:2001-12-25
申请号:US09707850
申请日:2000-11-08
IPC分类号: H01L2144
CPC分类号: H01L23/3121 , H01L23/49531 , H01L23/49838 , H01L24/45 , H01L24/48 , H01L2224/45099 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/73265 , H01L2924/00014 , H01L2924/01079 , H01L2924/15153 , H01L2924/15165 , H01L2924/15787 , H01L2924/1579 , H01L2924/181 , H01L2924/00012 , H01L2224/45015 , H01L2924/207
摘要: A semiconductor device with a thickness of 1 mm or less is disclosed, that comprises a frame plate main body with a thickness in the range from 0.1 mm to 0.25 mm, a semiconductor pellet disposed on a first surface of the frame plate main body and with a thickness in the range from 0.2 mm to 0.3 mm, an external connection lead, one end thereof being connected to a peripheral portion of the first surface of the frame plate main body, the other end thereof extending to the outside of the frame plate main body, a bonding wire for electrically connecting an electrode of the semiconductor pellet and a connection portion of the end of the external connection lead, and a sealing resin layer for covering and sealing at least a region including the semiconductor pellet, the bonding wire, and a connection portion.
摘要翻译: 公开了一种厚度为1mm以下的半导体器件,其包括厚度为0.1mm至0.25mm的框架板主体,设置在框架板主体的第一表面上并具有 厚度在0.2mm至0.3mm的范围内,外部连接引线,其一端连接到框架板主体的第一表面的周边部分,其另一端延伸到框架主体的外部 电连接半导体芯片的电极和外部连接引线的端部的连接部分的接合线,以及用于覆盖和密封至少包括半导体芯片,接合线和 连接部分。
-
公开(公告)号:US06054774A
公开(公告)日:2000-04-25
申请号:US890633
申请日:1997-07-09
申请人: Jun Ohmori , Hiroshi Iwasaki
发明人: Jun Ohmori , Hiroshi Iwasaki
IPC分类号: H01L23/12 , G06K19/077 , H01L23/31 , H01L23/498 , H01L29/41
CPC分类号: H01L23/49855 , G06K19/07743 , H01L23/3121 , H01L23/49838 , H01L2224/16 , H01L2224/48227 , H01L24/48 , H01L2924/00014 , H01L2924/01039 , H01L2924/01057 , H01L2924/01079 , H01L2924/12041 , H01L2924/15153 , H01L2924/15165 , H01L2924/181 , H01L2924/18161
摘要: A semiconductor package having a board, at least one semiconductor chip, and flat type external connecting terminals, the board having a wiring circuit including connecting portions on a first main surface, the semiconductor being mounted on the first main surface, the flat type external connecting terminals being electrically connected to the semiconductor chip and formed on a second main surface of the board, wherein the flat type external connecting terminals are disposed in such a manner that any straight line which is arbitrarily drawn across the surface of a region to form the flat type external connecting terminals of the board runs on at least one of the flat type external connecting terminals.
摘要翻译: 一种具有板,至少一个半导体芯片和平面型外部连接端子的半导体封装,所述板具有布线电路,所述布线电路包括在第一主表面上的连接部分,所述半导体安装在所述第一主表面上,所述平面型外部连接 端子电连接到半导体芯片并形成在板的第二主表面上,其中扁平型外部连接端子以这样的方式设置,即任意直线横过区域的表面而形成平面 板的外部连接端子至少在一个平面型外部连接端子上运行。
-