公开(公告)号：US20170028741A1

公开(公告)日：2017-02-02

申请号：US14925877

申请日：2015-10-28

Applicant: KABUSHIKI KAISHA TOSHIBA ,  TOSHIBA TEC CORPORATION

Inventor： Shinichi TATSUTA ,  Junya TANAKA ,  Misato ISHIKAWA ,  Shunsuke HATTORI ,  Takahiro OMORI ,  Tetsuya KUGIMIYA ,  Kazuaki SUGIMOTO

IPC: B41J2/355

CPC classification number: B41J2/355 ,  B41J2/3555 ,  B41J2/3556 ,  B41J2/3558 ,  B41J2/365 ,  B41J2/375 ,  B41J2/38

Abstract: A thermal printer includes: a plurality of heat elements that are to be heated by applying an electrical power; a printing controller that applies a first electrical power to heat elements not to be used for printing, the first electrical power depending on the number of heat elements not to be used for printing among the plurality of heat elements; and a thermal head that prints using the plurality of heat elements.

Abstract translation: 热敏打印机包括：通过施加电力而被加热的多个热元件; 打印控制器，其施加第一电力以加热不用于打印的元件，所述第一电功率取决于所述多个热元件中不用于打印的热元件的数量; 以及使用多个加热元件打印的热敏头。

公开(公告)号：US20150171054A1

公开(公告)日：2015-06-18

申请号：US14564610

申请日：2014-12-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuu YAMAYOSE ,  Tetsuya KUGIMIYA ,  Kenji HIROHATA

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L22/34 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/26155 ,  H01L2224/29006 ,  H01L2224/29013 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32227 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/83007 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit board and the semiconductor chip to bond the circuit board and the semiconductor chip. The bond part includes a first area immediately under the semiconductor chip and a second area adjacent to the first area. The second area has a porosity equal to or lower than that of the first area.

Abstract translation: 根据实施例，半导体部件包括电路板; 半导体芯片; 以及通过在电路板和半导体芯片之间烧结含有金属粒子的糊料以将电路板和半导体芯片接合而形成的接合部分。 接合部分包括紧邻在半导体芯片下面的第一区域和与第一区域相邻的第二区域。 第二区域的孔隙率等于或低于第一区域的孔隙率。