公开(公告)号：US20170271214A1

公开(公告)日：2017-09-21

申请号：US15253476

申请日：2016-08-31

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Kentaro KASA ,  Kazuya FUKUHARA ,  Kazutaka ISHIGO ,  Manabu TAKAKUWA ,  Yoshinori HAGIO ,  Kazuhiro SEGAWA ,  Yuki MURASAKA ,  Tetsuya KUGIMIYA ,  Yuu YAMAYOSE ,  Yosuke OKAMOTO

IPC: H01L21/66 ,  G01B11/30 ,  G01N25/72 ,  G03F7/26 ,  H01L21/027 ,  G03F7/20 ,  G03F7/039 ,  G01B11/27 ,  H01L21/67

CPC classification number: H01L22/20 ,  G01B11/002 ,  G01B11/24 ,  G01B11/27 ,  G01B11/306 ,  G01B2210/44 ,  G01B2210/56 ,  G01N25/72 ,  G03F7/039 ,  G03F7/20 ,  G03F7/26 ,  H01L21/0274 ,  H01L21/67248 ,  H01L21/67288 ,  H01L21/68 ,  H01L22/12

Abstract: A pattern accuracy detecting apparatus includes a stage for supporting a substrate, an optical warpage detecting unit that measures a shape of a substrate disposed on the stage, an optical pattern detection unit that detects a position of a pattern on the substrate, and a processing unit that corrects the detected pattern position based on the measured shape of the substrate.

公开(公告)号：US20160282291A1

公开(公告)日：2016-09-29

申请号：US15074499

申请日：2016-03-18

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuu YAMAYOSE ,  Tetsuya KUGIMIYA

IPC: G01N27/20 ,  G01N27/04 ,  G01N25/72

CPC classification number: G01N27/20 ,  G01N27/045 ,  H05K1/0268 ,  H05K3/30 ,  H05K3/34 ,  H05K2201/10151 ,  H05K2201/10484

Abstract: According to one embodiment, an electronic device comprises a circuit board, an electrical component, and a measurement unit. The circuit board has a first face. The electrical component includes a second face electrically connected to the first face via a bonding material, a first end in a first direction along the second face, and a second end. The second end is opposite to the first end in the first direction. The measurement unit is configured to measure a characteristic changing depending on a conductivity of the bonding material. A first distance between the first face and the first end is shorter than a second distance between the first face and the second end. The measurement unit includes a first measurement unit configured to measure the characteristic of a part of the bonding material. The part is adjacent to the first end.

Abstract translation: 根据一个实施例，电子设备包括电路板，电气部件和测量单元。 电路板有第一面。 电气部件包括通过接合材料电连接到第一面的第二面，沿着第二面的沿第一方向的第一端和第二端。 第二端与第一方向的第一端相反。 测量单元被配置为测量根据接合材料的导电性而变化的特性。 第一面和第一端之间的第一距离比第一面和第二端之间的第二距离短。 测量单元包括被配置为测量接合材料的一部分的特性的第一测量单元。 该部分与第一端相邻。

公开(公告)号：US20140091829A1

公开(公告)日：2014-04-03

申请号：US14013573

申请日：2013-08-29

Applicant: Kabushiki Kaisha Toshiba

Inventor： Yuu YAMAYOSE ,  Kenji HIROHATA

IPC: G01R31/319

CPC classification number: G01R31/31924 ,  G01R31/318513 ,  H01L2224/16145

Abstract: According to one embodiment, a semiconductor device includes a circuit board, a plurality of semiconductor chips stacked above the circuit board, first and second bumps, third and fourth bumps, and first and second detection units. The first and second bumps are provided in either a gap between the circuit board and the semiconductor chip or a gap between the two semiconductor chips. The third and fourth bumps are provided in any of gaps other than the gap in which the first and second bumps are provided. The first detection unit is electrically connected to the first bump to detect damage of the first bump and to generate a first signal indicating the damage of the first bump. The second detection unit is electrically connected to the third bump to detect damage of the third bump and to generate a second signal indicating the damage of the third bump.

Abstract translation: 根据一个实施例，半导体器件包括电路板，堆叠在电路板上的多个半导体芯片，第一和第二凸块，第三和第四凸块以及第一和第二检测单元。 第一和第二凸起设置在电路板和半导体芯片之间的间隙中或两个半导体芯片之间的间隙。 第三和第四凸起设置在除了设置第一和第二凸块的间隙之外的任何间隙中。 第一检测单元电连接到第一凸块以检测第一凸块的损坏并产生指示第一凸块损坏的第一信号。 第二检测单元电连接到第三凸块以检测第三凸块的损坏并产生指示第三凸起的损伤的第二信号。

公开(公告)号：US20150171054A1

公开(公告)日：2015-06-18

申请号：US14564610

申请日：2014-12-09

Applicant: KABUSHIKI KAISHA TOSHIBA

Inventor： Yuu YAMAYOSE ,  Tetsuya KUGIMIYA ,  Kenji HIROHATA

IPC: H01L23/00

CPC classification number: H01L24/83 ,  H01L22/34 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/26155 ,  H01L2224/29006 ,  H01L2224/29013 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32227 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/83007 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/00012

Abstract: According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit board and the semiconductor chip to bond the circuit board and the semiconductor chip. The bond part includes a first area immediately under the semiconductor chip and a second area adjacent to the first area. The second area has a porosity equal to or lower than that of the first area.

Abstract translation: 根据实施例，半导体部件包括电路板; 半导体芯片; 以及通过在电路板和半导体芯片之间烧结含有金属粒子的糊料以将电路板和半导体芯片接合而形成的接合部分。 接合部分包括紧邻在半导体芯片下面的第一区域和与第一区域相邻的第二区域。 第二区域的孔隙率等于或低于第一区域的孔隙率。