公开(公告)号：US20170154880A1

公开(公告)日：2017-06-01

申请号：US15364267

申请日：2016-11-30

申请人： NICHIA CORPORATION

发明人： Kenji OZEKI ,  Hiroki FUKUTA

IPC分类号： H01L25/16 ,  H01L33/60 ,  H01L23/00 ,  H01L33/54 ,  H01L33/58

CPC分类号： H01L25/167 ,  H01L23/24 ,  H01L24/26 ,  H01L24/73 ,  H01L24/96 ,  H01L24/97 ,  H01L25/072 ,  H01L25/0753 ,  H01L27/0248 ,  H01L29/866 ,  H01L33/0095 ,  H01L33/505 ,  H01L33/54 ,  H01L33/56 ,  H01L33/58 ,  H01L33/60 ,  H01L33/62 ,  H01L2224/16227 ,  H01L2224/26155 ,  H01L2224/26175 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/92225 ,  H01L2224/97 ,  H01L2924/12035 ,  H01L2924/12041 ,  H01L2924/1304 ,  H01L2924/1426 ,  H01L2924/1811 ,  H01L2924/19105 ,  H01L2933/0033 ,  H01L2933/0041 ,  H01L2933/005 ,  H01L2933/0091 ,  H01L2224/81 ,  H01L2224/83

摘要： A method of manufacturing a light emitting device includes: mounting light emitting elements on a collective substrate; arranging a first protruding member surrounding the light emitting elements; arranging a second protruding member between the light emitting elements; forming a cover member covering an upper end of the second protruding member, a lateral surface of each of the light emitting elements in a region surrounded by the first protruding member; and singulating the light emitting devices by cutting the cover member, the second protruding member, and the collective substrate at a portion including the second protruding member. The second protruding member is harder than the cover member. An upper end of the second protruding member is located lower than that of the first protruding member but higher than the upper surface of each of the light emitting elements.

公开(公告)号：US09355966B2

公开(公告)日：2016-05-31

申请号：US13937040

申请日：2013-07-08

申请人： Avago Technologies General IP (Singapore) Pte. Ltd.

发明人： Adam Gallegos ,  Walter J. Dauksher

IPC分类号： H01L23/00 ,  H01L23/367 ,  H01L23/16 ,  H01L23/498 ,  H05K1/14 ,  H05K3/34

CPC分类号： H01L23/562 ,  H01L23/16 ,  H01L23/3675 ,  H01L23/49816 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/10155 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13124 ,  H01L2224/13139 ,  H01L2224/13144 ,  H01L2224/13147 ,  H01L2224/13164 ,  H01L2224/16225 ,  H01L2224/26155 ,  H01L2224/2919 ,  H01L2224/32245 ,  H01L2224/48225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81007 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81801 ,  H01L2224/83007 ,  H01L2224/83203 ,  H01L2224/83411 ,  H01L2224/83424 ,  H01L2224/83439 ,  H01L2224/83444 ,  H01L2224/83447 ,  H01L2224/8346 ,  H01L2224/8385 ,  H01L2224/92225 ,  H01L2924/00014 ,  H01L2924/15311 ,  H01L2924/16152 ,  H01L2924/1659 ,  H01L2924/167 ,  H01L2924/19105 ,  H01L2924/3511 ,  H05K1/141 ,  H05K3/3436 ,  H05K2201/041 ,  H05K2201/068 ,  H05K2201/10378 ,  H05K2201/10734 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/00012 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

摘要： A chip package and methods of manufacturing the same are disclosed. In particular, a chip package comprising a ball grid array is disclosed in which the chip package includes a package substrate supporting the ball grid array and in which the chip package further includes a warpage control frame that helps to minimize or mitigate warpage of the chip package.

摘要翻译： 公开了一种芯片封装及其制造方法。 特别地，公开了一种包括球栅阵列的芯片封装，其中芯片封装包括支撑球栅阵列的封装衬底，其中芯片封装还包括翘曲控制框架，其帮助最小化或减轻芯片封装的翘曲 。

公开(公告)号：US09111896B2

公开(公告)日：2015-08-18

申请号：US13803609

申请日：2013-03-14

申请人： Chen-Hua Yu ,  Der-Chyang Yeh

发明人： Chen-Hua Yu ,  Der-Chyang Yeh

IPC分类号： H01L23/34 ,  H01L21/56 ,  H01L23/00 ,  H01L23/31 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L25/03 ,  H01L25/065

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/585 ,  H01L24/19 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/26125 ,  H01L2224/26145 ,  H01L2224/26155 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/33505 ,  H01L2224/33519 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81007 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： A semiconductor device and method of forming the semiconductor device, the semiconductor device includes a package having at least one first die and at least one second die. The semiconductor device further includes a set of conductive elements electrically connecting the at least one first and the at least one second die to a substrate. The semiconductor device further includes a thermal contact pad between the at least one first die and the at least one second die, to thermally isolate the at least one first die from the at least one second die.

摘要翻译： 一种形成半导体器件的半导体器件和方法，该半导体器件包括具有至少一个第一管芯和至少一个第二管芯的封装。 半导体器件还包括将至少一个第一和至少一个第二管芯电连接到衬底的一组导电元件。 所述半导体器件还包括在所述至少一个第一管芯和所述至少一个第二管芯之间的热接触焊盘，以将所述至少一个第一管芯与所述至少一个第二管芯热隔离。

公开(公告)号：US08994191B2

公开(公告)日：2015-03-31

申请号：US14159813

申请日：2014-01-21

申请人： Advanced Micro Devices Co., Ltd (Shanghai)

发明人： I-Tseng Lee ,  Yi Hsiu Liu

IPC分类号： H01L29/40 ,  H01L23/52 ,  H01L23/48 ,  H01L23/00

CPC分类号： H01L24/17 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/81 ,  H01L24/83 ,  H01L25/0657 ,  H01L2224/0401 ,  H01L2224/1134 ,  H01L2224/13082 ,  H01L2224/131 ,  H01L2224/13147 ,  H01L2224/1356 ,  H01L2224/16113 ,  H01L2224/16221 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/17134 ,  H01L2224/17179 ,  H01L2224/17515 ,  H01L2224/17517 ,  H01L2224/26125 ,  H01L2224/26155 ,  H01L2224/29011 ,  H01L2224/29012 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/3201 ,  H01L2224/32057 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32225 ,  H01L2224/73104 ,  H01L2224/73204 ,  H01L2224/81191 ,  H01L2224/81193 ,  H01L2224/83191 ,  H01L2224/83193 ,  H01L2225/06513 ,  H01L2225/06565 ,  H01L2924/07025 ,  H01L2924/15311 ,  H01L2924/351 ,  H01L2924/3512 ,  H01L2924/00014 ,  H01L2924/00 ,  H01L2924/014 ,  H01L2924/00012

摘要： The present invention relates to die-die stacking structure and the method for making the same. The die-die stacking structure comprises a top die having a bottom surface, a first insulation layer covering the bottom surface of the top die, a bottom die having a top surface, a second insulation layer covering the top surface of the bottom die, a plurality of connection members between the top die and the bottom die and a protection material between the first insulation layer and the second insulation layer. The plurality of connection members communicates the top die with the bottom die. The protection material bridges the plurality of connection members to form a mesh layout between the first insulation layer and the second insulation layer. The structure and method of present invention at least provide more strength and stress buffer to resist die warpage and absorb thermal cycling stress, and then prevents the bump and dielectric materials in the die-die stacking structure from cracking caused by thermal stress or external mechanical stress.

摘要翻译： 本发明涉及模片堆叠结构及其制造方法。 模片堆叠结构包括具有底表面的顶模，覆盖顶模的底表面的第一绝缘层，具有顶表面的底模，覆盖底模顶表面的第二绝缘层， 顶模和底模之间的多个连接构件和第一绝缘层与第二绝缘层之间的保护材料。 多个连接构件将顶模与底模连通。 保护材料桥接多个连接构件以在第一绝缘层和第二绝缘层之间形成网格布局。 本发明的结构和方法至少提供更多的强度和应力缓冲以抵抗模翘曲并吸收热循环应力，然后防止模芯堆叠结构中的凸起和介电材料由热应力或外部机械应力引起的破裂 。

公开(公告)号：US11923331B2

公开(公告)日：2024-03-05

申请号：US17184924

申请日：2021-02-25

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Wei-Jhih Mao ,  Kuei-Sung Chang ,  Shang-Ying Tsai

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/10 ,  H01L23/498 ,  H01L25/00 ,  H01L25/065

CPC分类号： H01L24/32 ,  H01L21/4803 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L24/05 ,  H01L2224/05554 ,  H01L2224/1403 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17106 ,  H01L2224/17107 ,  H01L2224/26155 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/819 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06582

摘要： In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.

公开(公告)号：US20240021567A1

公开(公告)日：2024-01-18

申请号：US18366179

申请日：2023-08-07

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： Wei-Jhih Mao ,  Kuei-Sung Chang ,  Shang-Ying Tsai

IPC分类号： H01L23/00 ,  H01L21/48 ,  H01L23/10 ,  H01L23/498 ,  H01L25/065 ,  H01L25/00

CPC分类号： H01L24/32 ,  H01L21/4803 ,  H01L21/4853 ,  H01L23/10 ,  H01L23/49838 ,  H01L24/14 ,  H01L24/16 ,  H01L24/17 ,  H01L24/33 ,  H01L24/48 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/0657 ,  H01L25/50 ,  H01L24/05 ,  H01L2224/05554 ,  H01L2224/1403 ,  H01L2224/1601 ,  H01L2224/16014 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17106 ,  H01L2224/17107 ,  H01L2224/26155 ,  H01L2224/32145 ,  H01L2224/32227 ,  H01L2224/3303 ,  H01L2224/33181 ,  H01L2224/48105 ,  H01L2224/48145 ,  H01L2224/48227 ,  H01L2224/73104 ,  H01L2224/73207 ,  H01L2224/73257 ,  H01L2224/81191 ,  H01L2224/81192 ,  H01L2224/819 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06568 ,  H01L2225/06582

摘要： In some embodiments, the present disclosure relates to an integrated chip (IC), including a substrate, a first die disposed over the substrate, a metal wire attached to a frontside of the first die, and a first plurality of die stopper bumps disposed along a backside of the first die and configured to control an angle of operation of the first die. The first plurality of die stopper bumps directly contacts a backside surface of the first die.

公开(公告)号：US20230299247A1

公开(公告)日：2023-09-21

申请号：US18058201

申请日：2022-11-22

申请人： Samsung Display Co., LTD.

发明人： Dong Hyun LEE ,  Si Joon SONG

IPC分类号： H01L33/60 ,  H01L25/16 ,  H01L23/00

CPC分类号： H01L33/60 ,  H01L23/562 ,  H01L24/29 ,  H01L24/83 ,  H01L25/167 ,  H01L24/30 ,  H01L24/32 ,  H01L2224/26122 ,  H01L2224/26155 ,  H01L2224/29016 ,  H01L2224/2919 ,  H01L2224/30517 ,  H01L2224/32155 ,  H01L2224/83007 ,  H01L2224/8322 ,  H01L2224/83874

摘要： A display device includes: a display layer on a substrate, the display layer including a light emitting element; a reflective structure on the display layer; a resin part on the display layer; a cover part on the resin part; and a driving circuit board, at least a portion of the driving circuit board being on a side of the display layer. The reflective structure includes a reflective surface facing the at least the portion of the driving circuit board.

公开(公告)号：US10083940B2

公开(公告)日：2018-09-25

申请号：US15622166

申请日：2017-06-14

申请人： Taiwan Semiconductor Manufacturing Co., Ltd.

发明人： Chen-Hua Yu ,  Der-Chyang Yeh

IPC分类号： H01L23/00 ,  H01L21/56 ,  H01L25/065 ,  H01L23/36 ,  H01L23/373 ,  H01L23/498 ,  H01L23/58 ,  H01L25/03 ,  H01L25/00 ,  H01L21/683 ,  H01L23/31 ,  H01L23/34

CPC分类号： H01L25/0657 ,  H01L21/561 ,  H01L21/565 ,  H01L21/568 ,  H01L21/6835 ,  H01L23/3114 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/34 ,  H01L23/36 ,  H01L23/3737 ,  H01L23/49811 ,  H01L23/49816 ,  H01L23/49833 ,  H01L23/585 ,  H01L24/19 ,  H01L24/29 ,  H01L24/48 ,  H01L24/81 ,  H01L24/85 ,  H01L24/92 ,  H01L24/94 ,  H01L24/96 ,  H01L24/97 ,  H01L25/03 ,  H01L25/0652 ,  H01L25/0655 ,  H01L25/50 ,  H01L2221/68359 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/12105 ,  H01L2224/16225 ,  H01L2224/26125 ,  H01L2224/26145 ,  H01L2224/26155 ,  H01L2224/26175 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/325 ,  H01L2224/33505 ,  H01L2224/33519 ,  H01L2224/48227 ,  H01L2224/73253 ,  H01L2224/73267 ,  H01L2224/81007 ,  H01L2224/92247 ,  H01L2224/94 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/0652 ,  H01L2225/06541 ,  H01L2225/06548 ,  H01L2225/06558 ,  H01L2225/06568 ,  H01L2225/06572 ,  H01L2225/06586 ,  H01L2225/06589 ,  H01L2924/00014 ,  H01L2924/12042 ,  H01L2924/15311 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2224/83 ,  H01L2224/19 ,  H01L2224/82 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/45015 ,  H01L2924/207 ,  H01L2224/45099

摘要： Some embodiments relate to a semiconductor device. The semiconductor device includes a substrate. A first die is coupled beneath a lower surface of the substrate. A second die is coupled beneath the lower surface of the substrate and is disposed over the first die. A thermal contact pad is arranged beneath a lower surface of the second die and an upper surface of the first die. The thermal contact pad thermally isolates the first die from the second die.

公开(公告)号：US20170323874A1

公开(公告)日：2017-11-09

申请号：US15437237

申请日：2017-02-20

申请人： Intel Corporation

发明人： Omkar Karhade ,  Nitin Deshpande ,  Bassam M. Ziadeh ,  Yoshihiro Tomita

IPC分类号： H01L25/18 ,  H01L23/538 ,  H01L25/065 ,  H01L23/48 ,  H01L25/00 ,  H01L23/00 ,  H01L23/498 ,  H01L25/16

CPC分类号： H01L25/18 ,  H01L23/481 ,  H01L23/49838 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/17 ,  H01L24/29 ,  H01L24/32 ,  H01L24/48 ,  H01L24/49 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/0657 ,  H01L25/16 ,  H01L25/50 ,  H01L2224/0401 ,  H01L2224/04042 ,  H01L2224/13025 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16227 ,  H01L2224/1703 ,  H01L2224/17181 ,  H01L2224/26155 ,  H01L2224/26175 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/49109 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/73265 ,  H01L2224/81 ,  H01L2224/81203 ,  H01L2224/83 ,  H01L2224/83851 ,  H01L2224/85 ,  H01L2224/92125 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06558 ,  H01L2225/06593 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/15153 ,  H01L2924/19104 ,  H01L2924/3511 ,  H01L2924/3512 ,  H01L2224/45099

摘要： An integrated circuit assembly that includes a substrate; a member formed on the substrate; a first die mounted to the substrate within an opening in the member such that there is space between the first die and the member and the member surrounds the first die, and wherein the first die does not extend above an upper surface of the member; an underfill between the first the die and the substrate, wherein the underfill at least partially fills the space between the die and member; and a second die mounted to the first die and the member, wherein the second die is mounted to the member on all sides of the opening.

公开(公告)号：US20150171054A1

公开(公告)日：2015-06-18

申请号：US14564610

申请日：2014-12-09

申请人： KABUSHIKI KAISHA TOSHIBA

发明人： Yuu YAMAYOSE ,  Tetsuya KUGIMIYA ,  Kenji HIROHATA

IPC分类号： H01L23/00

CPC分类号： H01L24/83 ,  H01L22/34 ,  H01L24/29 ,  H01L24/32 ,  H01L24/75 ,  H01L2224/26155 ,  H01L2224/29006 ,  H01L2224/29013 ,  H01L2224/29294 ,  H01L2224/29339 ,  H01L2224/29347 ,  H01L2224/3201 ,  H01L2224/32013 ,  H01L2224/32059 ,  H01L2224/32227 ,  H01L2224/75315 ,  H01L2224/75318 ,  H01L2224/7532 ,  H01L2224/83007 ,  H01L2224/83192 ,  H01L2224/83201 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/8384 ,  H01L2924/00014 ,  H01L2924/00012

摘要： According to an embodiment, a semiconductor component includes a circuit board; a semiconductor chip; and a bond part formed by sintering a paste containing metal particles between the circuit board and the semiconductor chip to bond the circuit board and the semiconductor chip. The bond part includes a first area immediately under the semiconductor chip and a second area adjacent to the first area. The second area has a porosity equal to or lower than that of the first area.

摘要翻译： 根据实施例，半导体部件包括电路板; 半导体芯片; 以及通过在电路板和半导体芯片之间烧结含有金属粒子的糊料以将电路板和半导体芯片接合而形成的接合部分。 接合部分包括紧邻在半导体芯片下面的第一区域和与第一区域相邻的第二区域。 第二区域的孔隙率等于或低于第一区域的孔隙率。