公开(公告)号：US11990435B2

公开(公告)日：2024-05-21

申请号：US17867287

申请日：2022-07-18

申请人： Amkor Technology Singapore Holding Pte. Ltd.

发明人： Sung Sun Park ,  Ji Young Chung ,  Christopher Berry

IPC分类号： G06V40/13 ,  B81C3/00 ,  H01L23/00 ,  H01L23/053 ,  H01L23/31

CPC分类号： H01L24/05 ,  B81C3/00 ,  G06V40/13 ,  G06V40/1329 ,  H01L23/053 ,  H01L24/16 ,  H01L24/32 ,  H01L24/73 ,  H01L23/3128 ,  H01L24/03 ,  H01L24/11 ,  H01L24/13 ,  H01L24/27 ,  H01L24/29 ,  H01L24/33 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L2224/0345 ,  H01L2224/03452 ,  H01L2224/03464 ,  H01L2224/0347 ,  H01L2224/0361 ,  H01L2224/03912 ,  H01L2224/0401 ,  H01L2224/05124 ,  H01L2224/05139 ,  H01L2224/05144 ,  H01L2224/05147 ,  H01L2224/05155 ,  H01L2224/05166 ,  H01L2224/05624 ,  H01L2224/05639 ,  H01L2224/05644 ,  H01L2224/05647 ,  H01L2224/05655 ,  H01L2224/05666 ,  H01L2224/05671 ,  H01L2224/05684 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/1147 ,  H01L2224/11849 ,  H01L2224/119 ,  H01L2224/13013 ,  H01L2224/13014 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13294 ,  H01L2224/133 ,  H01L2224/16227 ,  H01L2224/27312 ,  H01L2224/2732 ,  H01L2224/27622 ,  H01L2224/2784 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29011 ,  H01L2224/2919 ,  H01L2224/2929 ,  H01L2224/29294 ,  H01L2224/29299 ,  H01L2224/2939 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81424 ,  H01L2224/81439 ,  H01L2224/81444 ,  H01L2224/81447 ,  H01L2224/81455 ,  H01L2224/8146 ,  H01L2224/81464 ,  H01L2224/81466 ,  H01L2224/81471 ,  H01L2224/81484 ,  H01L2224/81815 ,  H01L2224/8185 ,  H01L2224/83101 ,  H01L2224/83102 ,  H01L2224/83192 ,  H01L2224/9211 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2924/014 ,  H01L2924/1815 ,  H01L2924/18161 ,  H01L2224/131 ,  H01L2924/014 ,  H01L2224/13147 ,  H01L2924/00014 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2224/13111 ,  H01L2924/01079 ,  H01L2224/13111 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01029 ,  H01L2224/13111 ,  H01L2924/01047 ,  H01L2924/01083 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2224/13111 ,  H01L2924/0103 ,  H01L2924/01083 ,  H01L2224/11334 ,  H01L2924/00014 ,  H01L2224/1146 ,  H01L2924/00014 ,  H01L2224/1132 ,  H01L2924/00014 ,  H01L2224/11849 ,  H01L2924/00014 ,  H01L2224/05647 ,  H01L2924/00014 ,  H01L2224/05624 ,  H01L2924/00014 ,  H01L2224/05639 ,  H01L2924/00014 ,  H01L2224/05644 ,  H01L2924/00014 ,  H01L2224/05655 ,  H01L2924/00014 ,  H01L2224/0345 ,  H01L2924/00014 ,  H01L2224/03464 ,  H01L2924/00014 ,  H01L2224/03452 ,  H01L2924/00014 ,  H01L2224/05147 ,  H01L2924/00014 ,  H01L2224/05124 ,  H01L2924/00014 ,  H01L2224/05139 ,  H01L2924/00014 ,  H01L2224/05144 ,  H01L2924/00014 ,  H01L2224/05155 ,  H01L2924/00014 ,  H01L2224/0347 ,  H01L2924/00014 ,  H01L2224/1147 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01074 ,  H01L2224/05671 ,  H01L2924/00014 ,  H01L2224/05666 ,  H01L2924/01028 ,  H01L2224/0361 ,  H01L2924/00014 ,  H01L2224/119 ,  H01L2224/034 ,  H01L2224/1147 ,  H01L2224/034 ,  H01L2224/114 ,  H01L2224/0361 ,  H01L2224/13294 ,  H01L2924/00014 ,  H01L2224/133 ,  H01L2924/014 ,  H01L2224/81203 ,  H01L2924/00014 ,  H01L2224/81815 ,  H01L2924/00014 ,  H01L2224/2919 ,  H01L2924/0665 ,  H01L2224/2929 ,  H01L2924/0665 ,  H01L2224/2919 ,  H01L2924/07025 ,  H01L2224/2929 ,  H01L2924/07025 ,  H01L2224/2919 ,  H01L2924/069 ,  H01L2224/2929 ,  H01L2924/069 ,  H01L2224/83102 ,  H01L2924/00014 ,  H01L2224/83101 ,  H01L2924/00014 ,  H01L2224/9211 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2224/29294 ,  H01L2924/00014 ,  H01L2224/2939 ,  H01L2924/00014 ,  H01L2224/29299 ,  H01L2924/00014 ,  H01L2224/27622 ,  H01L2924/00014 ,  H01L2224/2732 ,  H01L2924/00014 ,  H01L2224/27312 ,  H01L2924/00014 ,  H01L2224/81447 ,  H01L2924/00014 ,  H01L2224/81424 ,  H01L2924/00014 ,  H01L2224/81455 ,  H01L2924/00014 ,  H01L2224/8146 ,  H01L2924/00014 ,  H01L2224/81439 ,  H01L2924/00014 ,  H01L2224/81464 ,  H01L2924/00014 ,  H01L2224/81484 ,  H01L2924/00014 ,  H01L2224/81444 ,  H01L2924/00014 ,  H01L2224/81466 ,  H01L2924/00014 ,  H01L2224/81471 ,  H01L2924/00014 ,  H01L2224/8185 ,  H01L2924/00012 ,  H01L2224/05166 ,  H01L2924/00014 ,  H01L2224/05684 ,  H01L2924/00014

摘要： A fingerprint sensor device and a method of making a fingerprint sensor device. As non-limiting examples, various aspects of this disclosure provide various fingerprint sensor devices, and methods of manufacturing thereof, that comprise a sensing area on a bottom side of a die without top side electrodes that senses fingerprints from the top side, and/or that comprise a sensor die directly electrically connected to conductive elements of a plate through which fingerprints are sensed.

公开(公告)号：US11735545B2

公开(公告)日：2023-08-22

申请号：US17365634

申请日：2021-07-01

申请人： VueReal Inc.

发明人： Gholamreza Chaji ,  Ehsanollah Fathi

IPC分类号： H01L21/683 ,  H01L23/00 ,  H01L21/687 ,  H01L25/00 ,  G01R31/26 ,  H01L21/66 ,  H05K13/04

CPC分类号： H01L24/08 ,  H01L21/68714 ,  H01L24/29 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  G01R31/2635 ,  H01L21/6831 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/75 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/08238 ,  H01L2224/27002 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/29026 ,  H01L2224/29078 ,  H01L2224/32237 ,  H01L2224/7598 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/8316 ,  H01L2224/8318 ,  H01L2224/83121 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83238 ,  H01L2224/83862 ,  H01L2224/83902 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/97 ,  H05K13/0411

摘要： A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

公开(公告)号：US11728306B2

公开(公告)日：2023-08-15

申请号：US17569893

申请日：2022-01-06

申请人： VueReal Inc.

发明人： Gholamreza Chaji ,  Ehsanollah Fathi

IPC分类号： H01L23/00 ,  H01L21/687 ,  H01L25/00 ,  G01R31/26 ,  H01L21/683 ,  H01L21/66 ,  H05K13/04

CPC分类号： H01L24/08 ,  H01L21/68714 ,  H01L24/29 ,  H01L24/83 ,  H01L24/95 ,  H01L24/97 ,  G01R31/2635 ,  H01L21/6831 ,  H01L21/6835 ,  H01L22/14 ,  H01L22/20 ,  H01L24/27 ,  H01L24/32 ,  H01L24/75 ,  H01L25/50 ,  H01L2221/68322 ,  H01L2221/68368 ,  H01L2221/68381 ,  H01L2224/08238 ,  H01L2224/27002 ,  H01L2224/2732 ,  H01L2224/27334 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29019 ,  H01L2224/2919 ,  H01L2224/29026 ,  H01L2224/29078 ,  H01L2224/32237 ,  H01L2224/7598 ,  H01L2224/75252 ,  H01L2224/75253 ,  H01L2224/83005 ,  H01L2224/8314 ,  H01L2224/8316 ,  H01L2224/8318 ,  H01L2224/83121 ,  H01L2224/83141 ,  H01L2224/83143 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83234 ,  H01L2224/83238 ,  H01L2224/83862 ,  H01L2224/83902 ,  H01L2224/95 ,  H01L2224/95001 ,  H01L2224/97 ,  H05K13/0411

摘要： A method of selectively transferring micro devices from a donor substrate to contact pads on a receiver substrate. Micro devices being attached to a donor substrate with a donor force. The donor substrate and receiver substrate are aligned and brought together so that selected micro devices meet corresponding contact pads. A receiver force is generated to hold selected micro devices to the contact pads on the receiver substrate. The donor force is weakened and the substrates are moved apart leaving selected micro devices on the receiver substrate. Several methods of generating the receiver force are disclosed, including adhesive, mechanical and electrostatic techniques.

公开(公告)号：US09890036B2

公开(公告)日：2018-02-13

申请号：US15429636

申请日：2017-02-10

申请人： TEXAS INSTRUMENTS INCORPORATED

发明人： John Charles Ehmke ,  Virgil Cotoco Ararao

IPC分类号： H01L21/00 ,  H01L21/31 ,  H01L21/469 ,  B81B7/00 ,  B81C1/00 ,  G02B26/08 ,  G02B6/42 ,  G02B26/00 ,  B82Y30/00

CPC分类号： B81B7/0038 ,  B81B2203/0315 ,  B81C1/00269 ,  B81C1/00285 ,  B81C1/00293 ,  B81C2201/0108 ,  B81C2201/013 ,  B81C2201/0188 ,  B81C2201/0198 ,  B81C2201/053 ,  B81C2203/0109 ,  B81C2203/0118 ,  B81C2203/019 ,  B81C2203/035 ,  B82Y30/00 ,  G02B6/4204 ,  G02B6/4208 ,  G02B6/4248 ,  G02B26/001 ,  G02B26/0833 ,  H01L24/03 ,  H01L24/05 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/83 ,  H01L24/94 ,  H01L2224/03612 ,  H01L2224/03614 ,  H01L2224/039 ,  H01L2224/04026 ,  H01L2224/05083 ,  H01L2224/05109 ,  H01L2224/05123 ,  H01L2224/05138 ,  H01L2224/05163 ,  H01L2224/05166 ,  H01L2224/0517 ,  H01L2224/05562 ,  H01L2224/27462 ,  H01L2224/2747 ,  H01L2224/279 ,  H01L2224/29006 ,  H01L2224/29011 ,  H01L2224/29023 ,  H01L2224/29109 ,  H01L2224/29144 ,  H01L2224/32058 ,  H01L2224/32227 ,  H01L2224/83121 ,  H01L2224/83193 ,  H01L2224/8381 ,  H01L2224/83825 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/0102 ,  H01L2924/01024 ,  H01L2924/01074 ,  H01L2924/1461 ,  H01L2924/164 ,  H01L2924/00014 ,  H01L2924/01049 ,  H01L2224/03 ,  H01L2924/01042 ,  H01L2924/01072 ,  H01L2924/01004 ,  H01L2224/83 ,  H01L2224/0345 ,  H01L2224/0361 ,  H01L2224/03462

摘要： In described examples, a hermetic package of a microelectromechanical system (MEMS) structure includes a substrate having a surface with a MEMS structure of a first height. The substrate is hermetically sealed to a cap forming a cavity over the MEMS structure. The cap is attached to the substrate surface by a vertical stack of metal layers adhering to the substrate surface and to the cap. The stack has a continuous outline surrounding the MEMS structure while spaced from the MEMS structure by a distance. The stack has: a first bottom metal seed film adhering to the substrate and a second bottom metal seed film adhering to the first bottom metal seed film; and a first top metal seed film adhering to the cap and a second top metal seed film adhering to the first top metal seed film.

公开(公告)号：US09780059B2

公开(公告)日：2017-10-03

申请号：US14339524

申请日：2014-07-24

申请人： Semiconductor Components Industries, LLC

发明人： Shutesh Krishnan ,  Yun Sung Won

IPC分类号： H01L23/00 ,  H01L23/495

CPC分类号： H01L24/27 ,  H01L23/49513 ,  H01L23/49524 ,  H01L24/16 ,  H01L24/29 ,  H01L24/36 ,  H01L24/40 ,  H01L24/48 ,  H01L24/73 ,  H01L24/83 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/27318 ,  H01L2224/27334 ,  H01L2224/29 ,  H01L2224/29006 ,  H01L2224/29101 ,  H01L2224/29199 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/293 ,  H01L2224/32013 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/33181 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48235 ,  H01L2224/48247 ,  H01L2224/73263 ,  H01L2224/73265 ,  H01L2224/81192 ,  H01L2224/8184 ,  H01L2224/83048 ,  H01L2224/83101 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/838 ,  H01L2224/8384 ,  H01L2224/92 ,  H01L2224/92247 ,  H01L2924/00013 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01025 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/01049 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01057 ,  H01L2924/01058 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15747 ,  H01L2924/15787 ,  H01L2924/181 ,  H01L2924/19105 ,  H01L2924/351 ,  H01L2224/45099 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2224/29099 ,  H01L2224/37099 ,  H01L2224/05599

摘要： A bonding structure and a method for bonding components, wherein the bonding structure includes a nanoparticle preform. In accordance with embodiments, the nanoparticle preform is placed on a substrate and a workpiece is placed on the nanoparticle preform.

公开(公告)号：US20160104659A1

公开(公告)日：2016-04-14

申请号：US14877373

申请日：2015-10-07

申请人： Amkor Technology, Inc.

发明人： Dong Joo Park ,  Jae Sung Park ,  Jin Seong Kim ,  Ju Hoon Yoon

IPC分类号： H01L23/48 ,  H01L23/528 ,  H01L23/00 ,  H01L25/065 ,  H01L23/31 ,  H01L23/498

CPC分类号： H01L24/32 ,  H01L23/3128 ,  H01L23/49838 ,  H01L23/5385 ,  H01L23/5389 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/73 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/131 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/27436 ,  H01L2224/29006 ,  H01L2224/29294 ,  H01L2224/29344 ,  H01L2224/29386 ,  H01L2224/2939 ,  H01L2224/29393 ,  H01L2224/294 ,  H01L2224/32058 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/83101 ,  H01L2224/83191 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/83385 ,  H01L2224/83851 ,  H01L2224/92 ,  H01L2224/92125 ,  H01L2224/92225 ,  H01L2225/1023 ,  H01L2225/1041 ,  H01L2225/1058 ,  H01L2225/107 ,  H01L2225/1094 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/15331 ,  H01L2924/18161 ,  H01L2924/3511 ,  H01L2924/014 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2224/16 ,  H01L21/56 ,  H01L21/304 ,  H01L2224/27 ,  H01L2224/83 ,  H01L2924/00

摘要： A stacked semiconductor package and a manufacturing method thereof. For example and without limitation, various aspects of this disclosure provide a semiconductor package in which an upper interposer and/or package are electrically and mechanically coupled to a lower package utilizing an adhesive member comprising conductive particles.

摘要翻译： 叠层半导体封装及其制造方法。 例如但不限于，本公开的各个方面提供半导体封装，其中使用包括导电颗粒的粘合构件将上插入件和/或封装电气和机械耦合到下封装。

公开(公告)号：US09252116B2

公开(公告)日：2016-02-02

申请号：US14242206

申请日：2014-04-01

申请人： Invensas Corporation

发明人： Scott Jay Crane ,  Simon J. S. McElrea ,  Scott McGrath ,  Weiping Pan ,  De Ann Eileen Melcher ,  Marc E. Robinson

IPC分类号： H01L23/00 ,  H01L25/065 ,  H01L23/29

CPC分类号： H01L24/83 ,  H01L23/293 ,  H01L23/3171 ,  H01L23/3185 ,  H01L24/24 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/73 ,  H01L25/0657 ,  H01L2224/24145 ,  H01L2224/24146 ,  H01L2224/27452 ,  H01L2224/29005 ,  H01L2224/29006 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/32245 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/48465 ,  H01L2224/73265 ,  H01L2224/83191 ,  H01L2224/8385 ,  H01L2224/92247 ,  H01L2225/0651 ,  H01L2225/06524 ,  H01L2225/06551 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01033 ,  H01L2924/01038 ,  H01L2924/01082 ,  H01L2924/12042 ,  H01L2924/14 ,  H01L2924/00 ,  H01L2924/00012

摘要： A conformal coating on a semiconductor die provides adhesion between the die and a support. No additional adhesive is necessary to affix the die on the support. The conformal coating protects the die during assembly, and serves to electrically insulate the die from electrically conductive parts that the die may contact. The conformal coating may be an organic polymer, such as a parylene, for example. Also, a method for adhering a die onto a support, which may optionally be another die, includes providing a coating of a conformal between the die and the support, and heating the coating between the die and the support. The conformal coating may be provided on a die attach area of a surface of the die, or on a die mount region of a surface of the support, or on both a die attach area of a surface of the die and on a die mount region of a surface of the support; and the conformal coating may be provided following placement of the die on the support.

摘要翻译： 半导体管芯上的保形涂层提供了管芯和支撑件之间的粘附。 不需要额外的粘合剂将模具固定在支撑件上。 共形涂层在组装期间保护模具，并且用于使模具与模具可接触的导电部件电绝缘。 保形涂层可以是有机聚合物，例如聚对二甲苯。 此外，将模具粘附到可任选地是另一个模具的支撑件上的方法包括在模具和支撑件之间提供共形的涂层，以及加热模具和支撑件之间的涂层。 保形涂层可以设置在模具的表面的芯片附着区域上，或在支撑体的表面的模具安装区域上，或者在模具的表面的芯片附着区域上以及模具安装区域 的支撑体的表面; 并且可以在将模具放置在支撑件上之后提供保形涂层。

公开(公告)号：US20150306669A1

公开(公告)日：2015-10-29

申请号：US14650331

申请日：2013-10-09

申请人： ROBERT BOSCH GMBH

发明人： Michael Guenther ,  Andrea Feiock

IPC分类号： B22F7/06 ,  B22F1/00 ,  B22F7/00

CPC分类号： B22F7/062 ,  B22F1/0059 ,  B22F1/0062 ,  B22F7/008 ,  B22F7/064 ,  B22F7/08 ,  B23K35/0244 ,  B23K35/025 ,  H01L24/29 ,  H01L24/83 ,  H01L2224/29006 ,  H01L2224/2929 ,  H01L2224/29299 ,  H01L2224/29399 ,  H01L2224/32013 ,  H01L2224/8384 ,  H01L2924/12044 ,  H01L2924/00

摘要： The invention relates to a method for connecting at least two components (18, 20) using a sintering process. The aim of the invention is to improve the sintering process. This is achieved in that the method has the following method steps: a) providing a starting material (10) of a sintering compound (22), comprising particles (12) which can be sintered and have at least one metal or at least one metal compound and comprising at least one polymeric, polymerizable, and/or monomeric organic compound (14), wherein the polymeric, polymerizable, and/or monomeric compound (14) has a flow temperature which is higher than or equal to the room temperature and lower than the sintering temperature, and the polymeric, polymerizable, and/or monomeric organic compound (14) further has a desorption temperature which is higher than the flow temperature and lower than or equal to the sintering temperature; b) arranging the starting material (10) between two components (18, 20) to be connected; c) heating the starting material (10) to a temperature (T1) which is higher than or equal to the flow temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) and lower than the desorption temperature of the polymeric, polymerizable, and/or monomeric organic compound (14) for a period of time (t1); and d) heating the starting material (10) to a temperature (T2) which is higher than or equal to the sintering temperature of the particles (12) which can be sintered, optionally under the influence of a sintering pressure, for a period of time (t2), thereby forming a sintering compound (22).

摘要翻译： 本发明涉及一种使用烧结工艺连接至少两个部件（18,20）的方法。 本发明的目的是改善烧结过程。 这是通过以下方法实现的：a）提供烧结化合物（22）的起始材料（10），其包含可以烧结并具有至少一种金属或至少一种金属的颗粒（12） 化合物并且包含至少一种聚合物，可聚合和/或单体有机化合物（14），其中聚合物，可聚合和/或单体化合物（14）具有高于或等于室温的流动温度和较低 聚合的，可聚合的和/或单体的有机化合物（14）还具有高于流动温度并低于或等于烧结温度的解吸温度; b）将起始材料（10）布置在待连接的两个部件（18,20）之间; c）将起始原料（10）加热到高于或等于聚合物，可聚合和/或单体有机化合物（14）的流动温度的温度（T1），并且低于聚合物的可解吸温度， 可聚合和/或单体有机化合物（14）一段时间（t1）; 和d）任选地在烧结压力的影响下，将起始材料（10）加热到高于或等于可烧结的颗粒（12）的烧结温度的温度（T2），持续一段时间 时间（t2），由此形成烧结化合物（22）。

公开(公告)号：US20150236003A1

公开(公告)日：2015-08-20

申请号：US14404099

申请日：2012-09-14

申请人： Jumpei Konno ,  Takafumi Nishita ,  Kenji Sakata ,  Nobuhiro Kinoshita ,  Michiaki Sugiyama ,  Tsuyoshi Kida ,  Yoshihiro Ono

发明人： Jumpei Konno ,  Takafumi Nishita ,  Kenji Sakata ,  Nobuhiro Kinoshita ,  Michiaki Sugiyama ,  Tsuyoshi Kida ,  Yoshihiro Ono

IPC分类号： H01L25/00 ,  H01L23/498 ,  H01L25/065 ,  H01L21/56 ,  H01L23/00

CPC分类号： H01L21/486 ,  H01L21/561 ,  H01L21/563 ,  H01L21/565 ,  H01L21/6835 ,  H01L21/6836 ,  H01L21/76898 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/3128 ,  H01L23/3135 ,  H01L23/481 ,  H01L23/49816 ,  H01L23/49827 ,  H01L23/49838 ,  H01L23/538 ,  H01L24/03 ,  H01L24/06 ,  H01L24/11 ,  H01L24/13 ,  H01L24/16 ,  H01L24/27 ,  H01L24/29 ,  H01L24/32 ,  H01L24/33 ,  H01L24/75 ,  H01L24/81 ,  H01L24/83 ,  H01L24/92 ,  H01L24/97 ,  H01L25/03 ,  H01L25/065 ,  H01L25/0657 ,  H01L25/07 ,  H01L25/18 ,  H01L25/50 ,  H01L2221/68327 ,  H01L2221/68331 ,  H01L2224/03002 ,  H01L2224/0401 ,  H01L2224/13083 ,  H01L2224/131 ,  H01L2224/13111 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/16235 ,  H01L2224/16238 ,  H01L2224/27312 ,  H01L2224/27334 ,  H01L2224/2741 ,  H01L2224/29006 ,  H01L2224/29007 ,  H01L2224/29012 ,  H01L2224/29015 ,  H01L2224/2919 ,  H01L2224/32013 ,  H01L2224/32014 ,  H01L2224/32058 ,  H01L2224/32059 ,  H01L2224/32145 ,  H01L2224/32225 ,  H01L2224/33181 ,  H01L2224/73204 ,  H01L2224/753 ,  H01L2224/75315 ,  H01L2224/81001 ,  H01L2224/81191 ,  H01L2224/81203 ,  H01L2224/81447 ,  H01L2224/81815 ,  H01L2224/81907 ,  H01L2224/83001 ,  H01L2224/83192 ,  H01L2224/83203 ,  H01L2224/8321 ,  H01L2224/8385 ,  H01L2224/83862 ,  H01L2224/83906 ,  H01L2224/83907 ,  H01L2224/92 ,  H01L2224/9211 ,  H01L2224/92242 ,  H01L2224/97 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06555 ,  H01L2225/06565 ,  H01L2225/06568 ,  H01L2924/07802 ,  H01L2924/07811 ,  H01L2924/15311 ,  H01L2924/15313 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/81 ,  H01L2224/83 ,  H01L2924/00 ,  H01L2924/00014 ,  H01L2924/014 ,  H01L2224/11 ,  H01L21/304 ,  H01L2224/03 ,  H01L21/78 ,  H01L2221/68381 ,  H01L21/4825 ,  H01L2224/27 ,  H01L2924/01047

摘要： A method of manufacturing a semiconductor device obtained by laminating a first semiconductor chip and a second semiconductor chip with different planar sizes when seen in a plan view on a wiring board via an adhesive material, in which the second semiconductor chip with a relatively larger planar size is mounted on the first semiconductor chip with a relatively smaller planar size. Also, after the first and second semiconductor chips are mounted, the first and second semiconductor chips are sealed with resin. Here, before sealing with the resin, a gap between the second semiconductor chip and the wiring board is previously sealed with the adhesive material used when the first and second semiconductor chips are mounted.

摘要翻译： 一种制造半导体器件的方法，所述半导体器件通过层叠具有不同平面尺寸的第一半导体芯片和第二半导体芯片的方法，所述半导体器件和第二半导体芯片在通过粘合材料在布线板上的平面图中看到，其中具有相对较大的平面尺寸 以相对较小的平面尺寸安装在第一半导体芯片上。 此外，在安装第一和第二半导体芯片之后，用树脂密封第一和第二半导体芯片。 这里，在用树脂密封之前，当安装第一和第二半导体芯片时，使用所使用的粘合剂材料预先密封第二半导体芯片和布线板之间的间隙。

公开(公告)号：US09093430B2

公开(公告)日：2015-07-28

申请号：US14059102

申请日：2013-10-21

申请人： Taiwan Semiconductor Manufacturing Company, Ltd.

发明人： I-Chih Chen ,  Ying-Hao Chen ,  Chi-Cherng Jeng ,  Volume Chien ,  Fu-Tsun Tsai ,  Kun-Huei Lin

IPC分类号： H01L23/48 ,  G06F17/50

CPC分类号： H01L23/5226 ,  G06F17/5077 ,  H01L21/76805 ,  H01L21/76877 ,  H01L21/76897 ,  H01L23/3171 ,  H01L23/481 ,  H01L23/522 ,  H01L23/528 ,  H01L23/5283 ,  H01L23/5329 ,  H01L24/03 ,  H01L24/05 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L24/94 ,  H01L25/50 ,  H01L2224/03616 ,  H01L2224/0401 ,  H01L2224/04026 ,  H01L2224/05022 ,  H01L2224/05085 ,  H01L2224/05092 ,  H01L2224/05124 ,  H01L2224/05147 ,  H01L2224/05184 ,  H01L2224/05567 ,  H01L2224/05624 ,  H01L2224/05647 ,  H01L2224/05684 ,  H01L2224/16145 ,  H01L2224/29006 ,  H01L2224/29186 ,  H01L2224/2919 ,  H01L2224/32145 ,  H01L2224/73204 ,  H01L2224/94 ,  H01L2924/0002 ,  H01L2924/3511 ,  H01L2924/00 ,  H01L2224/83 ,  H01L2924/00014 ,  H01L2224/81 ,  H01L2924/00012

摘要： A semiconductor device includes a first layer including a number of first layer metal pads, a second layer formed on top of the first layer, the second layer including a number of second layer metal pads, and vias connecting the first layer metal pads to the second layer metal pads. A surface area overlap between the first layer metal pads and the second layer metal pads is below a defined threshold.

摘要翻译： 半导体器件包括包括多个第一层金属焊盘的第一层，形成在第一层顶部上的第二层，第二层包括多个第二层金属焊盘，以及将第一层金属焊盘连接到第二层金属焊盘的通孔 层金属垫。 第一层金属焊盘和第二层金属焊盘之间的表面积重叠低于规定的阈值。