公开(公告)号：US11024374B2

公开(公告)日：2021-06-01

申请号：US16560554

申请日：2019-09-04

Applicant: Kioxia Corporation

Inventor： Atsushi Kawasumi

IPC: G11C13/00 ,  H01L27/24 ,  H01L45/00

Abstract: A semiconductor memory device of an embodiment includes: a first wiring disposed at a first level and extending in a first direction; a second and third wirings disposed at a second level and extending in the first direction; a plurality of fourth wirings disposed at a third level and extending in a third direction; a plurality of first resistive change elements disposed in intersection regions of the first and fourth wirings; a plurality of second resistive change elements disposed in intersection regions between the second wiring and the third wiring and the fourth wirings; a first driving circuit electrically connected to the first wiring, a second driving circuit electrically connected to the second wiring, and a third driving circuit electrically connected to the third wiring; and a control circuit that controls the first driving circuit, the second driving circuit, and the third driving circuit, and also the fourth wirings.

公开(公告)号：US12057186B2

公开(公告)日：2024-08-06

申请号：US17471909

申请日：2021-09-10

Applicant: Kioxia Corporation

Inventor： Atsushi Kawasumi

IPC: G11C5/06 ,  G06F7/544 ,  G11C11/412 ,  G11C11/417

CPC classification number: G11C5/063 ,  G06F7/5443 ,  G11C11/412 ,  G11C11/417 ,  G06F2207/4824

Abstract: A semiconductor integrated circuit has a plurality of memory cells arranged in a first direction and each storing first data, a plurality of first wirings provided to correspond to the plurality of memory cells arranged in the first direction and supplying second data to be multiplied by the first data, and a second wiring pair provided to correspond to the plurality of memory cells arranged in the first direction and that includes one second wiring which is discharged when multiplication data of the first data, stored in each of the plurality of memory cells, and the second data, supplied by the first wiring corresponding to the memory cell, is a first logic; and another second wiring which is discharged when the multiplication data is a second logic.

公开(公告)号：US11615834B2

公开(公告)日：2023-03-28

申请号：US17197371

申请日：2021-03-10

Applicant: Kioxia Corporation

Inventor： Atsushi Kawasumi

IPC: G11C11/4094 ,  G11C11/4097 ,  G06N3/063 ,  G06F7/544 ,  G06N3/08 ,  G11C5/06

Abstract: A semiconductor storage device has a plurality of memory cells that are arranged in a first direction and store first data, a plurality of first wiring pairs that are provided corresponding to the plurality of memory cells arranged in the first direction, and supply second data multiplied with the first data, a second wiring pair that is provided corresponding to two memory cells adjacent to each other in the first direction, and outputs multiplication data obtained by multiplying the first data stored in the two memory cells with the corresponding second data on the first wiring pair, and a third wiring pair in which potentials are changed depending on an addition result only when the addition result obtained by adding two multiplication data output to the second wiring pair to each other is not zero.

公开(公告)号：US11501830B2

公开(公告)日：2022-11-15

申请号：US17348005

申请日：2021-06-15

Applicant: Kioxia Corporation

Inventor： Takeshi Sugimoto ,  Atsushi Kawasumi

IPC: G11C5/14 ,  G11C13/00

Abstract: According to the embodiment, in a first period, the semiconductor storage device maintains the switch in an ON state. In a second period, the semiconductor storage device performs a first operation, a second operation and a third operation while maintaining the switch in an OFF state. The second period is a period after the first period. The first operation is an operation to supply the first pulse having the first polarity from the first pulse generation circuit to the other end of the first capacitive element. The second operation is an operation to supply the second pulse having the second polarity from the second pulse generation circuit to the other end of the second capacitive element. The third operation is an operation to connect the first bit line to the first data line.

公开(公告)号：US20210082476A1

公开(公告)日：2021-03-18

申请号：US16806053

申请日：2020-03-02

Applicant: Kioxia Corporation

Inventor： Hiroyuki HARA ,  Atsushi Kawasumi

IPC: G11C5/06 ,  G11C5/14 ,  H01L23/528 ,  H01L27/24 ,  H01L45/00 ,  G11C13/00

Abstract: A semiconductor memory device according to an embodiment includes: a substrate having a substrate plane extending in a first direction and a second direction intersecting with the first direction; a first wiring provided above the substrate, the first wiring being provided so that a longitudinal direction extends along the first direction; a second wiring provided above the substrate, the second wiring being separated from the first wiring in the first direction, the second wiring being passed by the same virtual line together with the first wiring, the second wiring being provided so that a longitudinal direction extends along the first direction; a third wiring provided between the first wiring and the second wiring, the third wiring being separated from the first wiring and the second wiring, the third wiring being passed by the same virtual line together with the first wiring and the second wiring, the third wiring being provided so that a longitudinal direction extends along the first direction; a fourth wiring provided above the first wiring, the fourth wiring overlapping with the first wiring when viewed from the above, the fourth wiring being provided so that a longitudinal direction extends along the first direction; a fifth wiring provided over the second wiring and the third wiring, the fifth wiring being separated from the fourth wiring in the first direction, the fifth wiring overlapping with the second wiring and the third wiring when viewed from the above, the fifth wiring being passed by the same virtual line together with the fourth wiring, the fifth wiring being provided so that a longitudinal direction extends along the first direction; a sixth wiring provided over the fourth wiring and the fifth wiring, the sixth wiring overlapping with the fourth wiring and the fifth wiring when viewed from the above, the sixth wiring being provided so that a longitudinal direction extends along the first direction; a plurality of seventh wirings provided between the first wiring and the fourth wiring, between the third wiring and the fifth wiring, and between the second wiring and the fifth wiring, the seventh wirings being provided so that a longitudinal direction extends along the second direction; a plurality of eighth wirings provided between the fourth wiring and the sixth wiring and between the fifth wiring and the sixth wiring, the eighth wirings being provided so that a longitudinal direction extends along the second direction; a plurality of first memory cells provided between the first wiring, the second wiring, and the third wiring and the seventh wirings; a plurality of second memory cells provided between the fourth wiring and the seventh wirings and between the fifth wiring and the seventh wirings, the second memory cells overlapping with the first memory cells when viewed from the above; a plurality of third memory cells provided between the fourth wiring and the eighth wirings and between the fifth wiring and the eighth wirings, the third memory cells overlapping with the second memory cells when viewed from the above; a plurality of fourth memory cells provided between the sixth wiring and the eighth wirings, the fourth memory cells overlapping with the third memory cells when viewed from the above; a first connection wiring provided above the substrate, the first connection wiring being provided at least partially under a portion where the first wiring and the third wiring are separated; a second connection wiring provided between the first wiring and the third wiring so that a longitudinal direction extends along a third direction intersecting with the first direction and the second direction, the second connection wiring connecting the sixth wiring and the first connection wiring; a third connection wiring configured to connect the first wiring and the first connection wiring; a fourth connection wiring configured to connect the third wiring and the first connection wiring; a fifth connection wiring provided above the substrate, the fifth connection wiring being provided at least partially under a portion where the second wiring and the third wiring are separated; and a sixth connection wiring provided between the second wiring and the third wiring so that a longitudinal direction extends along the third direction, the sixth connection wiring connecting the fifth wiring and the fifth connection wiring.