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公开(公告)号：US10402963B2
公开(公告)日：2019-09-03
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
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公开(公告)号：US20190114758A1
公开(公告)日：2019-04-18
申请号：US16158774
申请日：2018-10-12
Applicant: KLA-TENCOR CORPORATION
Inventor： Himanshu Vajaria , Jan Lauber , Yong Zhang
IPC: G06T7/00 , G01N21/95 , G01N21/88 , G01N21/956 , G06T7/11
Abstract: The present disclosure describes methods, systems, and articles of manufacture for performing a defect inspection of a die image using adaptive care areas (ACAs). The use of ACAs solve the problem of handling rotations of components that require rotating care areas; handling the situation where each care area requires its own rotation, translation, or affine transformation; and the situation of decoupling intensity differences caused by defects or process variation from intensity differences caused by size variations.
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公开(公告)号：US20190066284A1
公开(公告)日：2019-02-28
申请号：US15803091
申请日：2017-11-03
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang , Yiwu Ding
CPC classification number: G06T7/001 , G06K9/00 , G06T5/50 , G06T7/136 , G06T7/55 , G06T2207/10056 , G06T2207/20152 , G06T2207/20224
Abstract: Defect detection on transparent or translucent wafers can be performed on a die using references from the same die. A first calculated value based on a kernel size, such as a moving mean, is determined. A first difference is determined by subtracting the first calculated value from a pixel intensity. Candidate pixels with a first difference above a threshold are classified. A second calculated value based on a kernel size, such as a local median, is determined. A second difference is determined by subtracting the second calculated value from the pixel intensity. Pixels that include a defect are classified when the second difference is above the threshold.
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公开(公告)号：US10043265B2
公开(公告)日：2018-08-07
申请号：US15221542
申请日：2016-07-27
Applicant: KLA-Tencor Corporation
Inventor： Tong Huang , Xuguang Jiang , Yong Zhang
IPC: G06T7/00
Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.
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公开(公告)号：US20150178907A1
公开(公告)日：2015-06-25
申请号：US14563845
申请日：2014-12-08
Applicant: KLA-Tencor Corporation
Inventor： Yong Zhang , Tao Luo , Chaohong Wu , Stephanie Chen , Lisheng Gao
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T7/33 , G06T2207/30148
Abstract: Methods and systems for detecting defects on a wafer are provided. One method includes altering one or more design clips based on how the one or more design clips will appear in output generated by a wafer inspection process for a wafer. The method also includes aligning the one or more altered design clips to the output generated for the wafer during the wafer inspection process. In addition, the method includes detecting defects on the wafer based on the output aligned to the one or more altered design clips.
Abstract translation: 提供了用于检测晶片上的缺陷的方法和系统。 一种方法包括基于如何将一个或多个设计剪辑出现在由晶片的晶片检查过程产生的输出中来改变一个或多个设计剪辑。 该方法还包括在晶片检查过程中将一个或多个改变的设计剪辑与晶片产生的输出对准。 此外，该方法包括基于与一个或多个改变的设计剪辑对准的输出来检测晶片上的缺陷。
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Patent Agency Ranking
16.发明授权公开(公告)号：US10410338B2
公开(公告)日：2019-09-10
申请号：US14506407
申请日：2014-10-03
Applicant: KLA-Tencor Corporation
Inventor： Hucheng Lee , Lisheng Gao , Jan Lauber , Yong Zhang
Abstract: The correlation of optical images with SEM images includes acquiring a full optical image of a sample by scanning the sample with an optical inspection sub-system, storing the full optical image, identifying a location of a feature-of-interest present in the full optical image with an additional sources, acquiring an SEM image of a portion of the sample that includes the feature at the identified location with a SEM tool, acquiring an optical image portion at the location identified by the additional source, the image portions including a reference structure, correlating the image portion and the SEM image based on the presence of the feature-of-interest and the reference structure in both the image portions and the SEM image, and transferring a location of the feature-of-interest in the SEM image into the coordinate system of the image portion of the full optical image to form a corrected optical image.
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公开(公告)号：US10372113B2
公开(公告)日：2019-08-06
申请号：US15669030
申请日：2017-08-04
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Shifang Li , Yong Zhang
IPC: G06F17/50 , G05B19/418 , G06T7/00 , G06T7/11 , G06T7/174
Abstract: Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color combination, and obtain defocus detection threshold. This can include applying a segment mask, calculating mean intensities of the segment, determining a color combination that optimizes defocus sensitivity, and generating a second segment mask based on pixels that are above a threshold to sensitivity. In a detection step, the selected color combination is calculated, and the threshold is applied to obtain defocus detection result.
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公开(公告)号：US20180088560A1
公开(公告)日：2018-03-29
申请号：US15669030
申请日：2017-08-04
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Shifang Li , Yong Zhang
IPC: G05B19/418 , G06T7/00
CPC classification number: G05B19/418 , G05B2219/45027 , G05B2219/45031 , G06T7/0004 , G06T7/11 , G06T7/174 , G06T2207/10024 , G06T2207/10148 , G06T2207/10152 , G06T2207/30148 , G06T2207/30168
Abstract: Two or more color data can be combined to form a new data source to enhance sensitivity to defocus signal. Defocus detection can be performed on the newly formed data source. In a setup step, a training wafer can be used to select the best color combination, and obtain defocus detection threshold. This can include applying a segment mask, calculating mean intensities of the segment, determining a color combination that optimizes defocus sensitivity, and generating a second segment mask based on pixels that are above a threshold to sensitivity. In a detection step, the selected color combination is calculated, and the threshold is applied to obtain defocus detection result.
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公开(公告)号：US20170284944A1
公开(公告)日：2017-10-05
申请号：US15388577
申请日：2016-12-22
Applicant: KLA-Tencor Corporation
Inventor： Xuguang Jiang , Yong Zhang
Abstract: A method includes receiving one or more images of three or more die of a wafer, determining a median intensity value of a set of pixel intensity values acquired from a same location on each of the three or more die, determining a difference intensity value for the set of pixel intensity values by comparing the median intensity value of the set of pixel intensity values to each pixel intensity value, grouping the pixel intensity values into an intensity bin based on the median intensity value of the set of pixel intensity values, generating an initial noise boundary based on a selected difference intensity value in the intensity bin, generating a final noise boundary by adjusting the initial noise boundary, generating a detection boundary by applying a threshold to the final noise boundary, and classifying one or more pixel intensity values outside the detection boundary as a defect.
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20.发明申请公开(公告)号：US20170270652A1
公开(公告)日：2017-09-21
申请号：US15221542
申请日：2016-07-27
Applicant: KLA-Tencor Corporation
Inventor： Tong Huang , Xuguang Jiang , Yong Zhang
IPC: G06T7/00
CPC classification number: G06T7/001 , G06T2207/20224 , G06T2207/30148
Abstract: A system, method, and computer program product are provided for identifying fabricated component defects using a local adaptive threshold. In use, images are received for target and reference components of a fabricated device. Additionally, a difference image is generated from the target and reference component images, and defect candidates for the target component are identified from the difference image. Further, for each of the identified defect candidates at a location in the difference image: a threshold is determined based on a local area surrounding the location of the defect candidate, and a signal at the location of the defect candidate is compared to the threshold to determine whether the defect candidate is a defect.
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