摘要:
An optical pickup device in which a hologram element has a plurality of different diffraction directions. In the tracking standard state, the hologram element is divided into six areas by a straight line connecting two strength center points of two light beams, and by two straight lines that are perpendicular to the straight line. By adding the amount of light received by an area demarcated by two straight lines that pass the two strength center points, to the amount of light received by one of two outer areas sandwiching the area depending on the type of the light beam, it is possible to obtain a well-balanced tracking error signal for each of the two light beams.
摘要:
An optical pickup device in which a hologram element has a plurality of different diffraction directions. In the tracking standard state, the hologram element is divided into six areas by a straight line connecting two strength center points of two light beams, and by two straight lines that are perpendicular to the straight line. By adding the amount of light received by an area demarcated by two straight lines that pass the two strength center points, to the amount of light received by one of two outer areas sandwiching the area depending on the type of the light beam, it is possible to obtain a well-balanced tracking error signal for each of the two light beams.
摘要:
An optical pickup includes: two laser diodes respectively operable to emit optical beams having different wave lengths; a diffraction grating operable to diffract each optical beam to a zero order diffracted beam and plus and minus first order diffracted beams; a holographic optical element operable to diffract the beams reflected from a recording medium; and photoelectric devices operable to receive the beams diffracted by the holographic optical element, wherein a photoelectric device for generating a tracking error signal and a photoelectric device for generating a focus error signal are disposed on opposite sides with respect to the laser diodes so as to face each other.
摘要:
An optical semiconductor device comprising an emitted beam branching section (61) which branches an emitted light beam from a laser device (51), a reflected light beam branching section (71) which branches a reflected light beam from an information recording medium (3) into light beams different from each other in focused state, servo signal sensing photodetectors (43, 45) which receive the branched reflected light beam in a defocused state, a first diffraction grating provided in the emitted light beam branching section for diffracting the reflected light beam having passed through the reflected light beam flux branching section, and a signal sensing photodetector (47) which receives the reflected light beam diffracted by the first diffraction grating.
摘要:
An optical device includes a light-emitting element for irradiating light onto an information recording medium, a diffraction grating for splitting light emitted from said light-emitting element into a plurality of beams, a focussing member for focussing the plurality of beams onto the information recording medium, a deflection member for deflecting the plurality of beams after they have been reflected from the information recording medium; and a photodetector for receiving the plurality of beams after they have been deflected by the deflection member. The diffraction grating has a first grating region and a second grating region, which have different diffraction efficiencies. The zero-order diffraction light in the first grating region is used as the main beam for reproducing the information signal, and the +1-order or −1-order diffraction light in the second grating regions is used as sub-beams for reproduction of the tracking error signal. Thus, the light amount of both the main beam and the sub-beams can be increased without increasing the light emission of the semiconductor laser element 1, and the S/N ratio of the main beam and the sub-beams can be enhanced.
摘要:
A semiconductor device includes: a first lead having an element mounting portion; a second lead located in a same plane as the first lead, with a predetermined space left between the first lead and the second lead; a molding encapsulant made of a resin for fixing the leads; and a semiconductor element affixed to a top surface of the element mounting portion of the first lead. The molding encapsulant covers at least part of each of upper and lower surfaces of the leads. A resin injection hole mark, which is a mark of a hole through which the encapsulant has been injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead.
摘要:
A first diffractive optical element pattern with a pattern pitch that is no greater than a wavelength of incident light is formed on a first main surface of substrate such as a glass plate. Second diffractive optical element patterns are formed at positions that are respectively incident to positive first-order diffracted light and negative first-order diffracted light produced by the first diffractive optical element pattern. Negative first-order diffracted light produced by each second diffractive optical element pattern is incident upon a boundary face of the substrate at an angle that is smaller than the critical angle, and so exits the substrate.
摘要:
A semiconductor laser device includes a semiconductor laser element, a light beam branching element for branching a light beam emitted from the semiconductor laser element and reflected by an optical recording medium into a plurality of light beams, a light beam reflector for reflecting the light beam branched by the light beam branching element, and a photodetector portion for detecting the light beam reflected by the light beam reflector. The light beam branching element and the photodetector portion are formed on the same substrate. The miniature semiconductor laser device can be assembled without complicated position adjustment and has less deterioration of characteristics arising from misregistration during and after assembly.
摘要:
A semiconductor device includes: a first lead having an element mounting portion; a second lead located in a same plane as the first lead, with a predetermined space left between the first lead and the second lead; a molding encapsulant made of a resin for fixing the leads; and a semiconductor element affixed to a top surface of the element mounting portion of the first lead. The molding encapsulant covers at least part of each of upper and lower surfaces of the leads. A resin injection hole mark, which is a mark of a hole through which the encapsulant has been injected, is left on the encapsulant, and part of the resin injection hole mark is located above the first lead or the second lead, and the remaining part of the resin injection hole mark is located above a space between the first lead and the second lead.
摘要:
A semiconductor device includes an optical semiconductor element, a package including a base made of a metal for mounting the optical semiconductor element, and a cap for encapsulating the optical semiconductor element and a gas by covering the package and the optical semiconductor element. The gas encapsulated with the package has an oxygen concentration not less than 15% and less than 30% and has a dew-point not less than −15° C. and not more than −5° C.