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    Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor
    11.
    发明授权
    Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor 失效
    含有脂环结构的不饱和酰亚胺化合物，其制备方法和中间体

    公开(公告)号：US5444165A

    公开(公告)日：1995-08-22

    申请号：US202068

    申请日：1994-02-25

    申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

    发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

    IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

    CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

    摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

    摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

    Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor
    12.
    发明授权
    Unsaturated imide compounds containing alicyclic structure, process for producing the same and intermediate therefor 失效
    含有脂环结构的不饱和酰亚胺化合物，其制备方法和中间体

    公开(公告)号：US5326881A

    公开(公告)日：1994-07-05

    申请号：US142578

    申请日：1993-10-28

    申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

    发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

    IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

    CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

    摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

    摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

    Filler-containing resin composition suitable for injection molding and transfer molding
    18.
    发明授权
    Filler-containing resin composition suitable for injection molding and transfer molding 失效

    公开(公告)号：US5719225A

    公开(公告)日：1998-02-17

    申请号：US487628

    申请日：1995-06-07

    申请人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

    发明人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

    IPC分类号： C08K7/18 ,  C08L71/10 ,  C08K3/36

    CPC分类号： C08K7/18 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31721

    摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

    Epoxy resin composition, process for producing the same and resin-sealed semiconductor device
    19.
    发明授权
    Epoxy resin composition, process for producing the same and resin-sealed semiconductor device 失效
    环氧树脂组合物，其制造方法和树脂密封型半导体装置

    公开(公告)号：US5644003A

    公开(公告)日：1997-07-01

    申请号：US503668

    申请日：1995-07-18

    申请人： Noriyuki Arai ,  Yutaka Shiomi ,  Hiroshi Nakamura ,  Noriaki Saito

    发明人： Noriyuki Arai ,  Yutaka Shiomi ,  Hiroshi Nakamura ,  Noriaki Saito

    IPC分类号： C08L63/00 ,  H01L23/29 ,  C08F283/04

    CPC分类号： H01L23/293 ,  C08L63/00 ,  H01L2924/0002 ,  Y10S428/901 ,  Y10S525/935 ,  Y10T428/2907 ,  Y10T428/31511 ,  Y10T428/31725

    摘要： An epoxy resin composition which comprises: (a) an epoxy resin having at least two epoxy groups in the molecule, (b) an epoxy resin curing agent, (c) a cure accelerator, (d) an aromatic polyamide pulp and (e) an inorganic filler as the essential components, the aromatic polyamide pulp (d) being contained in an amount of 0.5 to 10% by weight based on the total weight of the component (a), the component (b) and the component (d), and the inorganic filler (e) being contained in an amount of 75 to 94% by weight based on the total weight of the component (a), the component (b), the component (c) and the component (e), and a semiconductor device sealed with the above epoxy resin composition. The cured product of the epoxy resin composition is good in balance of hot impact strength and hot flexural strength and hence, the semiconductor device sealed with the epoxy resin composition is excellent in soldering resistance.

    摘要翻译： 一种环氧树脂组合物，其包含：（a）在分子中具有至少两个环氧基的环氧树脂，（b）环氧树脂固化剂，（c）固化促进剂，（d）芳族聚酰胺纸浆和（e） 作为必要成分的无机填料，以（a）成分，（b）成分和（d）成分的总重量计，含有0.5〜10重量％的芳香族聚酰胺纸浆（d） （e），成分（b），成分（c）和成分（e）的总重量为75〜94重量％的无机填料（e） 和用上述环氧树脂组合物密封的半导体器件。 环氧树脂组合物的固化产物的热冲击强度和热弯曲强度的平衡良好，因此用环氧树脂组合物密封的半导体器件具有优异的耐焊接性。

    Filler-containing resin composition suitable for injection molding and transfer molding
    20.
    发明授权
    Filler-containing resin composition suitable for injection molding and transfer molding 失效
    适用于注射成型和传递成型的含填料的树脂组合物

    公开(公告)号：US5780145A

    公开(公告)日：1998-07-14

    申请号：US885196

    申请日：1997-06-30

    申请人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

    发明人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

    IPC分类号： C08K7/18 ,  C08L71/10 ,  B23B5/16 ,  B23B27/26 ,  B23B27/38

    CPC分类号： C08K7/18 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31721

    摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

    摘要翻译： 一种成型树脂组合物，其在树脂中含有平均粒径不小于0.1μm且不大于1.5μm（x组分）的球状粉末的填料，其平均粒径不为球状粉末 小于2μm，不大于15μm（y成分）和平均粒径不小于20μm且不大于70μm（z成分）的球状粉末，其中x， 基于x，y和z成分的总体积的y和z成分不小于体积的10体积％且不大于24体积％，不小于体积的0.1体积％且不大于36体积％ 小于57体积％且不大于76体积％，即使在加载高比例填料时也具有优异的流动性。 此外，由于固化物中存在的树脂本身，其固化物的吸湿性和热膨胀系数增加，其固化产物降低。 此外，用树脂组合物密封的半导体封装具有高封装抗裂性。 该树脂组合物适合用作半导体的密封材料，并且广泛适用于需要高填料填充量的其它用途。