公开(公告)号：US5498687A

公开(公告)日：1996-03-12

申请号：US411880

申请日：1995-03-28

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C08G59/18

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含有4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5750789A

公开(公告)日：1998-05-12

申请号：US536281

申请日：1995-09-29

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12 ,  C07C211/54

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5444165A

公开(公告)日：1995-08-22

申请号：US202068

申请日：1994-02-25

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5326881A

公开(公告)日：1994-07-05

申请号：US142578

申请日：1993-10-28

申请人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

发明人： Yasuhiro Hirano ,  Yasuhiro Endo ,  Kazuo Takebe ,  Mitsuhiro Shibata ,  Shuichi Kanagawa ,  Yutaka Shiomi ,  Masatsugu Akiba ,  Shinichiro Kitayama

IPC分类号： C07C205/38 ,  C07C217/90 ,  C07D207/44 ,  C07D207/452 ,  C08G73/12

CPC分类号： C07D207/452 ,  C07C205/38 ,  C07C217/90 ,  C08G73/12

摘要： An unsaturated imide compound represented by formula (1): ##STR1## wherein Q is an alicyclic structure-containing hydrocarbon group having 4-20 carbon atoms; each of R.sub.1, R.sub.2, R.sub.3, R.sub.4, R.sub.i and R.sub.j represents a hydrogen atom, a halogen atom, a hydrocarbon group having 1-6 carbon atoms or a halogen-containing hydrocarbon group having 1-6 carbon atoms; each of a, b, c, d, e and f represents an integer of 0 to 4 satisfying a+b.ltoreq.4, c+d.ltoreq.4 and e+f.ltoreq.4 and D represents a divalent organic group having 2-24 carbon atoms and an ethylenically unsaturated double bond, a process for producing the unsaturated imide compound of formula (1) and intermediates for producing the unsaturated imide compound of formula (1). The unsaturated imide compound of formula (1) is well soluble in organic solvents and can give cured products excellent in heat resistance, low water absorption and flexibility.

摘要翻译： 由式（1）表示的不饱和酰亚胺化合物：其中Q是含4-20个碳原子的含脂环结构的烃基; R 1，R 2，R 3，R 4，R 1和R 3中的每一个表示氢原子，卤素原子，具有1-6个碳原子的烃基或含有1-6个碳原子的含卤素烃基; a，b，c，d，e和f中的每一个表示满足+ b = 4，c + d 4和e + f 4的0〜4的整数，D表示二价有机 具有2-24个碳原子和烯属不饱和双键的基团，制备式（1）的不饱和酰亚胺化合物的方法和用于制备式（1）的不饱和酰亚胺化合物的中间体。 式（1）的不饱和酰亚胺化合物在有机溶剂中很好溶解，可以得到耐热性，吸水性和柔软性优异的固化产物。

公开(公告)号：US5780145A

公开(公告)日：1998-07-14

申请号：US885196

申请日：1997-06-30

申请人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

发明人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

IPC分类号： C08K7/18 ,  C08L71/10 ,  B23B5/16 ,  B23B27/26 ,  B23B27/38

CPC分类号： C08K7/18 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31721

摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

摘要翻译： 一种成型树脂组合物，其在树脂中含有平均粒径不小于0.1μm且不大于1.5μm（x组分）的球状粉末的填料，其平均粒径不为球状粉末 小于2μm，不大于15μm（y成分）和平均粒径不小于20μm且不大于70μm（z成分）的球状粉末，其中x， 基于x，y和z成分的总体积的y和z成分不小于体积的10体积％且不大于24体积％，不小于体积的0.1体积％且不大于36体积％ 小于57体积％且不大于76体积％，即使在加载高比例填料时也具有优异的流动性。 此外，由于固化物中存在的树脂本身，其固化物的吸湿性和热膨胀系数增加，其固化产物降低。 此外，用树脂组合物密封的半导体封装具有高封装抗裂性。 该树脂组合物适合用作半导体的密封材料，并且广泛适用于需要高填料填充量的其它用途。

公开(公告)号：US5719225A

公开(公告)日：1998-02-17

申请号：US487628

申请日：1995-06-07

申请人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

发明人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Yutaka Shiomi ,  Noriaki Saito

IPC分类号： C08K7/18 ,  C08L71/10 ,  C08K3/36

CPC分类号： C08K7/18 ,  Y10S428/901 ,  Y10T428/25 ,  Y10T428/259 ,  Y10T428/31511 ,  Y10T428/31721

摘要： A molding resin composition containing, in a resin, a filler comprising a globular powder of which mean particle diameter is not smaller than 0.1 .mu.m and not greater than 1.5 .mu.m (x component), a globular powder of which mean particle diameter is not smaller than 2 .mu.m and not greater than 15 .mu.m (y component) and a globular powder of which mean particle diameter is not smaller than 20 .mu.m and not greater than 70 .mu.m (z component), wherein proportions of the x, y and z components based on the total volume of x, y and z components are not smaller than 10% by volume and not greater than 24% by volume, not smaller than 0.1% by volume and not greater than 36% by volume and not smaller than 57% by volume and not greater than 76% by volume, exhibits an excellent fluidity even when loaded with a high percentage of filler. Further, their cured products are lowered in the moisture absorption and thermal expansion coefficient of which increases result from the resin itself present in the cured product. Further, a semi-conductor package sealed with the resin composition exhibits a high package crack resistance. The resin composition is suitable for use as a sealing material for semi-conductors, and extensively applicable to other uses requiring a high-percentage loading of filler.

公开(公告)号：US5252687A

公开(公告)日：1993-10-12

申请号：US677451

申请日：1991-03-29

申请人： Yutaka Shiomi ,  Shigeki Naitoh ,  Yasuhiro Hirano ,  Kazuo Takebe

发明人： Yutaka Shiomi ,  Shigeki Naitoh ,  Yasuhiro Hirano ,  Kazuo Takebe

IPC分类号： C08G8/28 ,  C08G77/42 ,  C08G77/50 ,  C08K5/3415 ,  C08L61/14 ,  C08L79/08 ,  H05K1/03 ,  C08F283/04

CPC分类号： C08L61/14 ,  C08G77/42 ,  C08G77/50 ,  C08G8/28 ,  C08K5/3415 ,  C08L79/085 ,  H05K1/0353

摘要： A thermosetting resin composition is provide, which contains a compound of ##STR1## wherein substituents R.sub.1 -R.sub.6 each represents a hydrogen atom or a saturated alkyl group having 1-6 carbon atoms, substituents R.sup.7 -R.sup.12 each represents a hydrogen atom, a saturated alkyl group having 1-4 carbon atoms or an alkoxy group having 1-4 carbon atoms, X.sub.a -X.sub.e each represents a hydrogen atom, a chlorine atom or a bromine atome, and the average repeating unit number n denotes a numeral from 0 to 5, and a polyamide compound having two or more maleimide groups and, if desired, a compound of ##STR2## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicylic epoxy group, l denotes a numeral in the range of 0-500, and m denotes a numeral in the range of 1-500, or ##STR3## wherein R.sub.1 and R.sub.2 each represents a methyl group or a phenyl group, and R.sub.3 represents a hydrogen atom or a functional group containing an amino group, a glycidyl group or an alicyclic epoxy group, and p denotes a numeral in the range of 0-500. The composition is useful for electronic parts.

公开(公告)号：US5854370A

公开(公告)日：1998-12-29

申请号：US863300

申请日：1997-05-27

申请人： Akira Yokota ,  Yasuhiro Hirano ,  Masatsugu Akiba ,  Hiroshi Nakamura ,  Shigeki Naitoh

发明人： Akira Yokota ,  Yasuhiro Hirano ,  Masatsugu Akiba ,  Hiroshi Nakamura ,  Shigeki Naitoh

IPC分类号： C07D303/24 ,  C08G59/06 ,  C08G59/24

CPC分类号： C08G59/063 ,  C07D303/24 ,  C08G59/245

摘要： The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

摘要翻译： 本发明提供了一种具有比迄今已知的反茋系环氧树脂更低的熔点和更低的粘度的顺式 - 二苯乙烯型环氧树脂。 二苯乙烯型环氧树脂的顺式异构体含量基本上为100％，或者替代地，至少约10％，其余为反式异构体，并且基于以下通式（1）： （1）其中R1至R8独立地为非环状或环状烷基，氢原子或卤素原子。 还公开了这些环氧树脂的生产方法。

公开(公告)号：US5939473A

公开(公告)日：1999-08-17

申请号：US639506

申请日：1996-04-29

申请人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Akira Yokota ,  Hiroshi Nakamura ,  Shigeki Naitoh

发明人： Yasuhiro Hirano ,  Masatsugu Akiba ,  Akira Yokota ,  Hiroshi Nakamura ,  Shigeki Naitoh

IPC分类号： C07C39/21 ,  C07C39/215 ,  C07D301/28 ,  C07D303/23 ,  C07D303/24 ,  C08G59/24 ,  H01L23/29 ,  H05K1/03

CPC分类号： C07D303/24 ,  C07C39/21 ,  C07C39/215 ,  C08G59/245 ,  H01L23/293 ,  H01L2924/0002 ,  H05K1/0326

摘要： The stilbene epoxy resin having two different aryl groups and an epoxy resin mixture including this stilbene epoxy resin have lower melting points than those of the stilbene epoxy resin having two identical aryl groups and the epoxy resin mixture of the latter stilbene epoxy resin. Compared with the conventional resins, the present resin or resin mixture has improved working and molding properties, which shortens the time required for the molding and working process, resulting in economic advantages and a preferred affect on productivity. The present epoxy resin or resin mixture is preferably used as an adhesive, a coating, an insulating material, an electrical or electronic material for laminated sheets or the like. It is especially suited for use as material for encapsulating electronic parts.

摘要翻译： 具有两个不同芳基的二苯乙烯环氧树脂和包含该二苯乙烯环氧树脂的环氧树脂混合物具有比具有两个相同芳基的二苯乙烯环氧树脂和后者二苯乙烯环氧树脂的环氧树脂混合物的熔点低的熔点。 与常规树脂相比，本发明的树脂或树脂混合物具有改进的加工和成型性能，缩短了成型和加工过程所需的时间，从而产生经济上的优点和对生产率的优选影响。 本发明的环氧树脂或树脂混合物优选用作粘合剂，涂料，绝缘材料，层压片材的电气或电子材料等。 它特别适用于封装电子部件的材料。

公开(公告)号：US5705596A

公开(公告)日：1998-01-06

申请号：US657363

申请日：1996-06-03

申请人： Akira Yokota ,  Yasuhiro Hirano ,  Masatsugu Akiba ,  Hiroshi Nakamura ,  Shigeki Naitoh

发明人： Akira Yokota ,  Yasuhiro Hirano ,  Masatsugu Akiba ,  Hiroshi Nakamura ,  Shigeki Naitoh

IPC分类号： C07D303/24 ,  C08G59/06 ,  C08G59/24

CPC分类号： C08G59/063 ,  C07D303/24 ,  C08G59/245

摘要： The invention provides a cis-stilbene type epoxy resin having lower melting point and lower viscosity than the trans-stilbene type epoxy resin hitherto known. The stilbene type epoxy resin has a cis-isomer content of essentially 100%, or in the alternative, at least about 10% with the rest being the trans-isomer, and is based on the following general formula (1): ##STR1## wherein R.sub.1 to R.sub.8 are independently an acyclic or cyclic alkyl group, a hydrogen atom, or a halogen atom. Production processes for these epoxy resins are also disclosed.

摘要翻译： 本发明提供了一种具有比迄今已知的反茋系环氧树脂更低的熔点和更低的粘度的顺式 - 二苯乙烯型环氧树脂。 二苯乙烯型环氧树脂的顺式异构体含量基本上为100％，或者替代地，至少约10％，其余为反式异构体，并且基于以下通式（1）： （1）其中R1至R8独立地为非环状或环状烷基，氢原子或卤素原子。 还公开了这些环氧树脂的生产方法。