公开(公告)号：US08119925B2

公开(公告)日：2012-02-21

申请号：US12390010

申请日：2009-02-20

申请人： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano

发明人： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano

IPC分类号： H05K1/00

CPC分类号： H05K3/4641 ,  H05K3/445 ,  H05K3/4608 ,  H05K2201/0281 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/09809 ,  Y10T428/24331

摘要： The core layer of a core substrate is made of carbon fibers impregnated with resin. When the temperature of the core layer increases, the core layer suffers from an increase in the thickness because of thermal expansion of the resin. The core layer is sandwiched between the insulating layers containing glass fibers. The insulating layers serve to suppress an increase in the thickness of the core layer resulting from the thermal expansion of the core layer. Thermal stress is suppressed in the core substrate.

摘要翻译： 核心基材的芯层由浸渍有树脂的碳纤维制成。 当芯层的温度升高时，由于树脂的热膨胀，芯层的厚度增加。 芯层夹在包含玻璃纤维的绝缘层之间。 绝缘层用于抑制由芯层的热膨胀产生的芯层的厚度的增加。 核心基板中的热应力被抑制。

公开(公告)号：US20090084590A1

公开(公告)日：2009-04-02

申请号：US12188257

申请日：2008-08-08

申请人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

发明人： Hideaki YOSHIMURA ,  Kenji Fukuzono ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Takashi Nakagawa ,  Shin Hirano ,  Takashi Kanda

IPC分类号： H05K1/00

CPC分类号： H05K1/0366 ,  H05K1/0271 ,  H05K1/056 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/068 ,  H05K2201/09145 ,  Y10T428/24917 ,  Y10T428/24926

摘要： A circuit board has a low thermal expansion coefficient that suits the thermal expansion coefficient of an element to be mounted thereupon and can prevent the occurrence of delamination and cracking of a core layer when the circuit board is used in a low temperature environment. The circuit board is constructed by laminating a core layer and at least one wiring layer, where the at least one wiring layer has slightly smaller external dimensions in a planar direction than the core layer.

摘要翻译： 电路板具有适合要安装的元件的热膨胀系数的低热膨胀系数，并且可以防止当在低温环境中使用电路板时芯层的分层和破裂的发生。 电路板通过层叠芯层和至少一个布线层而构成，其中至少一个布线层在平面方向上具有比芯层稍小的外部尺寸。

公开(公告)号：US08110749B2

公开(公告)日：2012-02-07

申请号：US12390168

申请日：2009-02-20

申请人： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano

发明人： Hideaki Yoshimura ,  Kenji Iida ,  Tomoyuki Abe ,  Yasutomo Maehara ,  Shin Hirano

IPC分类号： H05K1/16

CPC分类号： H05K3/445 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/09536 ,  H05K2201/0959 ,  H05K2201/096 ,  H05K2201/09609 ,  H05K2201/09809

摘要： Large-sized through holes are formed in a core layer of a printed wiring board. Large-sized vias are formed in the shape of a cylinder along the inward wall surfaces of the large-sized through holes located within a specific area. A filling material fills the inner space of the large-sized via. A small-sized through hole penetrates through the corresponding filling material along the longitudinal axis of the small-sized through hole. A small-sized via is formed in the shape of a cylinder along the inward wall surface of the small-sized through hole. The filling material and the core layer are uniformly distributed within the specific area in the in-plane direction of the core substrate. This results in suppression of uneven distribution of thermal stress in the core layer in the in-plane direction of the core layer.

摘要翻译： 在印刷电路板的芯层中形成大尺寸的通孔。 大尺寸通孔沿着位于特定区域内的大尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料填充大尺寸通孔的内部空间。 小尺寸的通孔穿过相应的填充材料沿着小尺寸通孔的纵向轴线。 小尺寸的通孔沿着小尺寸通孔的内壁表面形成为圆柱体的形状。 填充材料和芯层均匀地分布在芯基板的面内方向的特定区域内。 这导致抑制芯层在芯层的面内方向上的热应力的不均匀分布。

公开(公告)号：US08178791B2

公开(公告)日：2012-05-15

申请号：US12331113

申请日：2008-12-09

申请人： Tomoyuki Abe ,  Kazumasa Saito ,  Shin Hirano ,  Kenji Iida

发明人： Tomoyuki Abe ,  Kazumasa Saito ,  Shin Hirano ,  Kenji Iida

IPC分类号： H05K1/11 ,  H01K3/10

CPC分类号： H05K3/445 ,  H05K3/42 ,  H05K3/4608 ,  H05K2201/0323 ,  H05K2201/0347 ,  H05K2201/09563 ,  H05K2201/096 ,  H05K2201/09827 ,  H05K2203/135 ,  Y10T29/49165

摘要： A wiring substrate includes a core substrate having a first main surface and a mutually opposing second main surface, the second main surface having a conductive property. A first through hole penetrates a core substrate. A first conductive layer extends from the first main surface to the second main surface via the first through hole. An insulating layer is formed on the first conductive layer. A second through hole has the insulating layer as an interior wall. And a second conductive layer is formed inside the second through hole.

摘要翻译： 布线基板包括具有第一主表面和相互相对的第二主表面的芯基板，第二主表面具有导电性能。 第一通孔穿透芯基板。 第一导电层经由第一通孔从第一主表面延伸到第二主表面。 绝缘层形成在第一导电层上。 第二通孔具有作为内壁的绝缘层。 并且第二导电层形成在第二通孔的内部。