POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD
    14.
    发明申请
    POSITIVE RESIST COMPOSITION AND PATTERN FORMING METHOD 审中-公开
    积极抵抗组成和图案形成方法

    公开(公告)号:US20090023096A1

    公开(公告)日:2009-01-22

    申请号:US12176589

    申请日:2008-07-21

    IPC分类号: G03F7/004

    摘要: A positive resist composition, includes: (A) a compound capable of generating an acid upon irradiation with actinic rays or radiation; (B) a resin of which solubility in an alkali developer increases under an action of an acid, the resin containing 80 mol % or more of an aromatic group-free copolymerization component; and (C) a compound capable of decomposing under an action of an acid to generate an acid, wherein an absolute value of difference in pKa between the acid generated from the component (A) and the acid generated from the component (C) is 2 or less, and an absolute value of difference in molecular weight between the acid generated from the component (A) and the acid generated from the component (C) is 50 or less.

    摘要翻译: 正型抗蚀剂组合物包括:(A)在用光化射线或辐射照射时能够产生酸的化合物; (B)在酸的作用下在碱性显影剂中的溶解度增加的树脂,所述树脂含有80摩尔%以上的无芳族基团的共聚成分; 和(C)能够在酸的作用下分解以产生酸的化合物,其中由组分(A)产生的酸与由组分(C)产生的酸之间的pKa的差异绝对值为2 (A)生成的酸与由成分(C)生成的酸之间的分子量差的绝对值为50以下。