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公开(公告)号:US07470923B2
公开(公告)日:2008-12-30
申请号:US11370945
申请日:2006-03-09
IPC分类号: H01L47/00
CPC分类号: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
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公开(公告)号:US20090250680A1
公开(公告)日:2009-10-08
申请号:US12487492
申请日:2009-06-18
IPC分类号: H01L47/00
CPC分类号: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。
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公开(公告)号:US07335907B2
公开(公告)日:2008-02-26
申请号:US10790881
申请日:2004-03-03
IPC分类号: H01L47/00
CPC分类号: G11C11/5678 , G11C13/0004 , G11C2213/79 , H01L27/2436 , H01L27/2454 , H01L27/2463 , H01L45/06 , H01L45/1213 , H01L45/1233 , H01L45/1253 , H01L45/126 , H01L45/144 , H01L45/1625
摘要: A phase change memory device is provided which is constituted by memory cells using memory elements and select transistors and having high heat resistance to be capable of an operation at 140 degrees or higher. As a device configuration, a recording layer of which, of Zn—Ge—Te, content of Zn, Cd or the like is 20 atom percent or more, content of at least one element selected from the group consisting of Ge and Sb is less than 40 atom percent, and content of Te is 40 atom percent or more is used. It is thereby possible to implement the memory device usable for an application which may be performed at a high temperature such as an in-vehicle use.
摘要翻译: 提供一种相变存储器件,其由使用存储元件和选择晶体管的存储器单元构成,并且具有高耐热性能够在140度以上的操作。 作为器件结构,其中Zn-Ge-Te,Zn,Cd等的含量为20原子%以上的记录层选自Ge和Sb中的至少一种元素的含量较少 40原子%以上,Te含量为40原子%以上。 由此,可以实现可以在诸如车载用途的高温下执行的应用的存储装置。
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公开(公告)号:US20080048166A1
公开(公告)日:2008-02-28
申请号:US11907989
申请日:2007-10-19
IPC分类号: H01L47/00
CPC分类号: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。
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公开(公告)号:US20060157680A1
公开(公告)日:2006-07-20
申请号:US11370945
申请日:2006-03-09
IPC分类号: H01L29/04
CPC分类号: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
摘要翻译: 通过高速非易失性相变存储器,提高了刷新次数的可靠性。 在使用MISFET作为选择存储单元的晶体管的相变存储器的存储单元形成区域中,形成了使用相变材料的包括电阻元件的存储单元的相变材料层,用于常用。 结果,减少了通过蚀刻对存储单元元件的隔离而导致的相变材料的形状变化和组成变化,从而提高了存储单元的刷新次数的可靠性。
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公开(公告)号:US20090108247A1
公开(公告)日:2009-04-30
申请号:US10587079
申请日:2004-12-20
IPC分类号: H01L47/00
CPC分类号: G11C13/0004 , G11C13/04 , G11C13/047 , G11C2213/56 , G11C2213/71 , H01L27/2436 , H01L27/2463 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/1625
摘要: A phase-change memory device including a memory cell having a memory element and a select transistor is improved in heat resistance so that it may be operable at 145° C. or higher.The memory layer is used which has a content of Zn or Cd of 20 at % or more and 50 at % or less, a content of Ge or Sb of 5 at % or more and 25 at % or less, and a content of Te of 40 at % or more and 65 at % or less in Zn-Ge-Te.
摘要翻译: 包括具有存储元件和选择晶体管的存储单元的相变存储器件的耐热性得到改善,使得其在145℃以上可操作。 使用具有20原子%以上且50原子%以下的Zn或Cd含量的记忆层,Ge或Sb的含量为5原子%以上且25原子%以下,Te含量 在Zn-Ge-Te中为40at%以上且65at%以下。
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公开(公告)号:US07071485B2
公开(公告)日:2006-07-04
申请号:US10790764
申请日:2004-03-03
CPC分类号: H01L27/2436 , H01L27/2463 , H01L27/2472 , H01L45/06 , H01L45/1233 , H01L45/126 , H01L45/144 , H01L45/16
摘要: With a high-speed nonvolatile phase change memory, reliability in respect of the number of refresh times is enhanced. In a memory cell forming area of a phase change memory using a MISFET as a transistor for selection of memory cells, a phase change material layer of a memory cell comprising a resistor element, using a phase change material, is formed for common use. As a result, variation in shape and a change in composition of the phase change material, caused by isolation of memory cell elements by etching, are reduced, thereby enhancing reliability of memory cells, in respect of the number of refresh times.
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公开(公告)号:US20090014770A1
公开(公告)日:2009-01-15
申请号:US12169789
申请日:2008-07-09
申请人: Motoyasu Terao , Hideyuki Matsuoka , Naohiko Irie , Yoshitaka Sasago , Riichiro Takemura , Norikatsu Takaura
发明人: Motoyasu Terao , Hideyuki Matsuoka , Naohiko Irie , Yoshitaka Sasago , Riichiro Takemura , Norikatsu Takaura
IPC分类号: H01L29/00
CPC分类号: H01L45/145 , G11C11/5614 , G11C13/0011 , G11C2213/11 , G11C2213/79 , H01L27/2409 , H01L27/2436 , H01L27/2463 , H01L27/2481 , H01L45/085 , H01L45/1233 , H01L45/1266 , H01L45/142 , H01L45/143 , H01L45/144 , H01L45/146
摘要: A technique that can realize high integration even for multilayered three-dimensional structures at low costs by improving the performance of the semiconductor device having recording or switching functions by employing a device structure that enables high precision controlling of the movement of ions in the solid electrolyte. The semiconductor element of the device is formed as follows; two or more layers are deposited with different components respectively between a pair of electrodes disposed separately in the vertical (z-axis) direction, then a pulse voltage is applied between those electrodes to form a conductive path. The resistance value of the path changes according to an information signal. Furthermore, a region is formed at a middle part of the conductive path. The region is used to accumulate a component that improves the conductivity of the path, thereby enabling the resistance value (rate) to response currently to the information signal. More preferably, an electrode should also be formed at least in either the x-axis or y-axis direction to apply a control voltage to the electrode.
摘要翻译: 通过采用能够高精度地控制固体电解质中的离子的运动的装置结构,通过提高具有记录或切换功能的半导体器件的性能,可以以低成本实现多层次三维结构的高集成度的技术。 器件的半导体元件如下形成; 分别在垂直(z轴)方向上分开设置的一对电极之间分别沉积两层或更多层,然后在这些电极之间施加脉冲电压以形成导电路径。 路径的电阻值根据信息信号而变化。 此外,在导电路径的中间部分形成区域。 该区域用于累积改善路径的导电性的分量,从而使电阻值(速率)能够当前响应于信息信号。 更优选地,电极也应至少形成在x轴方向或y轴方向上,以向电极施加控制电压。
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公开(公告)号:US07829930B2
公开(公告)日:2010-11-09
申请号:US12169789
申请日:2008-07-09
申请人: Motoyasu Terao , Hideyuki Matsuoka , Naohiko Irie , Yoshitaka Sasago , Riichiro Takemura , Norikatsu Takaura
发明人: Motoyasu Terao , Hideyuki Matsuoka , Naohiko Irie , Yoshitaka Sasago , Riichiro Takemura , Norikatsu Takaura
IPC分类号: H01L27/108
CPC分类号: H01L45/145 , G11C11/5614 , G11C13/0011 , G11C2213/11 , G11C2213/79 , H01L27/2409 , H01L27/2436 , H01L27/2463 , H01L27/2481 , H01L45/085 , H01L45/1233 , H01L45/1266 , H01L45/142 , H01L45/143 , H01L45/144 , H01L45/146
摘要: A technique that can realize high integration even for multilayered three-dimensional structures at low costs by improving the performance of the semiconductor device having recording or switching functions by employing a device structure that enables high precision controlling of the movement of ions in the solid electrolyte. The semiconductor element of the device is formed as follows; two or more layers are deposited with different components respectively between a pair of electrodes disposed separately in the vertical (z-axis) direction, then a pulse voltage is applied between those electrodes to form a conductive path. The resistance value of the path changes according to an information signal. Furthermore, a region is formed at a middle part of the conductive path. The region is used to accumulate a component that improves the conductivity of the path, thereby enabling the resistance value (rate) to response currently to the information signal. More preferably, an electrode should also be formed at least in either the x-axis or y-axis direction to apply a control voltage to the electrode.
摘要翻译: 通过采用能够高精度地控制固体电解质中的离子的运动的装置结构,通过提高具有记录或切换功能的半导体器件的性能,可以以低成本实现多层次三维结构的高集成度的技术。 器件的半导体元件如下形成; 分别在垂直(z轴)方向上分开设置的一对电极之间分别沉积两层或更多层,然后在这些电极之间施加脉冲电压以形成导电路径。 路径的电阻值根据信息信号而变化。 此外,在导电路径的中间部分形成区域。 该区域用于累积改善路径的导电性的分量,从而使电阻值(速率)能够当前响应于信息信号。 更优选地,电极也应至少形成在x轴方向或y轴方向上,以向电极施加控制电压。
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公开(公告)号:US08618523B2
公开(公告)日:2013-12-31
申请号:US12302740
申请日:2006-05-31
申请人: Norikatsu Takaura , Yuichi Matsui , Motoyasu Terao , Yoshihisa Fujisaki , Nozomu Matsuzaki , Kenzo Kurotsuchi , Takahiro Morikawa
发明人: Norikatsu Takaura , Yuichi Matsui , Motoyasu Terao , Yoshihisa Fujisaki , Nozomu Matsuzaki , Kenzo Kurotsuchi , Takahiro Morikawa
IPC分类号: H01L47/00
CPC分类号: G11C13/0004 , G11C8/08 , G11C13/0028 , G11C2213/79 , H01L27/2436 , H01L45/06 , H01L45/12 , H01L45/1233 , H01L45/144 , H01L45/1625 , H01L45/1675
摘要: On an insulating film (41) in which a plug (43) as a lower electrode is embedded, a laminated layer pattern of an insulating film (51) made of tantalum oxide, a recording layer (52) made of Ge—Sb—Te based chalcogenide to which indium is introduced and an upper electrode film (53) made of tungsten or tungsten alloy is formed, thereby forming a phase change memory. By interposing the insulating film (51) between the recording layer (52) and the plug (43), an effect of reducing programming current of a phase change memory and an effect of preventing peeling of the recording layer (52) can be achieved. Further, by using the Ge—Sb—Te based chalcogenide to which indium is introduced as the recording layer (52), the difference in work function between the insulating film (51) and the recording layer (52) is increased, and the programming voltage of the phase change memory can be reduced.
摘要翻译: 在嵌入作为下电极的插头(43)的绝缘膜(41)上,由氧化钽构成的绝缘膜(51)的叠层图案,由Ge-Sb-Te制成的记录层(52) 引入铟的硫属化合物和由钨或钨合金制成的上电极膜(53),从而形成相变存储器。 通过将绝缘膜(51)插入在记录层(52)和插塞(43)之间,可以实现降低相变存储器的编程电流的效果和防止记录层(52)的剥离的效果。 此外,通过使用引入了铟的Ge-Sb-Te类硫族化物作为记录层(52),绝缘膜(51)和记录层(52)之间的功函数差增大,编程 可以减小相变存储器的电压。
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