-
公开(公告)号：US11374150B2
公开(公告)日：2022-06-28
申请号：US16858167
申请日：2020-04-24
Applicant: LG ELECTRONICS INC.
Inventor： Junghoon Kim , Hyunwoo Cho , Mihee Heo
IPC: H01L33/00 , H01L25/075 , H01L33/62
Abstract: A display device can include a plurality of semiconductor light emitting diodes; first and second wiring electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes; a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode that generate an electric field when a current is supplied thereto; a dielectric layer disposed to cover the plurality of pair electrodes; and a covalent bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes, and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes, wherein the first wiring electrode and the second wiring electrode are located at opposite sides of the plurality of pair electrodes based on the plurality of semiconductor light emitting diodes.
-
12.发明授权公开(公告)号：US10707377B2
公开(公告)日：2020-07-07
申请号：US16415583
申请日：2019-05-17
Applicant: LG ELECTRONICS INC.
Inventor： Junghoon Kim , Changseo Park , Bongchu Shim , Byoungkwon Cho , Hyunwoo Cho
Abstract: The present disclosure relates a display device including a semiconductor light emitting device, and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed at an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer, and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction, wherein when the semiconductor light emitting device is assembled into the receiving groove, the first conductive semiconductor layer has an asymmetrical shape with respect to at least one direction so that the first conductive electrode and the second conductive electrode are arranged at preset positions.
-
13.发明授权公开(公告)号：US12243964B2
公开(公告)日：2025-03-04
申请号：US17633520
申请日：2019-08-21
Applicant: LG ELECTRONICS INC.
Inventor： Wonjae Chang , Jisoo Ko , Hyeyoung Yang , Hyunwoo Cho
Abstract: Provided in the present specification are a substrate structure having an exclusive design for allowing assembly on a substrate, at the same time, of a plurality of semiconductor light emitting devices having various colors, and a new type of semiconductor light emitting device, such that the semiconductor light emitting devices can be quickly and accurately assembled on the substrate with a concern about color mixing. Here, at least one of the plurality of semiconductor light emitting devices, according to one embodiment of the present invention, comprises a bump part located in the lateral direction of a surface to be assembled. An assembly groove in which the semiconductor light emitting device including the bump part is assembled is provided with a protrusion part facing toward the inside of the assembly groove.
-
14.发明授权公开(公告)号：US12080689B2
公开(公告)日：2024-09-03
申请号：US17632058
申请日：2019-09-03
Applicant: LG ELECTRONICS INC.
Inventor： Dohee Kim , Gunho Kim , Yongil Shin , Bongchu Shim , Hyunwoo Cho
IPC: H01L25/075 , H01L23/00 , H01L33/00
CPC classification number: H01L25/0753 , H01L24/83 , H01L24/95 , H01L24/29 , H01L24/32 , H01L33/007 , H01L33/0093 , H01L2224/29021 , H01L2224/32237 , H01L2224/83801 , H01L2224/95101 , H01L2224/95133 , H01L2224/95136
Abstract: The present invention relates to a display device having a structure in which an assembly substrate on which self-assembly has taken place can be used as a final substrate, and a method for manufacturing same. According to an embodiment of the present invention, first-conductive-type electrodes of vertical-type semiconductor light-emitting elements can be connected to seed metal, which is used as a wiring electrode, via a solder part, and thus there is the effect of directly using, as a final substrate, an assembly substrate on which the vertical-type semiconductor light-emitting elements are self-assembled, without an additional transfer process.
-
公开(公告)号：US12057519B2
公开(公告)日：2024-08-06
申请号：US17289549
申请日：2019-10-08
Applicant: LG ELECTRONICS INC.
Inventor： Hyunwoo Cho , Bongchu Shim
IPC: H01L33/00 , H01L25/075 , H01L21/68
CPC classification number: H01L33/005 , H01L25/0753 , H01L21/68
Abstract: Discussed is a self-assembly apparatus of a semiconductor light emitting device, the self-assembly apparatus including a fluid chamber configured to accommodate a plurality of semiconductor light emitting devices, each semiconductor light emitting device having a magnetic body; a magnet disposed to be spaced apart from the fluid chamber and configured to apply a magnetic force to the plurality of semiconductor light emitting devices; and a position controller connected to the magnet, and configured to control a position of the magnet; and a power supply configured to induce formation of an electric field on a substrate placed at an assembly position so that the plurality of semiconductor light emitting devices are seated at preset positions on the substrate while being moved due to a positional change of the magnet, wherein the position controller transfers the magnet in one direction while rotating the magnet about a rotation axis for the magnet.
-
Patent Agency Ranking
16.发明授权公开(公告)号：US11996393B2
公开(公告)日：2024-05-28
申请号：US17013201
申请日：2020-09-04
Applicant: LG ELECTRONICS INC.
Inventor： Bongchu Shim , Hyunwoo Cho
IPC: H01L25/075 , H01L21/67 , H01L33/00
CPC classification number: H01L25/0753 , H01L21/67253 , H01L33/005
Abstract: The embodiment relates to an intelligent integrated assembly and transfer apparatus. The intelligent integrated assembly and transfer apparatus according to the embodiment can include a fluid chamber 300, a roller unit 200 and assembly inspection unit 500. The fluid chamber 300 can accommodate semiconductor light emitting devices 150. Semiconductor light emitting devices 150 can be assembled on an assembly substrate 210. The assembly substrate 210 can be mounted on the roller unit 200. The roller unit 200 can rotate the assembly substrate 210. The assembly inspection unit 500 can inspect the semiconductor light emitting devices 150 assembled on the assembly substrate 210. The roller unit 200 can include a roller rotated part 220 where the assembly substrate 210 is mounted and rotated, a roller driving part 230 for rotating the roller rotated part 220, and a magnet head unit 400 for applying magnetic force to the semiconductor light emitting devices 150 to be assembled on the assembly substrate 210.
-
公开(公告)号：US11715812B2
公开(公告)日：2023-08-01
申请号：US17832221
申请日：2022-06-03
Applicant: LG ELECTRONICS INC.
Inventor： Junghoon Kim , Hyunwoo Cho , Mihee Heo
IPC: H01L33/00 , H01L25/075 , H01L33/62
CPC classification number: H01L33/0095 , H01L25/0753 , H01L33/62 , H01L2933/0016 , H01L2933/0066
Abstract: A display device includes a plurality of semiconductor light emitting diodes, first and second electrodes respectively extending from the plurality of semiconductor light emitting diodes to supply an electrical signal to the plurality of semiconductor light emitting diodes, a plurality of pair electrodes disposed on a substrate and having a first electrode and a second electrode, a dielectric layer disposed on the plurality of pair electrodes, and a chemical bond layer disposed between the dielectric layer and the plurality of semiconductor light emitting diodes and forming a covalent bond with the dielectric layer and each of the plurality of semiconductor light emitting diodes. The chemical bond layer bonds the semiconductor light emitting diodes to the dielectric layer when a voltage applied to the plurality of pair electrodes is cut off after the plurality of semiconductor light emitting diodes are assembled on the dielectric layer.
-
公开(公告)号：US11408663B2
公开(公告)日：2022-08-09
申请号：US16086724
申请日：2017-03-02
Applicant: LG Electronics Inc.
Inventor： Hyunwoo Cho , Woocheol Kang , Geunhyung Lee , Gwinan Hwang
IPC: F25C1/10 , F25C5/04 , F25D21/08 , F25B39/02 , F25D21/06 , F25B47/00 , F25B47/02 , H05B3/56 , F25D23/00
Abstract: An evaporator includes: an evaporator case that defines a food storage space therein; a cooling tube located at the evaporator case and filled with refrigerant; a foil heater attached to at least one surface of the evaporator case and configured to contact the evaporator case and to generate heat such that heat for defrosting is transferred to the evaporator case. A defrosting time is reduced in comparison to that of conventional natural defrosting, such that the freshness of food can be maintained, and the cooling efficiency, having been reduced by frost, is increased such that power consumption can be reduced. The foil heater is attached to a conventional roll-bond type evaporator case, and the present invention has an advantageous effect of facilitating the maintenance of the foil heater because of a structure in which the foil heater is attached to the evaporator case.
-
公开(公告)号：US11073323B2
公开(公告)日：2021-07-27
申请号：US16321170
申请日：2017-07-27
Applicant: LG ELECTRONICS INC.
Inventor： Seungyoun Kim , Geunhyung Lee , Minjae Jeong , Hyunwoo Cho
Abstract: An evaporator comprises: an evaporator case having first and second case sheets coupled to each other and bent such that both sides of the evaporator case are open, thereby forming a box shape, a food storing space being formed inside the evaporator case; a cooling tube provided as an empty space between the first and second case sheets, thereby forming a cooling channel through which a refrigerant flows; and a heating tube formed as an empty space between the first and second case sheets so as not to overlap with the cooling tube, thereby forming a heating channel for defrosting, wherein the cooling tube and the heating tube are shaped to protrude to the outside of the evaporator case, and the evaporator case has an inner surface formed to be flat.
-
20.发明授权公开(公告)号：US10971654B2
公开(公告)日：2021-04-06
申请号：US16894262
申请日：2020-06-05
Applicant: LG ELECTRONICS INC.
Inventor： Junghoon Kim , Changseo Park , Bongchu Shim , Byoungkwon Cho , Hyunwoo Cho
Abstract: Discussed is a display device, including a semiconductor light emitting device and a substrate having a receiving groove in which the semiconductor light emitting device is accommodated, wherein the semiconductor light emitting device includes a first conductive semiconductor layer, a second conductive semiconductor layer disposed on an upper portion of the first conductive semiconductor layer, a first conductive electrode disposed on the first conductive semiconductor layer and a second conductive electrode disposed on the second conductive semiconductor layer, and spaced apart from the first conductive electrode along a horizontal direction of the semiconductor light emitting device, wherein the first conductive semiconductor layer has a symmetrical shape with respect to at least one direction of the semiconductor light emitting device so that the first conductive electrode and the second conductive electrode are arranged at preset positions when the semiconductor light emitting device is accommodated into the receiving groove.
-
-
-
-
-
-
-
-
-
Search Results
20
records
(took 0.02 seconds)
