Abstract:
A light emitting device package includes: a light emitting device disposed on a substrate; a diffusion plate disposed on the substrate to surround the light emitting device; and a molding portion that is disposed on the substrate and has a shape of an aspheric lens whose center is recessed, The center of the molding portion is located on the same axis as the center of the light emitting device, and the diffusion plate may be interposed between the light emitting device and the molding portion. The molding portion having the shape of the aspheric lens whose center is recessed and the diffusion plate are employed to widely diffuse the light emitted from the light emitting device. Thereby, the efficiency of light can be increased, and manufacturing time and cost can be reduced. Simultaneously, a yellow ring phenomenon can be avoided.